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coolingZONE Newsletter for February 13, 2013 February 13, 2013
Top Stories

How to Build Your Own Screaming Fast Gaming PC
How to Build a Gaming PC Featuring Intel Extreme Edition Read more
Alleviating Thermal Spreading Resistance in Telecommunication Systems
Solutions to deal with increased spreading resistance in high power telecomm equipment Read more
The Fundamentals of Heat Transfer Modeling for Electronic Systems
How to apply the 3 methods of thermal modeling: integral, computational, expermimental Read more
Can Software Be Your Thermal Management Solution?
Software controls precesses and makes systems usable, should cooling be included? Read more
Product & Industry News
Semi-Therm Program Announced with Executive Briefing on the Thermal Management Market [sponsored]
CD-Adpaco Announces Webinar: Best Practices for Forced Convection Simulations, Part 2 [sponsored]
Aseteks ISAC Data Center Liquid Cooling Technology Selected by U.S. DoD
Aavid Thermalloy Has Released A Complete Line of Liquid Cooled Systems
Ohmite Releases HVC Series of High Voltage Chip Resistors
COOLTRON Releases New Sourcing Tool For Fans and Blowers
High Conductivity Aluminum Plates with Embedded Heat Pipes is the Featured Product at Advanced Cooling Technologies
Two Part Epoxy System with Outstanding Thermal Conductivity Released by Master Bond
CTS Electronic Components announces a full line of heat sink products that are convenient and easy to use, while maintaining an exceptional thermal performance.
Technology Corner
  Multilayer PCB Simulation (Electronic News)
 
  Dynamic Thermal Management for Multi-core Microprocessors Considering Transient Thermal Effects (University of CA; pdf)
 
  German student builds electromagnetic harvester to recharge a battery (Phys.org)
 
  Clues from Quantum Biology Could Lead to More Efficient Solar Energy (Solar Novus Today)
 
  Graphene quilts for thermal management of high-power GaN transistors (Nature Communications Open Research)
 
Engineering How To
  How to Choose a Heat Sink Attachment
 
  How to Determine the Junction Temperature in Plastic Semiconductor Packages
 
  How to Select a Heat Sink
 









Conferences & Webinars
  Best Practices for Forced Convection Simulations, Part 2 (webinar | 2-21-2013)
 
  ICHTA 2013 : International Conference on Heat Transfer and Applications (conference | 3-5-2013)
 
  Semi-Therm 29 (conference | 3-17-2013)
 
  World Conferences on Experimental Heat Transfer, Fluid Mechanics and Thermodynamics (conference | 6-16-2013)
 
  ASME 2013 Summer Heat Transfer Conference (conference | 7-14-2013)
 
Editor's corner
Thermal Management: Boring or Enabling?
We ran an editorial from George Meyer, COO and CTO, Celsia Technologies last year and we thought his message about the trends in thermal management were worth repeating for 2013. He talks about trends in technologies like nano-thermal interfaces, thermal ground planes, MACE, liquid cooling and more. Has the field of mechanical engineering with thermal management cooled off? Not at all, it is just starting to heat up.
» Read more

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