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coolingZONE Newsletter for November 12, 2013 November 12, 2013
Top Stories
Turbulent Models for CFD Simulation in Electronics Cooling
Strategies for engineers to predict system air flow with CFD when there is air turbulence
Minimizing Acoustical Noise In Electronic Systems
How to Keep Electronics Cool While Keeping the Noise Within Proper Human Limits
Thin Is In With Ge's 4mm Tall Piezo Electric Cooler
Using Your Lungs as a model GE's Air Mover Cools Electronics at the Source
Dr. Cliff Federspiel on Mission Critical Cooling of Datacenters
How to address datacenter cooling where a 15-min. outage can mean $25M in lost revenue
coolingZONE News
Design Corner Thermal Analysis and Calcluation Tools Available Now from coolingZONE
coolingZONE has a series of free thermal analysis and calculation tools. The tools are no charge and include impingement heat transfer, heat sink fin...
Supplier Directory Expands Opportunities for Listed Companies
The coolingZONE Supplier Directory contains hundreds of companies with products and services focused on thermal management. There are still openings...
coolingZONE Partners with Google Scholar for In Depth Thermal Management Research
coolingZONE's partnership with Google Scholar brings you a searchable index of thermal management research engineers can apply to their projects
Product News
Future Facilities Has Launched A Significant Update To Its Powerful, Predictive Modelling Suite, 6sigmadc.
Future Facilities, the world's only provider of Predictive DCIM (Data Centre Infrastructure Management) software, has launched a significant update...
Fluke 2638a Hydra Series Iii Data Acquisition System Provides Best-In-Class Thermocouple Accuracy In A Portable System
Fluke Corporation introduces the Fluke 2638A Hydra Series III, the latest addition to the Hydra line of Data Acquisition Systems / Digital...
Stamped CPU heat sink improves air convection by up to 5%
ASSMANN WSW has introduced the 'Stamped CPU Heat Sinks' series, a combination of 'CROSS-CUT' and 'Finger-Shaped heat sinks'. The series is available...
Henkel's Novel Thermal Absorbent Films Deliver Robust Heat Management for Handheld Devices
To address the heat management challenges associated with higher functioning, smaller footprint handheld devices, The Electronics Group of Henkel...
Form-in-Place Thermal Compound Sets New Industry Benchmark
Fujipoly's new SARCON SPG-50A sets a new performance standard for form-in-place gap filler materials by delivering a thermal conductivity of 5.0 W/m...
New Precision Temperature Controllers for Gas Production
Cracking is not typically a welcome term in most industries as there may be obvious implications of damage. That's not true for the Custom Energy...
Space Saving, Energy Saving Thermoelectric Air Conditioners
TECA Corporation (Chicago, IL) introduces the largest flush-mounted thermoelectric air conditioners currently available on the market. For enclosures...
Forecast Report Released on Energy Harvesting/Regeneration for Electric Vehicles Land, Water & Air 2014 - 2024
The electric vehicle industry - land, water and air - is rapidly rising to become a huge market of over $290 billion by 2024. Some run entirely on...
Thermal Analysis Calculator Estimates Accurate Package Bottom Temp Based on PCB Construction
The thermal analysis tool tackles the problem of estimating the rise in temperature between the ambient surrounding and the bottom of a packaged MMIC...
ATS Introduces New Thermal Test Instrument, FSC-200, Fan Speed Controller
ATS has just introduced a new lab instrument, the FSC-200(TM) fan speed controller. This device is designed to control the fan/fan tray speed in a...
Technology Corner
Boeing Chip Experts Eye Design Breakthroughs In Electronics Thermal Management [Mil and Aerospace Magazine]
Microelectronics experts at the Boeing Co. Defense, Space & Security segment in El Segundo, Calif., will try to break through design limitations in...
For Thermal Management, How Does Fpc Compare To Rigid Material? [Printed Circuit Design and Fab]
Mobile devices are a modern computing marvel. What once filled an entire room now fits in a shirt pocket and is an indispensable convenience, with...
MIT Researchers Make Surfaces That Are Easier To Cool Under Extreme Heat; Finding Could Benefit Power Plants, Electronics [MIT News]
When an earthquake and tsunami struck Japan’s Fukushima nuclear power plant in 2011, knocking out emergency power supplies, crews sprayed seawater...
Building an efficient, intelligent, and flexible thermal management system [Embedded Systems Development]
The rapid growth of hardware-based systems has increased the need for efficient thermal management systems (TMS). A simple TMS can be an on/off...
Why Automatic Thermal Profiling Outperforms Manual Approaches [U.S. Tech]
Electronics manufacturers are constantly seeking improved performance for reduced cost. As part of electronic manufacturing, one of the last manual...
Engineering How To
How to Measure Air Flow in Electronic Systems
How to get past the complexity and unpredictability of system air flows in determing system or junction temperature through direct measurement.
How to calculate the temperature distribution on convection cooled plates using a Bessel Function
There are many ways to calculate the temperature distribution on convection cooled plates. This article presents how to based on a modified Bessel...
How to Approach the Cooling of Lithium-Ion Batteries
What makes Lithium Ion Batteries a challenge to cool and what are some concepts to approach this? This article gives ideas and thoughts to accomplish...










Conferences & Webinars
ATS Webinar: Basics and Options in Thermal Modeling of Electronic Systems
November 14, 2013 at 2:00PM EST, Webinar. There are three fundamentals behind thermal modeling: The Integral Method or first order solution; Computational or second order solution; The Experimental or final solution. There are distinctive and unique advantages for each one. The integral model leaves us with results that...
ICHTA 2014 : International Conference on Heat Transfer and Applications
January 20-21, 2014, London, UK The 2014 International Conference on Heat Transfer and Applications aims to bring together leading academic scientists, researchers and scholars to exchange and share their experiences and research results about all aspects of Heat Transfer and Applications, and discuss the practical...
9th European Advanced Technology Workshop On Micropackaging And Thermal Management
February 5 & 6, 2014 Sandrine LELONG-FENEYROU (ZODIAC AEROSPACE). The Workshop will present cooling solutions for microelectronics packaging; Micro-cooling solutions; Heat conductive materials at chip, board, sub-system and system levels, Advances in PCBs for thermal management; Thermal modeling and simulation; Heatsinks,...

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