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coolingZONE Newsletter February 08, 2012
Research
Miniature-Scale Refrigeration for Thermal Management
Processor frequencies are increasing along with board densities, while spatial constraints are remaining the same, or shrinking. Refrigeration cooling can emerge as a practical solution to advanced electronic cooling challenges. Refinement of vapor compression cooling techniques are sure to... Read more
LED Heat Transfer and Cooling Technology Options
LED lighting is one of the fastest growing market sectors across the globe. The challenge that a designer or producer of such product has is the alignment of the cooling system/solution with the deployment-site requirements and its marketplace acceptance. In addition to packaging issues, this... Read more
Cooling High Power Electronics with Microchannels
In recent years, as computing power densities have continued to increase, it has come to the point where the traditional air cooling solution is becoming less and less able to keep up with today's power dissipation requirements. No single technology has yet been declared the frontrunner in the... Read more
Understanding Cold Plate Manufacturing for Deployment in Electronics Equipment
The most important rule in the thermal management of electronics devices is to design cooling systems to maintain the device junction temperature below a set limit called maximum junction temperature. The most common and economical method for cooling devices is air cooling. However, to deal with... Read more
Product News
Ellsworth Adhesives Introduces Dow Corning 3-1900 Series Conformal Coatings
Thermoelectric Module Product Line Added to Digi-Key Online Product Training
Global and China Flexible Printed Circuit Board (FPCB) Industry Report, 2010-2011


Found on the web Technology corner Conferences
  More Customers Move to ATS for Thermal Characterization Services to Cool Their ...
 
  Aero-engineers debut open-source fluid dynamics design application
 
  Mentor Graphics' Deal Expands CFD Portfolio
 
  Air jet impingement on miniature pin-fin heat sinks for cooling electronic
 
  System and method for liquid cooling of an electronic device
 
  Air cooled computer chip
 
  coolingZONE-12 Thermal Management of Electronics eConference (August 29th and 30th)
at from29, August 2012to 30, August 2012
 
  coolingZONE LED 2012
at from09, October 2012to 09, October 2012
 
  SEMI-THERM l IEEE Semiconductor Thermal Measurement and ...
 
Editor's corner
coolingZONE-12 International Conference and Exhibition
Location: The coolingZONE International Conference and Exhibition will be in Cambridge, MA. in 2012, the heartland of high technology and business education Date: 29, August 2012 To 30, August 2012 for more details
» Read more
coolingZONE LED - May 2012
Berlin Germany, May 2012- coolingZONE and InnovationFAB will be hosting a dedicated conference on LED thermal management and smartCooling. The conference is a combination of the technical and manufacturers presentation on cooling solutions for LEDs. The conference will be preceded by a series of short courses dedicated to thermal management and characterization of LEDs. Please see here for Call for Paper
» Read more

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