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  • Liquid Cooling at the Rack and Server Level

    Liquid cooling in data centers and other room-scale electronic systems is gaining widespread attention because it can enable thermal management at much higher rack power...
    details>>
  • What Are the Latest Technologies in Lithiuim Ion Battery Thermal Management for EV and HEV? Learn it Live at CZ14 Summit!

    How did GM use the latest technologies in lithium ion battery thermal management for the Chevy Volt? What simulation tools can be deployed for development of a battery...
    details>>
  • Heat Pipes: From Basics to Advanced Materials; Learn it Live at CZ14 Summit!

    In this two hour track, Advanced Cooling Technologies will cover a full range of topics in heat pipes. Topics include: Heat Pipe Fundamentals, Heat Pipe Design and Modeling,...
    details>>
  • Why Using Advanced Materials for Your Next Electronics Enclosure Will Give You a Better Product. Learn it Live at CZ14 Summit!

    Are you still using conventional materials such as steel, aluminum and polymers? Learn how metal matrix, carbon matrix and polymer matrix materials could give you a better...
    details>>
  • What Are The Emerging Trends in Data Center Thermal Management? Learn it Live at CZ14 Summit!

    The U.S. Data center power usage was 11.55GW in 2013 and Outsourced Data Center utilization is at 90%. Data Centers powering cloud computing are going to grow, but with all...
    details>>
  • Telecomm Industry Trends in Cooling: Where The Technology Is and Where It Is Going; Learn it Live at CZ14 Summit

    What are Telecom trends relative to the effect that will have on infrastructure and equipment and their thermal management. New trends will be presented on the importance of...
    details>>
  • Are Quick Disconnect Fittings for Liquid Cooilng of Electronics Safe? Learn it Live at CZ14 Summit!

    Liquid cooling is seeing wider use in handheld and desktop systems, servers, racks and full data centers. But are they safe and if they are, how are they safe? How do they...
    details>>

Heat Pipes, Technology and Applications

Dr. William Anderson, Ph.D., Panel Chair Advanced Cooling Technology is presenting a comprehensive track on heat pipes for thermal management. Their track includes, an introduction to the topic, designing and modeling with heat pipes, heat pipe applications for blade and embedded computing (VME, VPX and other architectures), in military, HVAC, LED, Satellite and finally Advanced Heat Pipe considerations, including gas charged heat... details>>

Heat Pipes, Technology and Applications

Pete Ritt, Panel Speaker Advanced Cooling Technology is presenting a comprehensive track on heat pipes for thermal management. Their track includes, an introduction to the topic, designing and modeling with heat pipes, heat pipe applications for blade and embedded computing (VME, VPX and other architectures), in military, HVAC, LED, Satellite and finally Advanced Heat Pipe considerations, including gas charged heat... details>>

Heat Pipes, Technology and Applications

Bryan Muzyka, Panel Speaker Advanced Cooling Technology is presenting a comprehensive track on heat pipes for thermal management. Their track includes, an introduction to the topic, designing and modeling with heat pipes, heat pipe applications for blade and embedded computing (VME, VPX and other architectures), in military, HVAC, LED, Satellite and finally Advanced Heat Pipe considerations, including gas charged heat... details>>

Heat Pipes, Technology and Applications

Taylor Lott, Panel Speaker Advanced Cooling Technology is presenting a comprehensive track on heat pipes for thermal management. Their track includes, an introduction to the topic, designing and modeling with heat pipes, heat pipe applications for blade and embedded computing (VME, VPX and other architectures), in military, HVAC, LED, Satellite and finally Advanced Heat Pipe considerations, including gas charged heat... details>>

Liquid Cooling at the Rack and Server Level

Dr. Alfonso Ortega, Ph.D., Liquid cooling in data centers and other room-scale electronic systems is gaining widespread attention because it can enable thermal management at much higher rack power density compared to air-cooled systems. Dr. Ortega and Dr. Agonafer will present on their team's research in liquid cooling at the server/rack level for data center cooling. Topics will include introductions to (i.) single phase... details>>

High Performance Materials for Electronic Enclosures

Dr. Carl Zweben, Ph.D., The conventional materials used for electronic enclosures - steel, aluminum and polymers - date from earlier centuries. Many applications require enclosures that are lighter and/or more thermally conductive than can be obtained with these materials. This applies to commercial, as well as aerospace, applications. A tower-mounted remote radio unit (RRU) is one example. We now have advanced... details>>

Thermal Management of Batteries in Automobiles Panel

Dr. . Ahmad Pesaran, Ph.D., Panel Chair Batteries play a key role in the electrification of transportation. As electrochemical devices, battery performance, safety, and life depend on temperature. At high temperatures, although performance improves, batteries degrade faster and safety becomes a concern. At low temperatures, the battery capacity and resistance increases leading to lower energy and power capabilitiesTherefore, thermal... details>>

EV Batteries & Impact of Temperature [Thermal Management of Batteries in Automobiles Panel]

Dr. Kandler Smith, Ph.D., Panel Speaker Dr. Smith's will speak to EV Batteries & Impact of Temperature on the panel. Batteries play a key role in the electrification of transportation. As electrochemical devices, battery performance, safety, and life depend on temperature. At high temperatures, although performance improves, batteries degrade faster and safety becomes a concern. At low temperatures, the battery capacity and... details>>

Experimental Tools for Battery Thermal Management [Thermal Management of Batteries in Automobiles Panel]

Peter Ralbovsky, Panel Speaker Mr. Ralbovsky will speak to Experimental Tools for Battery Thermal Management. Batteries play a key role in the electrification of transportation. As electrochemical devices, battery performance, safety, and life depend on temperature. At high temperatures, although performance improves, batteries degrade faster and safety becomes a concern. At low temperatures, the battery capacity and... details>>

Simulation Tools for Battery Thermal Management [Thermal Management of Batteries in Automobiles Panel]

Dr. Xiao Hu,Ph.D., Panel Speaker Dr. Xiao will be speaking on Simulation Tools for Battery Thermal Management on the panel. Batteries play a key role in the electrification of transportation. As electrochemical devices, battery performance, safety, and life depend on temperature. At high temperatures, although performance improves, batteries degrade faster and safety becomes a concern. At low temperatures, the battery capacity... details>>

Modeling Tools for Design of Battery Thermal Management Systems [Thermal Management of Batteries in Automobiles Panel]

Dr. Zhongying(John) Shi, Ph.D., Panel Speaker Dr. Shi will speak on Using Modeling Tools for Design of Battery Thermal Management Systems on the panel. Batteries play a key role in the electrification of transportation. As electrochemical devices, battery performance, safety, and life depend on temperature. At high temperatures, although performance improves, batteries degrade faster and safety becomes a concern. At low temperatures, the... details>>

Emerging Trends in Data Center Thermal Management [Panel]

Dr. Al Ortega, Ph.D., Panel Chair The U.S. Data center power usage was 11.55GW in 2013 and Outsourced Data Center utilization is at 90%. Data Centers powering cloud computing are going to grow, but with all that equipment how are we going to cool it efficiently and cost effectively? This track features a panel from the NSF Center for Energy Smart Electronic Systems. Panelists include Professor Al Ortega, Professor Yogi Joshi... details>>

Emerging Trends in Data Center Thermal Management [Panel]

Dr. Yogi Joshi, Ph.D., Panel Speaker The U.S. Data center power usage was 11.55GW in 2013 and Outsourced Data Center utilization is at 90%. Data Centers powering cloud computing are going to grow, but with all that equipment how are we going to cool it efficiently and cost effectively? This track features a panel from the NSF Center for Energy Smart Electronic Systems. Panelists include Professor Al Ortega, Professor Yogi Joshi... details>>

Emerging Trends in Data Center Thermal Management [Panel]

Dr. Dereje Agonafer, Ph.D., Panel Speaker The U.S. Data center power usage was 11.55GW in 2013 and Outsourced Data Center utilization is at 90%. Data Centers powering cloud computing are going to grow, but with all that equipment how are we going to cool it efficiently and cost effectively? This track features a panel from the NSF Center for Energy Smart Electronic Systems. Panelists include Professor Al Ortega, Professor Yogi Joshi... details>>

Emerging Trends in Data Center Thermal Management [Panel] .

Dr. Minami Yoda, Ph.D., The U.S. Data center power usage was 11.55GW in 2013 and Outsourced Data Center utilization is at 90%. Data Centers powering cloud computing are going to grow, but with all that equipment how are we going to cool it efficiently and cost effectively? This track features a panel from the NSF Center for Energy Smart Electronic Systems. Panelists include Professor Al Ortega, Professor Yogi Joshi... details>>

The Role of Quick Disconnect Couplings in Liquid Cooling: Five Attributes that Contribute to Connector Reliability

David Vranish, Panel Speaker The use of liquid cooling to mitigate heat generated by electronics can be found in a wide variety of applications, including gaming computers, medical equipment, supercomputers and today's data center industry, where server manufacturers are turning to liquid cooling for cost-efficient and effective thermal management. This presentation will cover the integral role that quick disconnect... details>>

The Role of Quick Disconnect Couplings in Liquid Cooling: Five Attributes that Contribute to Connector Reliability

Dennis Downs, Panel Speaker The use of liquid cooling to mitigate heat generated by electronics can be found in a wide variety of applications, including gaming computers, medical equipment, supercomputers and today's data center industry, where server manufacturers are turning to liquid cooling for cost-efficient and effective thermal management. This presentation will cover the integral role that quick disconnect... details>>

Telecomm Shelter, Cabinet and Enclosure Cooling

Matthew Simpson, Panel Speaker Dantherm will be presenting on where they see Telecom trends realtive to the effect that will have on infrastructure and equipment and their thermal management. New trends will be presented on the importance of the proper sizing of a cooling solution. Cooling strategies will be discusssed including passive cooling, heat exchangers, active cooling, combination cooling and dual zone cooling. details>>

Telecomm Shelter, Cabinet and Enclosure Cooling

Rick Schmidt, Panel Speaker Dantherm will be presenting on where they see Telecom trends realtive to the effect that will have on infrastructure and equipment and their thermal management. New trends will be presented on the importance of the proper sizing of a cooling solution. Cooling strategies will be discusssed including passive cooling, heat exchangers, active cooling, combination cooling and dual zone cooling. details>>

Adcol Announces New Mini Dehumidifier for Power Cabinets

Adcol, a leading provider of Thermoelectric Cooling Systems, today introduced a new TE device - mini dehumidifier for the power cabinet market. The miniature unit has an outside dimension of 135mm x 120mm x 115mm, power consumption of 40W and is designed specifically for power cabinets to improve power supply reliability. details>>

CPC Expands Offering of Non - Spill Couplings

CPC (Colder Products Company), the leading provider of quick disconnect couplings and fittings for plastic tubing, announces the expansion of its NS4 Series quick disconnect couplings to now include elbow insert configurations. The lightweight, innovative couplings provide secure and reliable drip-free performance. Easy-to-use NS4 Series couplings include shutoff valves that ensure drip-free... details>>

Techsil Announces TIM11021 and TIM11123 Thermal Interface Materials

Techsil introduces 2 new one-component thermal interface materials to the market, the TIM11021 and the TIM11123. Techsil TIM11021 is a 1-part grey paste silicone non-curing compound that provides high thermal conductivity with low bleed and minimal weight loss at elevated temperatures; successfully operating at a wide temperature range of -40 degree C to 150 degree C with a thermal conductivity... details>>

GlacialTech Launches Two Cold Forging Thermal Module Solutions: Igloo FR210 and Igloo FR210HP

GlacialTech Inc., an experienced technology manufacturer, launched two new cold forging thermal modules: Igloo FR210 and Igloo FR210HP. Igloo FR210 / Igloo FR210HP. Both the Igloo FR210 and Igloo FR210HP are suitable for 80W applications. The Igloo FR210HP differs from the Igloo FR210 in that it optimized for CoB and spotlight applications. These modules' heatsinks are available in two color... details>>

Carbodeon Develops Nanodiamond Composite Thermally Conductive Thermoplastics With 20%-100% Improvement In Thermal Conductivity.

Carbodeon's uDiamond nanodiamond materials can now achieve a 20 percent increase in polymer thermal performance by using as little as 0.03 wt.% nanodiamond material at 45 percent thermal filler loading, enabling the further performance at a lower cost than made with traditional fillers. Samples were manufactured at VTT Technical Research Centre of Finland and their thermal performance was... details>>

FLIR Systems Announces AX8 Thermal Imager for Industrial Automation

The new FLIR Systems AX8 thermal imager has 4,800 active temperature points per image, provides streaming temperature data over industry-standard interfaces (Ethernet/IP and Modbus TCP) for easy analysis, has a built-in web interface, and includes a full suite of Analysis and Alarm functions that automatically send alerts when the AX8 detects elevated temperatures. details>>

Henkel to acquire The Bergquist Company

Henkel signed an agreement to acquire The Bergquist Company, a privately-held leading supplier of thermal-management solutions for the electronics industry worldwide. details>>

Thermal Imaging And Analysis For High Speed Semiconductor Devices

Microsanj announces the availability of a new high performance thermal analyzer in the Thermoreflectance Nanotherm Series. The NT410A has a time resolution of 800 picoseconds, sub-micron spatial, 1 degree C temperature resolution, and mega pixel full field thermal images. Tthe NT410A can provide device designers with important time-dependent thermal performance data that was, up to now, not... details>>

NEW Sarcon SPG-20B Delivers Lower Thermal Resistance and Higher Thermal Conductivity

Fujipoly introduces a new version of its popular SARCON SPG-15A, form-in-place thermal interface compound. The new SARCON® SPG-20B formulation is an easy to dispense, low-viscosity thermally conductive silicone that delivers a thermal conductivity of 2.1 W/m degree K and a thermal resistance of only 1.8 degree C cm2/W. This is roughly a 51% improvement in thermal resistance and a 40% improvement... details>>

Ellsworth Adhesives Exhibiting at Design2Part in Portland

Ellsworth Adhesives, a global distributor of adhesives, specialty chemicals and dispensing equipment, is pleased to announce that they will be exhibiting at this year's Design2Part Exposition October 29 and 30 at the Portland Expo Center in Portland, Oregon. Ellsworth Adhesives is displaying the latest technology of adhesives and dispensing equipment for manufacturing in Booth 327. Through... details>>

ACT Expanding High Temperature Heat Pipe Offerings [Video]

Advanced Cooling Technologies, Inc (ACT) announced they are expanding their high temperature heat pipe products and service offerings. The new offiering features ACT's Isothermal Furnace Liners (IFLs) and are capable of handling temperature ranges of 400⁰C to 1,100⁰C. Heat transfer rates of up to hundreds of kilowatts are typical of these heat pipes. Options include various... details>>

ATS Launches Round and Flat Profile Heat Pipes To Cool Hot Components

Advanced Thermal Solutions, Inc., ATS, has introduced a series of copper heat pipes for transporting power dissipation away from hot electronic components. Thirty-three round and flat profile heat pipes are available to meet application needs. Round profile heat pipes come in lengths from 200-300 mm and diameters from 4mm to 8mm. Flat profile heat pipes range in length from 100mm to 250mm,... details>>

Online Calculator Enables the Rapid Design and Analysis of Heat Sinks

Heat Sink Calculator's new online tool allows for thermal analysis of forced convection, natural convection, radiation, material properies and more. The tool is designed to make heat sink design take hours vs. minutes, thus reducing time to prototypes and production. No special training is needed to use the tool by engineers and other technical professionals. details>>

Thermal Bridging Guide Released to Help Building Thermal Management [Video]

Morrison Hershfield, an engineering and technical advisory firm, announced the release of the Building Envelope Thermal Bridging Guide - Analysis, Applications, and Insights. The new guide aims to assist companies and builders in mitigating thermal bridging to reduce energy consumption in buildings. details>>

Thermoelectric Devices Turn Waste Heat Into Electricity [Video]

Thermoelectric Generator created that fits into one-square inch, quarter-inch thick module. The device turns waste heat emitted by vehicles into electricity to lend those vehicles added power. The company's TEG can withstand temperatures of roughly 600 degrees Celsius on its hot side (top surface), while maintaining a temperature of 100 C on its cold side (bottom surface). With this gradient of... details>>

Degree C Introduces Next-Generation Multi-point Airflow Measurement Instrument, With Enhanced Accuracy and Mobile Access [Video]

The Degree C Port3600 aggregates up to 36 sensors designed for minimal airflow disruption and can simultaneously measure air velocity, air and surface temperatures, and humidity at multiple locations. With built-in atmospheric pressure and humidity compensation, experiments are easily repeatable and yield reliable, accurate results under variable environmental conditions. The latest web-enabled... details>>

Greenshine New Energy Solar Street Lights See Deployment in Saudia Arabia

Greenshine New Energy LLC (Greenshine) is delighted to announce its most customized solar street lights yet. Fifty-six custom-made solar street lights have now been manufactured and will be installed on Prince Abdullah Al Faisal - North Obhur- Jeddah, Saudi Arabia in the coming months, as part of the city's plan to go green. details>>

Cooler Master Product Spotlight: Heat Pipe Family: Ultra-slim, Dual-diameter and Loop for OEM's [Video]

Cooler Master's heat pipe family includes 1mm thick "Ultra-slim", dual diameter heat pipes and loop heat pipes. The Ultra-slim products are focused on mobile applications where both size and performance are crucial. The dual diameter heat pipes are engineered for applications that require high performance but at a reduced weight. Applications requiring multiple traditional heat pipes... details>>

TE Connectivity to Acquire Measurement Specialties, Inc.

TE Connectivity Ltd, a world leader in connectivity, announced today that it has entered into a definitive agreement to acquire Measurement Specialties, Inc. for $86 cash per share or a total transaction value of approximately $1.7 billion (including assumption of net debt). Measurement Specialties, a leading global designer and manufacturer of sensors and sensor-based systems with expected... details>>

Si2 Announces New Thermal Interface Protocol Standard for 3D Integrated Circuits

The Silicon Integration Initiative (Si2) announced the release of a Chip Thermal Interface Protocol (CTIP) Standard for 3D Integrated Circuits (3D-IC) under the auspices of the Open3D Technical Advisory Board (TAB). The Open3D TAB is chartered to define open standards for design data formats and interfaces to enable interoperable 2.5D and 3D design flows. details>>

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