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coolingZONE Technical Newsletter January 30, 2014
Top Stories
Uncertainties in Thermal Design
While temperature is often the focus in thermal design, there are a handful of other problems which are at least as important.
Thermoelectric Peltier Cooling
Peltier Coolers form the basis for thermoelectric cooling, learn about what they are and how they can best be deployed.
Carbon and Graphite Foams for Thermal Management
Improvements in carbon materials are increasing industry interest as cooling needs mount for components and PCBs.
Integrating Heat Pipes into Heat Sinks
In this technology review, patents covering the integration of heat pipes in to heat sinks are considered.
coolingZONE News
coolingZONE Partners with Google Scholar for In Depth Thermal Management Research
coolingZONE, LLC and Google have partnered to bring Google Scholar’s article library to coolingZONE’s members. Google Scholar content is a...
coolingZONE Technical Newsletter is Chock Full of Engineering Information
Did a colleague forward this newsletter to you? Why not sign up for your own? Delivered to your inbox, our technical newsletter is rich with...
coolingZONE Supplier Directory Features Solutions Providers in Heat Sinks, Advanced Materials and More!
The coolingZONE Supplier directory is a great way to find solutions for your next thermal management design. This focused directory helps you find...
Product News
FZtech Introduces Server Cooler Freezer 120 Series
FZtech, the Taiwan-based thermal and metal products manufacturer, is pleased to announce the addition of the Freezer 120 Series - LGA1366 CPU Cooler...
Iceotope Raises $10m In Series A Funding [video]
Iceotope, the environmental IT cooling specialist, has today announced the completion of its Series A fundraising, securing in excess of $10m. Aster...
Niagara Thermal Products LLC Selected as Critical Supplier for Buffalo BioBlower Air Purification Systems
Niagara Thermal Products is proud to announce that it has been selected by Buffalo BioBlower Technologies LLC ("B3") as the critical...
NREL Model Licensed to Improve Accuracy of Battery Simulations
The Energy Departments National Renewable Energy Laboratory (NREL) has licensed its Equivalent Circuit Battery Model to software developer...
Agilent Technologies Introduces World's Fastest USB Thermocouple Power Sensors with Best Linearity and Accuracy
Agilent Technologies announced the Agilent U8480 Series, the world's fastest USB thermocouple power sensors. Based on the same front-end design as...
Cree Introduces Industry's Brightest High-CRI LED Module
The new 6000-lumen LMH2 LED module from Cree (Nasdaq: CREE) is the industry's brightest module to offer color-quality greater than 90 CRI at a...
WindSim AS Launches WindSim Cloud Solution Providing Access to Highly Efficient; Scalable and Secure Computing Resources
WindSim AS, a pioneer and leading provider of CFD (Computational Fluid Dynamics) technology used to optimize wind turbine placement, wind...
Half Ton Capacity Thermoelectric Air Conditioner
A first in the field of thermoelectric cooling, TECA Corp. introduces the AHP-6263 Model with a half ton of cooling capacity. This is the largest...
FLIR Systems Introduces First Thermal Imager Designed for Smartphones [video]
FLIR Systems, Inc. FLIR -0.58% announces the launch of FLIR ONE(TM), the first consumer-oriented thermal imaging system. Introduced today at CES...
Liquid Crystal Thermography System Measures PCB and Component Temperatures [video]
The new ethermVIEW liquid crystal thermographic analysis system provides precise, optical temperature measurements of active PCBs and components. The...
Technology Corner
What’s Stopping Liquid Cooling? [Data Center Journal]
With all its benefits, liquid cooling would appear to be a default solution for much of what ails today’s data center. But combined with its...
Nanotechnology Primer: Graphene - Properties, Uses And Applications [Nano Werk]
Carbon comes in many different forms, from the graphite found in pencils to the world's most expensive diamonds. In 1980, we knew of only three...
This Carbon Nanotube Heatsink Is Six Times More Thermally Conductive, Could Trigger A Revolution In Cpu Clock Speeds [Extreme Tech]
One of the most significant problems facing modern CPUs is the efficient transmission of heat between the CPU cores themselves and the heatsinks that...
Synthetic diamond’s role in thermal management [Solid State Technology]
Synthetic diamond is ideally suited for thermal management of semiconductor packaging, as it combines exceptionally high thermal conductivity with...
Improved Thermoelectrics Could Migrate from Space to Earth [Scientific America]
NASA's latest rover on Mars depends on a sandwich of semiconducting material that can turn heat into electricity. In the case of Curiosity, the...
Engineering How To
How to Optimize the Evaporator to Condenser Length Ratio for Heat Pipe Maximum Performance
Finding the optimal L-ratio offers a valuable tool for thermal practitioners to most effectively deploy the heat pipe in their application. This...
How to Use The Most Famous Equation in Fluid Mechanics
Bernoulli's equation is one of the most famous equations of fluid mechanics and is applied to a lot of different situations. Unfortunately, it is...
How to Calculate the Heat Transfer Coefficient for a Flat Plate with Free Convection
What to do when calculating the heat transfer coefficient for a flat plate with free convection when your value for heat transfer coefficient does...









Conferences & Webinars
Heat Sink Selection Made Easy [webinar]
February 13, 2014 at 2:00PM EST, In this engineering webinar, attendees will learn the importance of system airflow and its impact on heat sink design; attachment methods and how to solve thermal and mechanical design challenges; and how to make the right off-the-shelf or custom heat sink choice for your application and...
9th European Advanced Technology Workshop On Micropackaging And Thermal Management
February 5 & 6, 2014 Sandrine LELONG-FENEYROU (ZODIAC AEROSPACE). The Workshop will present cooling solutions for microelectronics packaging; Micro-cooling solutions; Heat conductive materials at chip, board, sub-system and system levels, Advances in PCBs for thermal management; Thermal modeling and simulation; Heatsinks,...
Semi-Therm 30
March 9-13, 2014, San Jose, CA The mission of the IEEE Semiconductor Thermal Management and Measurement Symposium or SEMI-THERM is to provide an annual forum for the exchange of latest technical developments in thermal management of electronic devices, components and systems. SEMI-THERM’s mission is accomplished by...

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