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  • Effective Thermal Management with Different Thermal Interface Materials for Different Applications

    Proper and effective thermal management and heat dissipation for electronic devices from computers to LED lighting to solar panels are critical for its performance and...
    details>>
  • Heat Pipes: Review, Opportunities And Challenges

    A detailed overview of heat pipes is presented in this paper, including a historical perspective, principles of operations, types of heat pipes, heat pipe performance...
    details>>
  • Microstructure Dependence Of Heat Sink Constructed By Carbon Nanotubes For Chip Cooling

    Heat sinks based on carbon nanotube (CNT) arrays or sponge CNT were found to have a strong impact on the heat sinks thermal performance by changing their coefficient of air...
    details>>

Artila Releases RIO-2018 Web Enabled Thermocouple Input Module

Artila Electronics, the leading designer and manufacturer of embedded device networking and computing, is proud to release RIO-2018, the new generation of web enabled thermocouple input module. RIO-2018 is powered by ARM Cortex M3 and FreeRTOS operating system and features three thermocouple input channels, one 10/100Mbps Ethernet port, two isolated digital input channels and one relay output. details>>

Japanese Cooling Expert Scythe Unleashes New Ninja 4 CPU Cooler

Ninja 4 stays true to the core concept of the Ninja series, by keeping focus on passive and semi-passive cooling capabilities of the tower-cooler. To further underline this core concept, a new fan with additional features has been introduced. The GlideStream 120 PWM fan has equipped with a special fan controller, allowing users to switch between three different fan speed ranges. Low mode has been... details>>

MechaTronix Launches 5.000lm LED Cooling in just 20mm Height

MechaTronix now launches the ModuLED Mega 13420. With a diameter of 134mm and a height as low as 20mm, this LED cooler performs a thermal resistance of 1.32 degrees C/W or the equivalent of 5.000 lumen. details>>

SAE International Book Examines the Impact of Thermal Management on Efficiency of Engines in Vehicles

Thermal Management in Automotive Applications offers insights into how thermal management impacts the efficiency of engines in heavy vehicles, the effects of better coolant flow control, and the use of smart thermostat and next-generation cooling pumps. It also provides an in-depth analysis of the possible gains in optimum warm-up sequence and thermal management on a small gasoline engine. details>>

Dow Corning's New Silastic Fluorosilicone Elastomers Extend Thermal Stability, Design Options for Automotive Applications

Combining its expertise in formulating, mixing and compounding with its ability to modify polymer structure, the company was able to develop a more heat-resistant Silastic FSR technology for extreme high-temperature applications. This new platform now enables Dow Corning's FSR-engineered elastomers to meet the demands of customer automotive applications that require long-lasting, reliable... details>>

Fujipoly Highlights Sarcon SPG-30A Ultra Low Compression Thermal Gap Filler

Sarcon SPG-30A is an easy to handle, high viscosity thermal silicone that is ideal for filing large gaps between delicate circuit board components and a heat sink. Requires minimal compression force. details>>

Jaro Launches Low Noise, Fluid Bearing Air Movers for Thermal Management

Due to a variety of potential mounting options, JARO's frame-less bracket fans offer an amazing level of design flexibility. They are ideal for IC, CPU or embedded heat sink designs, and can also be directly mounted onto circuit boards. The blade diameter ranges in size from 20mm (on the small end) up to 88mm blade diameter (on the large end). Height ranges from 7mm (low profile) to 15mm. Airflow... details>>

NASA High Temperature Thermoelectric Material Called Skutterudite Commercialized by Evident Technologies

NASA's Jet Propulsion Laboratory, Pasadena, California, has licensed patents on high-temperature thermoelectric materials to Evident Technologies, Troy, New York, which provides these kinds of materials and related power systems. Evident Technologies will use technological advances from JPL in this area to develop commercial, high-temperature thermoelectric modules for terrestrial applications. details>>

Low Profile Full Brick Baseplate Cooled AC/DC Supplies Need No External Components

XP Power's ASB110 series provides a complete AC/DC power supply module requiring no external components. The full-brick sized power supplies offer high efficiency and a low profile for PCB pin-mounted designs. Aimed at ITE and industrial customers looking for a base-plate cooled power supply solution, the ASB110 provides 110W of DC output power from a universal AC input. Its high efficiency of... details>>

Indium Corp. Features Its Reinforced Indium and Solder Alloy Fabrications [VIDEO]

InFORMS are patented fabrications in which braided, woven, or random-fiber metal substrate materials are embedded into a solder preform. This technology is ideally suited for IGBT assembly of the DBC to the baseplate. details>>

Laird Tech Releases Coolzorb 400 Series- A Thermal Conductive Absorber

This hybrid materials product provides EMI mitigation while moving heat away from sensitive electronics; Laird has introduced the dual-function, board level material that simultaneously improves signal integrity and temperature stability of electronic circuits. details>>

Himalay Engineering Co. Offers Die Cast Aluminum Heat-sinks for Low-cost Cooling [VIDEO]

Made from high quality raw materials Himalay Engineering Company's custom designing of aluminum heat-sinks increases the efficiency life of devices and are known for their optimum efficiency and performance level. Our products are available in various sizes and are reckoned for their robust construction, high tensile strength and corrosion and abrasion resistance. details>>

Versarien Technologies' Launches First Range of 10 Low Profile Air Cooled Heat Sinks

Versarien plc's subsidiary, Versarien Technologies Limited, has launched a brand new range of 10 low profile air cooled heat sinks using the material VersarienCu. This is the first 'off the shelf' thermal management solution released by Versarien Technologies and offers added performance in low profile applications for passive cooling environments. details>>

DHCAE- Tools Releases CastNet V4 with extended functionality for OpenFOAM and a revised GUI

CastNet is an essential element of DHCAE Tools' modelling environment that supports the complete workflow for CFD and FEA applications from CAD import via mesh generation and case setup, run-time control and monitoring of the simulation job up to final post-processing. details>>

Sensirion Introduces The SLS-1500 Compact Liquid Flow Meter

Delivering measurements for 0-40 ml/min flow rates, SLS-1500 has 20 msec typ response time and can monitor highly dynamic dispensing processes. Modular approach, combining sensor and interface cable, ensures optimal match and accelerated results. Flow channel inside sensor is completely straight and open and has no moving parts, while inert wetted materials provide chemical resistance and... details>>

Innovations In Optics, Inc. Sources for Ultrafast Line Scan Applications Deliver Megalux Illuminance with Passive Cooling

Innovations in Optics, Inc. offers the Aurora Classic LED Line Source Illuminators that offer Megalux illuminance using passive cooling. Other line lights for machine vision require water-cooling to achieve equivalent Megalux levels that the Aurora Classic LED Line Sources can provide while cooling with natural convection. details>>

LIA Laboratories Ltd tests Show Nanotherm Thermal Management Substrates Running up to 47c Cooler than Competing Solutions

Tests by The LIA Laboratories show Cambridge Nanotherm's solution offered best-in-class thermal management solution for LEDs across comparative products tested at the same time. details>>

Data Translation Releases The DT9828, A Low-cost USB Thermacouple Measurement

The DT9828 design sets the accuracy benchmark for thermocouple measurements. Combined with the included QuickDAQ ready-to-measure application software, the DT9828 is a powerful temperature data logger. details>>

AI Technology, Inc (AIT) Introduces 3D-TSV Ultra-Thin Wafer Processing Temporary Bonding Adhesive Film

AIT high temperature capable WPA removes easily with laser assisted and solvent assisted release separation de-bonding besides traditional heat-sliding processes. details>>

ATS offers Heat Sinks that Cool LEDs with High-density, Lighter-weight Zipper Fins[VIDEO]

Zipper fin heat sinks allow the combined use of copper and aluminum materials. In these designs, the copper base allows for optimal heat spreading while the aluminum fins ensure the heat sink will be lightweight. details>>

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