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  • Researchers show bubble-recoil could cool microchips in space

    Scientists at the University of Illinois at Chicago, funded by NASA, have demonstrated how to utilize the minuscule force that is created by forming bubbles on a heated...
    details>>
  • MIT studies interactions that affect way heat moves through microchips

    Researchers at MIT have provided useful insights into how crystal dislocations, disruptions in the three-dimensional structure of a crystal lattice, affect electrical and...
    details>>
  • International team of physicists study thermal conductivity of nanoislands

    An team of physicists have detailed how the vibrations of the atoms in the crystal lattice (phonons) of europium silicide (EuSi2) change depending on the nanostructure...
    details>>
  • UMass researchers develop surface treatment for conducting thin films

    Engineers from the University of Massachusetts Amherst have reported modeling results for electrical surface treatment of conducting thin films.
    details>>
  • Stanford researchers present prototype energy converter that uses graphene

    Researchers used previously abandoned satellite-powering technology and graphene instead of metal to develop a prototype energy converter that is almost seven times more...
    details>>
  • Princeton engineers detail innovations to build intelligent cities

    As urban areas continue to expand to meet population and infrastructural needs, the future of cities is under intense scrutiny with engineers looking for new and sustainable...
    details>>
  • Scientists publish research on creation of the first time crystal

    A team of researchers led by the University of Maryland reported the creation of an entirely new phase of matter, which they are calling a time crystal.
    details>>
  • PCS researchers explain electronics structure of graphene

    Physicists at the Center for Theoretical Physics of Complex Systems (PCS) and the Research Institute for Standards and Science (KRISS) created a model to explain the...
    details>>
  • UChicago students use heat to levitate objects in vacuum chamber

    A pair of undergraduate physics students at the University of Chicago (UChicago) demonstrated how to levitate a variety of objects, including glass bubbles, polyethylene...
    details>>

PSMA Announces APEC 2017 Industry Session on 3D Power Packaging

The Power Sources Manufacturers Association (PSMA) Packaging Committee is sponsoring an Industry Session at APEC 2017 titled, "Component, Reliability and Manufacturing Innovations for 3D Power Packaging." details>>

Cool Technologies Granted New Patent for Radial Vent Cooling

On February 24, 2017, Cool Technologies, Inc., an innovator in mobile power generation, energy efficiency, and heat removal technologies received the US patent (9,543,809) for its radial vent heat pipe system. details>>

CeramTec acquires UK electro-ceramics business from Morgan Advanced Materials

CeramTec announced that it has agreed the acquisition of the U.K. electro-ceramics business, comprising two manufacturing sites at Ruabon and Southampton, from Morgan Advanced Materials. details>>

Global Electric Vehicle Battery Thermal Management System Market 2017-2021

The consumption of rechargeable batteries is growing globally, covering all major sectors, including consumer electronics, energy, automotive, and telecom. details>>

Delta Unveils Pioneering Agema Data Center and Carrier-Grade Deep Buffer White Box Switches

Delta announced the launch of two switches from its Agema product line for Open Networking Solutions at the OCP US Summit 2017. details>>

Corvus Energy announces availability of liquid-cooling for Orca ESS

Corvus Energy, the world-s leading manufacturer of lithium-ion based energy storage systems (ESS) for maritime industries, is pleased to announce the availability of Orca LQ. details>>

Egide completes the acquisition of Santier in the USA

Following its strategy to concentrate on high-potential markets, Egide, announces that is has acquired, as planned, the assets of TMS LLC (or Thermal Management Solutions, dba Santier), with the conditions laid down previously with them. details>>

MediaTek Announces CorePilot 4.0 Technology for Power Efficiency in Smartphones

MediaTek announced CorePilot 4.0, an advanced technology that intelligently manages smartphone tasks to deliver the perfect balance of processing power and battery life. details>>

Amerlux introduces DOSM LED downlight optically sealed module for exterior fixtures

Amerlux introduces the DOSM LED optically sealed module for exterior lighting fixtures that include a downlight component. details>>

Fujipoly offers reliable connection between PCB and LCD displays

The Zebra 1002 Carbon Connector from Fujipoly offers electronic device manufacturers an extremely affordable and reliable option for connecting printed circuit boards to a variety of LCD displays. details>>

Alphacool Presents the Eiswand Water Cooling Set for CPUs

Alphacool presents the Eiswand, "Ice Wall," a water cooling set for your CPU that can also be expanded on through its two quick-release connectors. details>>

EK announces G-Frost Hybrid Water Block for Gigabyte Aorus Z270X Gaming 9

EK Water Blocks is proud to announce the all new Aorus GA-Z270X-Gaming 9 motherboard, that is equipped with an EKWB G-Frost Hybrid Water Block. details>>

Thermalright announces new Silver Arrow ITX-R processor cooler

In the revised version of the Silver Arrow, the ITX-R is also compatible with the latest models of the ASUS M8I Mainboard series. details>>

Phanteks launches Glacier G1080 Water Block for NVIDIA GTX 1080 Founder Edition

Phanteks, a leader in thermal cooling, is excited to launch its very first water block designed for the new Nvidia GTX 1080 Founders Edition. details>>

Microsemi Unveils Industry-Lowest Power, Cost-Optimized FPGA Product Family

Microsemi Corporation, a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, announced the availability of its new cost-optimized PolarFire field programmable gate array (FPGA) product family. details>>

Palit releases the Silent 0dB GeForce GTX1050 Ti KalmX

Palit Microsystems Ltd., the leading graphics card manufacturer, releases a new line called KalmX and is consist of GeForce GTX 1050Ti series. details>>

Hanon Systems Wins IR52 Jang Young-Shil Award for Automotive Water-Air Cooled Condenser

Hanon Systems has been named co-winner of the IR52 Jang Young-Shil Award with Hyundai Motor Company for its water-air cooled condenser for passenger vehicles. details>>

Eaton Delivers Enhanced Flexibility and Efficiency with 5P Rackmount Compact UPS

Eaton announced the launch of its new 5P rackmount compact uninterruptible power supply (UPS), delivering enterprise class battery backup power for edge computing environments, network closets and computer rooms. details>>

Danfoss Introduces New Optyma Slim Condensing Units

Danfoss has extended its line of fully-equipped condensing units designed for low-temperature and medium-temperature outdoor applications. details>>

Aligned Data Centers Receives Both Uptime Tier III Certifications

Aligned Data Centers, a division of Aligned Energy, announced that it has been awarded design and construction Tier III Certifications from Uptime Institute for its next-generation, ultra-efficient data center in Plano, Texas. details>>

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