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Featured

  • Could holey silicon be a breakthrough in electronics cooling

    University of California - Irvine (UCI) scientists have developed holey silicon, a computer chip wafer that has tiny, vertically-etched orifices that channel heat to the desired location and that they believe could be a breakthrough in electronics cooling. details>>
  • Graphene assembled film demonstrates higher thermal conductivity than graphite

    A team of scientists at Chalmers University of Technology (Gothenburg, Sweden) have developed a graphene assembled film that demonstrates 60 percent higher thermal conductivity than graphite film, despite graphite being many layers of graphene. details>>
  • Wide-bandgap materials require innovative thermal management techniques

    A recent article from Advanced Thermal Solutions, Inc. (ATS), a leading-edge thermal engineering and manufacturing company focused on the thermal management of electronics, explores the thermal management techniques required for cooling high-powered devices composed of wide-bandgap materials silicon carbide (SiC) and gallium nitride (GaN). details>>
  • New dynamics revealed for wickless heat pipes in microgravity environments

    Researchers at the Rensselaer Polytechnic Institute (RPI) in Troy, N.Y. are studying wickless heat pipes in near-zero gravity environments on the International Space Station (ISS) as part of the Constrained Vapor Bubble (CVB) project. details>>
  • Study finds that water-repellent surfaces can boil water to cool electronics

    Researchers at Purdue University (West Lafayette, Ind.) have demonstrated that even superhydrophobic materials, which are the most water-repellent surfaces possible, can boil water efficiently under certain conditions and stay cooler than hydrophilic surfaces. details>>
  • Researchers develop cloaking material that hides people from infrared cameras

    Researchers at the University of Wisconsin (Madison, Wisc.) have created an ultra-thin sheet (less than one millimeter thick) that absorbs 94 percent of infrared light, masking warm objects that lie beneath it and making objects invisible to infrared detectors. details>>
  • Researchers observe anisotropic magneto-Peltier effect for the first time

    Researchers from the National Institute for Materials Science (NIMS) and Tohoku University (Japan) have observed the anisotropic magneto-Peltier effect, a thermoelectric conversion phenomenon in which redirection of a charge current in magnetic material induces heating and cooling. details>>
  • Researchers building blueprint for fabricating next-gen 2-D nanomaterials

    Scientists at Northwestern University (Evanston, Ill.) have created a blueprint for fabricating new heterostructures from different 2-D materials, which could lead to the development of building blocks for next-generation computers and electronics with enhanced properties. details>>
  • Researchers develop method for switching heat on and off in electronics

    A team of researchers developed a new technology that breaks the heat flow between a hotter region and a colder region, in effect allowing engineers to turn heat on and off. details>>
  • Improved fabrication methods developed for nano-structures for electronics

    Researchers created a more efficient fabrication process, called inverse metal-assisted chemical etching (I-MacEtch), to produce semiconductors that are more reliable and powerful nanotechnologies for numerous applications. details>>
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