Editorial
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Researcher receives DOE funding for the development of aerogel insulation
Researchers at the University of Buffalo (N.Y.) received nearly $2 million in funding from a U.S. Department of Energy (DOE) grant to develop an inexpensive, silica-aerogel-based insulating material that could be used to reduce home and business energy costs. details>> -
Researchers develop model to understand interaction between water and 2-D material
An undergraduate researcher at Virginia Tech University (Blacksburg, Va.) developed a computational model that describes the interaction between water and the surface of 2-D hexagonal boron nitride and will allow scientists to better predict the behavior of water at this interface, which could be a step towards boron-nitride-based electronics. details>> -
Detailing the impact of a novel air jet impingement design for cooling a 1U system
In the latest article from Advanced Thermal Solutions, Inc. (ATS), a leading-edge thermal engineering company based in Norwood, Mass., a novel air jet impingement design for cooling 1U systems is highlighted and its thermal performance is detailed. details>> -
TSMC announces first complete design infrastructure for 5 nm process technology
Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) recently announced that it has created the first complete version of its five-nanometer (nm) design infrastructure that enables 5 nm systems-on-chip (SoC) for next-gen mobile and high-performance computing applications. details>> -
DOE announces $36 million in funding for high-temperature materials projects
The U.S. Department of Energy (DOE) recently announced the award of $36 million in funding to support 18 projects, as part of the High Intensity Thermal Exchange through Materials and Manufacturing Processes (HITEMP) program and the final OPEN+ Cohort, Higher-Temperature Devices. details>> -
Clarkson professor named a fellow of the American Society of Thermal and Fluids Engineers
Dr. Goodarz Ahmadi, a professor of mechanical and aeronautical engineering at Clarkson University (Potsdam, N.Y.) has been elected as a fellow of the American Society of Thermal and Fluids Engineers (ASTFE) and will be presented his fellowship at the fourth annual Thermal and Fluids Engineering Conference in Las Vegas. details>> -
Microsoft holding off on a switch to liquid cooling for its Azure servers
According to a report from Data Center Knowledge, engineers at Microsoft announced at the 2019 OCP Summit that they would not yet be switching from air to liquid cooling for its Azure servers due to the lack of maturity of the technology. details>> -
Researchers design Blue, a low-cost, human-friendly robot designed for AI applications
Researchers at the University of California - Berkeley designed a new low-cost robot, named Blue, which will utilize developments in artificial intelligence (AI) to perform intricate human tasks such as folding laundry, according to an article from the school. details>> -
New study explores the heat transfer mechanisms behind boiling water to prevent boiling crisis
Researchers from the Massachusetts Institute of Technology (MIT) in Cambridge, Mass. analyzed the heat transfer mechanisms of boiling water to explain how to predict and prevent a boiling crisis, which is the point when enough bubbles form on the surface that the resulting sheet of vapor blocks further heat transfer to the surface. details>> -
Researchers create transparent wood that stores and releases heat for potential energy savings
Researchers from the KTH Royal Institute of Technology in Stockholm, Sweden presented a study of a new, transparent wood that absorbs and releases heat and could lead to savings on energy costs at the American Chemical Society (ACS) Spring 2019 National Meeting and Exposition. details>>