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  • Effective Thermal Management with Different Thermal Interface Materials for Different Applications

    Proper and effective thermal management and heat dissipation for electronic devices from computers to LED lighting to solar panels are critical for its performance and...
    details>>
  • Heat Pipes: Review, Opportunities And Challenges

    A detailed overview of heat pipes is presented in this paper, including a historical perspective, principles of operations, types of heat pipes, heat pipe performance...
    details>>
  • Microstructure Dependence Of Heat Sink Constructed By Carbon Nanotubes For Chip Cooling

    Heat sinks based on carbon nanotube (CNT) arrays or sponge CNT were found to have a strong impact on the heat sinks thermal performance by changing their coefficient of air...
    details>>

Lessons and Applications from the DARPA ICEcool Project at Stanford

Dr. Mehdi Asheghi, Ph.D., Short Course Presenter Standford is involved with 4 different projects all relating to the DARPA ICECool program (Intrachip/Interchip Enhanced Cooling). In this technical presentation, Dr. Asheghi will talk about the lessons and applications so far from these projects. details>>

Predictive Analytics for Data Center Thermal Risk and Reliability Management

Dr. Cliff Federspiel, Ph.D., Speaker This presentation will describe a means of precisely determining the functional cooling redundancy of a facility, show statistical analysis that correlates poor redundancy with high temperature events, and share tools that identify and suggest remediation for rooms and facilities at risk. Use of cooling analytics is an important aspect of operational excellence, and is a competitive... details>>

Recent Developments in Passive 2-Phase Immersion Cooling of Computer

Phil Tuma, Speaker Passive 2-phase immersion cooling (P2PIC) is being explored by 3M and partners as a means of meeting the energy efficiency and power density needs of the computing industry. This presentation will review the comparative merits and operating principles of 2PI. Its application for Bitcoin mining gives a glimpse of what may be possible when x86 hardware evolves to take advantage of the technology's... details>>

Heat Pipe Selection, Bending and Application Strategies

Dr. Rahul Mulinti, Ph.D., Speaker Heat pipes are heat transferring devices that rely on phase change phenomenon to efficiently manage heat transfer between a heat source and a heat sink. Their high effective thermal conductivity makes them ideal for applications where heat needs to be moved across a certain distance with least thermal resistance. Heat pipes offer flexibility in terms of functionality across a wide range of heat... details>>

Flexible Thermal Ground Planes for Smartphones and Wearable Electronics

Dr. Y.C. Lee, Ph.D., Speaker A well-known challenge for mobile systems, e.g. smartphones, tablets and wearable electronics, is the control of their skin temperatures, i.e. the temperatures of the case exterior surface touched by fingers, ears or other part of a human body. It is essential to keep the skin temperatures lower than 45-50oC for smartphones and 38oC for wearable electronics. Vapor chamber, copper and graphite are... details>>

Thermosyphons: How to Properly Size, Choose and Deploy in Electronics Cooling

Vineet Barot, Short Course Presenter Thermosyphons and heat pipes are used to transport large amounts of heat over a particular distance by using a two-phase fluid inside a hollow pipe. The more widely used heat pipe uses a wicking structure to transport the liquid back to the hot end whereas a thermosyphon is a simple hollow tube that uses gravity. The lack of a wicking structgure make the thermosyphon much less expensive than... details>>

Liquid Cooling Types for Data Center Computing: Choosing and Deploying

Phil Hughes, Speaker Abstract in process details>>

Analytical Modeling in Thermal Management Design

Dr. Kaveh Azar, Ph.D., Short Course Presenter Modeling and simulations are the cornerstone of any successful product launch of electronics products. Engineers are faced with three modeling options, Analytical, Computational and Experimental. In this short course, these modeling options are reviewed and their application to a problem domain is discussed. Emphasis is on the use of analytical modeling and how it can help with faster decisions... details>>

Cooling 10Kw in a Rack With Water and Other Fluids

Henry Coles, Speaker Abstract being written details>>

How to Perform and Understand Temperature Measurement Within Electronic Systems

Dr. Kaveh Azar, Ph.D., Speaker Attendees will become familiar with the importance of temperature measurement in electronic systems, the instruments that are necessary and the location within a systems where testing should be conducted. Further, salient features of each measurement system and technique will be highlighted, and the most ideal sensors and their placement for accurate temperature measurement will be presented. details>>

coolingZONE-15 Speaker, Dr. Clifford Federspiel, Ph.D. -- Predictive Analytics for Data Center Thermal Risk and Reliability Management

coolingZONE 2015 Thermal Management Summit, A Live Webcast! Is delighted to announce that Dr. Cliff Federspiel, Ph.D., will be speaking on "Predictive Analytics for Data Center Thermal Risk and Reliability Management". This presentation will describe a means of precisely determining the functional cooling redundancy of a facility, show statistical analysis that correlates poor... details>>

coolingZONE-15 Speaker, Phillip Tuma, MSME -- Recent Developments in Passive 2-Phase Immersion Cooling of Computers

coolingZONE 2015 Thermal Management Summit, A Live Webcast! Is proud to announce that Phil Tuma, of 3M's Advanced Materials Solutions Division will be speaking on Recent Developments in Passive 2-phase Immersion Cooling of Computers. This presentation will review the comparative merits and operating principles of 2PI. Its application for Bitcoin mining gives a glimpse of what may be possible... details>>

coolingZONE-15 Speaker, Dr. Rahul Mulinti, Ph.D. -- Heat Pipe Selection, Bending and Application Strategies

coolingZONE 2015 Thermal Management Summit, A Live Webcast! is happy to announce that Dr. Rahul Mulinti, Ph.D. will be speaking on Heat Pipe Selection, Bending and Application Strategies. Designing an optimum heat pipe will depend on several parameters that include but not limited to the heat load, operating temperature, orientation and geometry. This paper will outline some of the strategies... details>>

coolingZONE-15 Speaker, Dr. Y.C. Lee, Ph.D. -- Flexible Thermal Ground Planes for Smartphones and Wearable Electronics

coolingZONE 2015 Thermal Management Summit, A Live Webcast! Is delighted to announce that Dr. Y.C. Lee, Ph.D., will be speaking on "Flexible Thermal Ground Planes for Smartphones and Wearable Electronics". This presentation will discuss the development of a new flexible thermal ground plane (TGP) that eliminates issues such as thickness and cost barriers for cooling wearables,... details>>

coolingZONE-15 Speaker, Henry Coles MSME -- Cooling 10Kw in a Rack With Water and Other Fluids

coolingZONE 2015 Thermal Management Summit, A Live Webcast! Is proud to announce that Henry Coles MSME will be speaking on "Energy Efficiency of Rack Level Liquid Cooling in Data Centers". details>>

coolingZONE-15 Speaker Vineet Barot, MSc -- Thermosyphons: How to Properly Size, Choose and Deploy in Electronics Cooling

coolingZONE 2015 Thermal Management Summit, A Live Webcast! Is happy to announce that Vineet Barot, MSc of Advanced Thermal Solutions will be speaking on "Thermosyphons: How to Properly Size, Choose and Deploy in Electronics Cooling" details>>

coolingZONE-15 Speaker, Dr. Kaveh Azar, Ph.D., CEO Advanced Thermal Solutions -- Analytical Modeling in Thermal Management Design

coolingZONE 2015 Thermal Management Summit, A Live Webcast! Is happy to announce that Dr. Kaveh Azar, Ph.D., of Advanced Thermal Solutions will be speaking on "Analytical Modeling in Thermal Management Design". This short course will review the 3 modeling options Engineers are faced with Analytical, Computational, and Experimental. details>>

coolingZONE-15 Speaker, Dr. Mehdi Ashegi ,P.h.D -- Lessons and Applications from the DARPA ICEcool Project at Stanford

coolingZONE 2015 Thermal Management Summit, A Live Webcast! Is excited to announce that, Dr. Mehdi Ashegi, Ph.D. will be speaking on "Lessons and Applications from the DARPA ICEcool Project at Stanford". In this technical presentation, Dr. Asheghi will talk about the lessons and applications (Intrachip/ Interchip and Enhanced Cooling. details>>

Dow Corning Introduces Next-generation Thermal Interface Material

Dow Corning, a developer of silicones, silicon-based technology and innovation, today unveiled new Dow Corning TC-3040 Thermally Conductive Gel, a next-generation thermal interface material (TIM 1). Developed through the help of IBM, this cutting-edge new material offers more effective and reliable thermal management, reduced stress and excellent under-die coverage for demanding flip chip... details>>

MechaTronix Launches Advanced LED Pin Fin Coolers for Tilted Spot Lights

With the advantage of pin fin LED coolers under tilted position, MechaTronix announces 2 more diameters as standard available.This second generation pin fin coolers is developed for an optimized free air convection under tilted positions of spot and track lights over 45 degrees details>>

FLIR Releases Innovative Thermal Imaging Moisture Meter

The MR160 is the first moisture meter to be equipped with a built-in thermal camera and features Infrared Guided Measurement (IGM) technology driven by a FLIR Lepton thermal camera core. details>>

Supercritical Fluid Technologies Introduces New Self-contained Pump

Supercritical Fluid Technologies, Inc. introduces the completely self-contained SFT-10 Liquid Carbon Dioxide Pump. Advanced Peltier (thermoelectric) technology makes it possible to achieve high pressure without the need for an external cooling bath. details>>

Mentor Graphics Announces FloTHERM XT with EDA Connectivity for Advanced Thermal Management

FloTHERM XT is a unique, award-winning thermal simulation solution that can be used during all stages of the electronics design process - from conceptual design to manufacturing - improving product quality, reliability and time-to-market. details>>

Tempo Semi Introduces An Ultra-Low Power Audio CODEC For PC and Industrial Markets

Tempo Semiconductor Inc., (TSI), which delivers essential ultra-low power, high fidelity audio mixed-signal semiconductor solutions to the consumer, PC and industrial market, today announced a new low power audio subsystem for portable applications. This new device - the TSCS422XX - minimizes board space and reduces system cost through integration. details>>

Artila Releases RIO-2018 Web Enabled Thermocouple Input Module

Artila Electronics, the leading designer and manufacturer of embedded device networking and computing, is proud to release RIO-2018, the new generation of web enabled thermocouple input module. RIO-2018 is powered by ARM Cortex M3 and FreeRTOS operating system and features three thermocouple input channels, one 10/100Mbps Ethernet port, two isolated digital input channels and one relay output. details>>

Dyson's LED Bulb Has 37-Year Lifespan

Dyson has arrived and is promising a superior solution. Inventor Jake Dyson, son of Dyson founder James, says the company has built the first light that cools LEDs properly, enabling them to last 37 years. details>>

SANYO DENKI Releases O221 mm x 71 mm Centrifugal Fan

The San Ace C221 has the PWM control function, designed for controlling the rotational speed of the fan from the device side. details>>

Aavid Acquires Qfinsoft Technology For Software For The Simulation Of Fluid Flow, Thermodynamics, And Combustion Processes

Aavid Corporation ("Aavid") announced it has acquired Qfinsoft Technology Inc. ("Qfinsoft"). Based in Rossland, BC, Canada, Qfinsoft specializes in developing software for the simulation of fluid flow, thermodynamics, and combustion processes. Its Qfin software is widely used in fluid flow and thermal management applications and its Qled software is the only product of its... details>>

Dialog Semiconductor Achieves Highest Power Density and Efficiency in Powering Future Computing Platforms

Dialog Semiconductor announces the DA9312, a power management IC that enables the design of smaller, thinner notebook computers and tablets powered by dual cell stacked (2S) Li-ion or Li-Polymer batteries. The notebook industry is moving towards designs powered by 2-cell, rather than 3-cell batteries and tablets are moving from single cell to 2-cell batteries. Dialog is supporting these trends... details>>

New SL Power LB240 AC DC Power Supply Solves Challenging Cooling Issues for LED Lighting and Audio Video Equipment

SL Power Electronics, announces its LB240, the newest family of AC/DC power supplies for LED lighting and audio/video applications. The LB240 is a highly efficient single output power supply that is ideal for high intensity entertainment applications, such as stage lighting and audio/video control systems, due to its ability to operate efficiently in any cooling condition and/or tight space. details>>

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