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coolingZONE Tech Newletter 5-26-17 May 25, 2017
Top Stories
Low Temperature Thermoelectric Cooling
Researchers developed 1-D crystalline compounds with thermoelectric powers from cryogenic to room temperature.
Diamond Transistors Could Replace Silicon
Researchers have created a new fabrication process for building diamond-based transistors that could replace silicon.
Exploring Fin Geometries in Heat Exchangers
A recent article from ATS explored new finned heat sink and tube-to-fin heat exchanger designs.
Fujitisu Turning to Immersion Cooling
Fujitsu is implementing liquid immersion cooling systems that it believes will bring in the next generation of data centers.
coolingZONE Update
Watch Thermal Management Videos on coolTV
coolTV, coolingZONE's engineering and science information channel, has informative, interesting, and fun videos about the thermal management.
Join Supplier Directory and Promote Your Business
Join the coolingZONE Supplier Directory and promote your business to thousands of engineers from across the thermal management industry.
Explore coolingZONE Library for Thermal Management Research
Explore the extensive coolingZONE Library to find loads of research, case studies, and technical articles on all aspects of thermal management.
Product & Industry News
Boyd Corp Completes Acquisition of Aavid Thermalloy
Boyd Corporation, a global leader in thermal management and environmental sealing solutions, announced the acquisition of Aavid Thermalloy.
ATS offers High-Resolution Thermography System with Precise Temperature Accuracy
thermVIEW from Advanced Thermal Solutions, Inc. is a Thermochromic Liquid Crystal based temperature measurement system that performs high-resolution...
Sager Electronics Announces New Director of Sales Engineering
Sager Electronics announced the promotion of Randal Stone, BSEE, to Director of Sales Engineering for Sager Power Systems.
Laird Active transceiver coolers enable high data transmission speeds
Laird has developed a new platform of customizable TEAs specifically designed for thermal management in SFP transceivers.
Phononic Brings High-Performance Electronics Cooling to Asia Pacific
Phononic, the company revolutionizing cooling and heating with solid-state technology, announced it is has expanded its global footprint within the...
Autoneum Opens New North America Headquarters in Michigan
Autoneum continues to invest in the automotive market of North America with a new Headquarters facility in Michigan.
Solvay Hyflon PFA enables Beijing Xinshiyi to develop heat exchanger for power plants
Solvay announced that its advanced Hyflon PFA fluoropolymer enabled China-based Beijing Xinshiyi Energy Conservation and Environmental Protection...
GlacialTech Announces New Igloo FR210 Series Cold Forging Heatsinks
GlacialTech, the diversified lighting and thermal solution provider, announces a new series heatsinks using cold forging technology are ideal for...
LG Innotek mass produces thermoelectric modules for Wine Cellars
LG Innotek announced it has mass produced thermoelectric modules for Wine Cellars. This
1200V SiC Schottky Diodes from Littelfuse Are First Products from New Platform
Littelfuse, Inc., the global leader in circuit protection, introduced the first GEN2 Series of 1200V Silicon Carbide (SiC) Schottky Diodes.
Technology Corner
Advancing next-generation batteries towards 4S: Stable, safe, smart, sustainable [Phys.org]
Shu Lei Chou and colleagues from the University of Wollongong have published a review article in National Science Review proposing a new concept of...
2D Materials Go Ferromagnetic, Creating a New Scientific Field [IEEE Spectrum]
Researchers at the Lawrence Berkeley National Laboratory have successfully demonstrated that two-dimensional (2D) layered crystals held together by...
FLIR ETS320 Case Study Video [Electronics Cooling Magazine]
FLIR?s first thermal imaging camera accurately measures temperatures across more than 76,000 points on your device with just the push of a button.
NIST scientists develop new cryocooler that does not use liquid helium [coolingZONE]
Scientists at the National Institute of Standards and Technology (Gaithersburg, Md.) have created a novel, hybrid cooling system for superconducting...
Thermal Simulation and Wearables: Too Hot to Handle, Too Bright to Watch [Digital Engineering]
While the market grows, the devices themselves are shrinking. The miniaturization adds a new layer of complexity to the design.
Engineering How To
How to Enhance Heat Sink Performance with Stacked Multilayer Fin Structure
This video explains how to enhance heat sink performance by adding layered fin structures to add surface area for heat transfer.
How to Calculate the Performance of Heat Sinks
In this column, Dr. Cathy Biber pulls together an overview of the whole procedure. This applies to a straightforward heat sink with a base and...
How to Measure Air Velocity with Thermistors
Traditional methods of air velocity measurement use either a hot-wire anemometer or vane anemometer. Both are single-point measurement devices that...











Conferences & Webinars
INTERPACK - Packaging and Integration of Electronic and Photonic Microsystems
Aug. 29 - Sept. 1, 2017 - San Francisco, Calif. - InterPACK is the premier international forum for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronic packaging, MEMS, and NEMS. It is the flagship conference of the ASME Electronic and Photonic Packaging Division...
International Conference on Thermal Engineering Theory and Applications
February 25 - 28, 2018 - Doha, Qatar - The conference main objective is to bring together researchers engaged in the application of experimental, analytical, or theoretical thermal and energy engineering. The suggested topics link between conventional and emerging research areas in thermal energy. Papers submitted to the...
International Symposium on Advances in Computational Heat Transfer
May 28- June 2, 2018 - Napoli, Italy - The objective of the symposium is to provide a forum for the exchange of ideas, methods and results in computational heat transfer (CHT). Papers on all aspects of CHT - both fundamental and applied - will be welcome.

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