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  • Effective Thermal Management with Different Thermal Interface Materials for Different Applications

    Proper and effective thermal management and heat dissipation for electronic devices from computers to LED lighting to solar panels are critical for its performance and...
  • Heat Pipes: Review, Opportunities And Challenges

    A detailed overview of heat pipes is presented in this paper, including a historical perspective, principles of operations, types of heat pipes, heat pipe performance...
  • Microstructure Dependence Of Heat Sink Constructed By Carbon Nanotubes For Chip Cooling

    Heat sinks based on carbon nanotube (CNT) arrays or sponge CNT were found to have a strong impact on the heat sinks thermal performance by changing their coefficient of air...

coolingZONE-15 Speaker, Dr. Clifford Federspiel, Ph.D. -- Predictive Analytics for Data Center Thermal Risk and Reliability Management

coolingZONE 2015 Thermal Management Summit, A Live Webcast! Is delighted to announce that Dr. Cliff Federspiel, Ph.D., will be speaking on "Predictive Analytics for Data Center Thermal Risk and Reliability Management". This presentation will describe a means of precisely determining the functional cooling redundancy of a facility, show statistical analysis that correlates poor... details>>

coolingZONE-15 Speaker, Phillip Tuma, MSME -- Recent Developments in Passive 2-Phase Immersion Cooling of Computers

coolingZONE 2015 Thermal Management Summit, A Live Webcast! Is proud to announce that Phil Tuma, of 3M's Advanced Materials Solutions Division will be speaking on Recent Developments in Passive 2-phase Immersion Cooling of Computers. This presentation will review the comparative merits and operating principles of 2PI. Its application for Bitcoin mining gives a glimpse of what may be possible... details>>

coolingZONE-15 Speaker, Dr. Rahul Mulinti, Ph.D. -- Heat Pipe Selection, Bending and Application Strategies

coolingZONE 2015 Thermal Management Summit, A Live Webcast! is happy to announce that Dr. Rahul Mulinti, Ph.D. will be speaking on Heat Pipe Selection, Bending and Application Strategies. Designing an optimum heat pipe will depend on several parameters that include but not limited to the heat load, operating temperature, orientation and geometry. This paper will outline some of the strategies... details>>

coolingZONE-15 Speaker, Dr. Y.C. Lee, Ph.D. -- Flexible Thermal Ground Planes for Smartphones and Wearable Electronics

coolingZONE 2015 Thermal Management Summit, A Live Webcast! Is delighted to announce that Dr. Y.C. Lee, Ph.D., will be speaking on "Flexible Thermal Ground Planes for Smartphones and Wearable Electronics". This presentation will discuss the development of a new flexible thermal ground plane (TGP) that eliminates issues such as thickness and cost barriers for cooling wearables,... details>>

coolingZONE-15 Speaker, Henry Coles MSME -- Cooling 10Kw in a Rack With Water and Other Fluids

coolingZONE 2015 Thermal Management Summit, A Live Webcast! Is proud to announce that Henry Coles MSME will be speaking on "Energy Efficiency of Rack Level Liquid Cooling in Data Centers". details>>

coolingZONE-15 Speaker Vineet Barot, MSc -- Thermosyphons: How to Properly Size, Choose and Deploy in Electronics Cooling

coolingZONE 2015 Thermal Management Summit, A Live Webcast! Is happy to announce that Vineet Barot, MSc of Advanced Thermal Solutions will be speaking on "Thermosyphons: How to Properly Size, Choose and Deploy in Electronics Cooling" details>>

coolingZONE-15 Speaker, Dr. Kaveh Azar, Ph.D., CEO Advanced Thermal Solutions -- Analytical Modeling in Thermal Management Design

coolingZONE 2015 Thermal Management Summit, A Live Webcast! Is happy to announce that Dr. Kaveh Azar, Ph.D., of Advanced Thermal Solutions will be speaking on "Analytical Modeling in Thermal Management Design". This short course will review the 3 modeling options Engineers are faced with Analytical, Computational, and Experimental. details>>

coolingZONE-15 Speaker, Dr. Mehdi Ashegi ,P.h.D -- Lessons and Applications from the DARPA ICEcool Project at Stanford

coolingZONE 2015 Thermal Management Summit, A Live Webcast! Is excited to announce that, Dr. Mehdi Ashegi, Ph.D. will be speaking on "Lessons and Applications from the DARPA ICEcool Project at Stanford". In this technical presentation, Dr. Asheghi will talk about the lessons and applications (Intrachip/ Interchip and Enhanced Cooling. details>>

Dow Corning Introduces Next-generation Thermal Interface Material

Dow Corning, a developer of silicones, silicon-based technology and innovation, today unveiled new Dow Corning TC-3040 Thermally Conductive Gel, a next-generation thermal interface material (TIM 1). Developed through the help of IBM, this cutting-edge new material offers more effective and reliable thermal management, reduced stress and excellent under-die coverage for demanding flip chip... details>>

MechaTronix Launches Advanced LED Pin Fin Coolers for Tilted Spot Lights

With the advantage of pin fin LED coolers under tilted position, MechaTronix announces 2 more diameters as standard available.This second generation pin fin coolers is developed for an optimized free air convection under tilted positions of spot and track lights over 45 degrees details>>

FLIR Releases Innovative Thermal Imaging Moisture Meter

The MR160 is the first moisture meter to be equipped with a built-in thermal camera and features Infrared Guided Measurement (IGM) technology driven by a FLIR Lepton thermal camera core. details>>

Supercritical Fluid Technologies Introduces New Self-contained Pump

Supercritical Fluid Technologies, Inc. introduces the completely self-contained SFT-10 Liquid Carbon Dioxide Pump. Advanced Peltier (thermoelectric) technology makes it possible to achieve high pressure without the need for an external cooling bath. details>>

Mentor Graphics Announces FloTHERM XT with EDA Connectivity for Advanced Thermal Management

FloTHERM XT is a unique, award-winning thermal simulation solution that can be used during all stages of the electronics design process - from conceptual design to manufacturing - improving product quality, reliability and time-to-market. details>>

Tempo Semi Introduces An Ultra-Low Power Audio CODEC For PC and Industrial Markets

Tempo Semiconductor Inc., (TSI), which delivers essential ultra-low power, high fidelity audio mixed-signal semiconductor solutions to the consumer, PC and industrial market, today announced a new low power audio subsystem for portable applications. This new device - the TSCS422XX - minimizes board space and reduces system cost through integration. details>>

Artila Releases RIO-2018 Web Enabled Thermocouple Input Module

Artila Electronics, the leading designer and manufacturer of embedded device networking and computing, is proud to release RIO-2018, the new generation of web enabled thermocouple input module. RIO-2018 is powered by ARM Cortex M3 and FreeRTOS operating system and features three thermocouple input channels, one 10/100Mbps Ethernet port, two isolated digital input channels and one relay output. details>>

Dyson's LED Bulb Has 37-Year Lifespan

Dyson has arrived and is promising a superior solution. Inventor Jake Dyson, son of Dyson founder James, says the company has built the first light that cools LEDs properly, enabling them to last 37 years. details>>

SANYO DENKI Releases O221 mm x 71 mm Centrifugal Fan

The San Ace C221 has the PWM control function, designed for controlling the rotational speed of the fan from the device side. details>>

Aavid Acquires Qfinsoft Technology For Software For The Simulation Of Fluid Flow, Thermodynamics, And Combustion Processes

Aavid Corporation ("Aavid") announced it has acquired Qfinsoft Technology Inc. ("Qfinsoft"). Based in Rossland, BC, Canada, Qfinsoft specializes in developing software for the simulation of fluid flow, thermodynamics, and combustion processes. Its Qfin software is widely used in fluid flow and thermal management applications and its Qled software is the only product of its... details>>

Dialog Semiconductor Achieves Highest Power Density and Efficiency in Powering Future Computing Platforms

Dialog Semiconductor announces the DA9312, a power management IC that enables the design of smaller, thinner notebook computers and tablets powered by dual cell stacked (2S) Li-ion or Li-Polymer batteries. The notebook industry is moving towards designs powered by 2-cell, rather than 3-cell batteries and tablets are moving from single cell to 2-cell batteries. Dialog is supporting these trends... details>>

New SL Power LB240 AC DC Power Supply Solves Challenging Cooling Issues for LED Lighting and Audio Video Equipment

SL Power Electronics, announces its LB240, the newest family of AC/DC power supplies for LED lighting and audio/video applications. The LB240 is a highly efficient single output power supply that is ideal for high intensity entertainment applications, such as stage lighting and audio/video control systems, due to its ability to operate efficiently in any cooling condition and/or tight space. details>>

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