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coolingZONE-12 Thermal Management of Electronics eConference (August 29th only)

Location: Live Streamed, August 29th only Date: 29, August 2012 To 29, August 2012

coolingZONE-12 Thermal Management of Electronics eConference Program

Conference: coolingZONE-12 Thermal Management of Electronics eConference Program
Date:  Wednesday August 29 and Thursday August 30, 2012
Time: 9:30AM to 5PM EST

Wednesday Program
Host Introduction and opening remarks

Keynote Address
Intrachip Microfluidic Cooling - Gen3 Thermal Packaging Technology

Avram Bar-Cohen, Ph.D.
Program Manager, DARPA-Microsystems Technology Office

From the dawn of the Information Age thermal management technology has played a key role in the continuing miniaturization, performance improvements, and higher reliability of electronic systems. During the past 65 years, thermal packaging has migrated from ventilation and air-conditioning to cabinet cooling, to package cooling with heat sinks and cold plates, and is today addressing on-chip hot spots and near-junction thermal transport. Following a brief history of thermal packaging, attention will turn to a review of emerging DARPA-driven micro and nano-technologies for reducing the thermal resistance of defense electronic systems. The asymptotic maturation of current technology and growing thermal management demands in high performance computing and RF systems have led DARPA to initiate efforts in third-generation thermal management technology based on intrachip and interchip microfluidic cooling. The motivation, technological thrusts, and promise of this new thermal management paradigm will be discussed.

Flow and Thermal Optimization in CFD (CD-Adapco)

Ruben Bons
Electronics Sector Manager, CD-Adapco

 CD-adapco is the world's largest independent CFD-focused provider of engineering simulation software, support and services. CD-adapco's flagship software, STAR-CCM+, provides the world's most comprehensive engineering physics simulation inside a single integrated package.  This session will detail the optimization capabilities in STAR-CCM+, particularly its ability to perform design exploration, design of experiments, robustness analysis, and goal-driven constrained optimization.  The demonstration will show the usage of STAR-CCM+ in optimizing the flow and thermal performance of a liquid-cooled heat sink, balancing the pressure needed to drive the liquid flow with the cooling capacity provided.  Specifics of the simulation workflow, typical options, and available results will be examined.

Using computers to go where experiments cannot: massively-parallel LES of turbulent heat transfer

Andrew T. Duggleby, Ph. D.
Assistant Professor, Department of Mechanical Engineering, Texas A&M University

For decades, the steady increase in modern computing technology has allowed for faster as well as larger, more complex simulations. With all this computing power, there are still only two areas in which a numerical simulation is better than an experimental data: (1) quick, reliable (510-20% error) simulations for design optimization, and (2) massive resolution, highly accurate (< 1% error) simulations. In both cases the computer is going where experiments cannot. In quick simulation case, the simulations are faster and cheaper than any experiment, yielding results (hopefully trustworthy results) fast enough to be included in a design cycle. In the highly-resolved case, the resolution is far beyond any experimental measurements - in the context of turbulent heat transfer, the entire velocity, pressure, and temperature fields are known everywhere at all times. In this talk, the current state-of-the-art for both the quick simulations and the highly- resolved simulations will be discussed in the context of turbulent heat transfer. For the quick simulations, recent advances in not just simulation time, but total CAD to analysis time will be discussed: (a) Computer-Aided Design (CAD) model to mesh time, (b)  simulation time, (c) accuracy vs time trade-os (models, resolution, etc), (d) analysis time. For computational fluid dynamics and heat transfer, this almost always refers to the steady-state Reynolds-Averaged Navier-Stokes (RANS) models, but an example will be given for a time-dependent Large Eddy Simulation of a venturi nozzle where CAD to analysis was done in under 24 hours. For the highly-resolved simulations, analysis techniques to elucidate useful information out of terabytes of data are discussed, with an example of pin-n heat transfer direct numerical simulation (DNS) where the modes responsible for heat transfer are extracted via Proper Orthogonal Decomposition (POD), and then enhanced by endwall contouring resulting in increased convection with minimal drag increase.

Fan Flow Performance Enhancements Using norEASTER Technology (ATS, Inc.)

Eric Proos, Advanced Thermal Solutions, Summer Intern
Increased density of electronics both at the silicon level and board level have created an ever increasing need for advanced cooling technologies. Increasingly, liquid cooling, whether heat pipes, cold plates or full liquid cooling systems, are being seen as the next technologies to implement. ATS has developed an advanced active air cooling technology for these high power devices. The technology is norEASTER. ATS experimental data show that norEASTER provides, on average, a 25% increase in a fan’s cooling capabilities when tested using a 31mmx31mm aluminum base with 9.5mm finheight. This presentation will discuss the test data, findings and applications of this air cooling technololgy

High-Performance Thermal Management Materials

Carl Zweben, Ph.D.
Advanced Thermal Materials Consultant

Life Fellow, ASME; Fellow, SAMPE & ASM; Associate Fellow, AIAA

In response to well-recognized needs, there have been revolutionary advances in thermal management materials. Silicon carbide particle-reinforced aluminum (Al/SiC), which was first used in thermal management by the speaker’s group at GE in the 1980s, is now well established. By replacing a copper base plate with Al/SiC, one IGBT supplier “eliminated solder fatigue”, extending guaranteed life from 10 to 30 years. There are an increasing number of new materials with low coefficients of thermal expansion (CTEs) and low densities having thermal conductivities up to 1700 W/m-K. Some are cheaper than traditional materials. Payoffs include: increased reliability; reduced junction temperatures and weight; low-CTE, thermally conductive PCBs, potentially eliminating the need for underfill; CTE matching allows direct attach with hard solders, reducing thermal resistance and solder fatigue. There are a large and increasing number of microelectronic and optoelectronic applications, including: PCBs and PCB cold plates; heat sinks; microprocessor, RF and power modules; heat spreaders and sinks; LED and laser diode modules; thermoelectric coolers; plasma and LCD displays; detectors; and photovoltaics. This presentation covers the large and increasing number of advanced thermal management materials, including properties and the growing array of applications.

Next Generation Embedded Liquid Cooling with Ultra Low Thermal Resistance

Michael M. Ohadi, Ph.D.
Professor of Mechanical Engineering and Director of Advanced Thermal Management Laboratory

CALCE Electronics Systems and Products Center

Department of Mechanical Engineering, University of Maryland

The demand for increased functionality of electronic products and the simultaneous trend of smaller feature size continue to raise dissipated power and the resulting power densities in electronic systems, introducing new challenges and opportunities in thermal management of modern electronics.  Successful next generation thermal management systems will have to mitigate thermal limitations on the operation of high performance electronic systems to satisfy the increasing market demand for faster, smaller, lighter, and more energy efficient and cost effective products. The next generation cooling systems will integrate the thermal management techniques into the chip layout, and/or package design, to provide substantially enhanced cooling performance with ultra-low thermal resistance between chip-level heat generation and system-level heat removal path. This presentation will review most recent progress in embedded micro cooling systems, including use of use of thin film micro channel cooling. The technique involves utilization of 3-D structures and a distributed liquid delivery, with dedicated channels for vapor and liquid to maximize phase change heat transfer while facilitating isothermalization of the surface and minimizing the pressure drops and the associated pumping power requirements. Record-high heat transfer coefficients have been experimentally demonstrated with heat removal capability in excess of 1 kW/cm2 and heat density of 1 kW/cm3.

Technical Presentation (TBD/Exhibitor)

Host Closing Remarks


Presentation times subject to change in the event of unforeseen events. In the event of change, updated schedules will be provided at registration.




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