Editorial

• Grant given for development of additive manufacturing process for high-temp heat exchangers

  Michigan State University (East Lansing, Mich.) recently received a $2.3 million grant from the U.S. Department of Energy (DOE) Advanced Research Projects Agency-Energy (ARPA-E) to continue its work on 3-D metal printing technologies for compact, high-temperature heat exchangers. details>>

• Engineers design cooling and heating patch that acts as personal thermostat

  Engineers from the University of California San Diego designed a flexible, lightweight wearable patch that cools or heats the skin to maintain a comfortable temperature despite changes to the ambient environment, according to a report from the school. details>>

• Company introduces innovative method for cooling PV modules to increase efficiency

  Coolback, a company based in the Netherlands but with test facilities in Spain and Qatar, developed a new method for the cooling photovoltaic (PV) solar modules that it claims will increase efficiency and the lifespan of the module. details>>

• Researchers develop high-res, high-sensitivity proximity capacitance imaging sensor

  Researchers at Tohoku University (Sendai, Japan) recently presented a new capacitance imaging sensor that has a high enough resolution and sensitivity that it can display not only the swirls of a fingerprint but also the sweat pores between the ridges. details>>

• Exploring developments in extruded heat sinks for electronics cooling applications

  A recent article from Advanced Thermal Solutions, Inc. (ATS), a leading-edge thermal engineering firm based in Norwood, Mass., explored recent industry developments in extrusion profile heat sinks, from the material choices to the manufacturing techniques to the thermal performance. details>>

• High schooler creates clothing that turns sweat into electricity for active cooling

  Rohit Nemani, a 17-year-old student from Cox Mill High in Concord, N.C., developed an active cooling fabric with the help of equipment from North Carolina State University (Raleigh, N.C.) that pulls sweat from the skin and spreads it out to enhance evaporation on the skin and keep someone cool, according to a report from ScienceNewsForStudents.org. details>>

• What is the thermal performance of heat sinks with heat pipes in server cooling applications

  A recent article from Advanced Thermal Solutions, Inc. (ATS), a leading-edge thermal engineering company based in Norwood, Mass., looks at the thermal performance of heat sinks with embedded heat pipes and vapor chambers for cooling high-powered blade servers. details>>

• University program working to commercialize microscale liquid cooling technology

  Georgia Institute of Technology (Atlanta, Ga.) researcher Daniel Lorenzini developed a liquid cooling system that enabled overclocking chips to perform at lower temperatures than commercial hardware and he is now working with VentureLab, a Georgia Tech program, to commercialize this technology. details>>

• DOE and Cray announce partnership to build record-setting Frontier supercomputer

  The U.S. Department of Energy (DOE) announced a new contract with Cray Inc., an American supercomputer manufacturer, to build the Frontier supercomputer at the Oak Ridge (Tenn.) National Laboratory with an expected debut in 2021 and expected performance of more than 1.5 exaflops. details>>

• Company producing textile-based undercovers for thermal management of EV batteries

  Autoneum, a Switzerland-based automotive supplier, announced that it was expanding its product line to include a textile battery undercover made from its Ultra-Silent material that meets the acoustic and thermal needs of electric vehicle (EV) batteries. details>>