Log In   |   Sign up

New User Registration

Article / Abstract Submission
Register here
Register
Press Release Submission
Register here
Register
coolingZONE Supplier
Register here
Register

Existing User


            Forgot your password
February 2018

Renesas Electronics Unveils Fully Encapsulated Digital Power Modules


renesas electronics corporation, a premier supplier of advanced semiconductor solutions, announced two new fully encapsulated digital dc/dc pmbus power modules that deliver the highest power density and efficiency in their class.

 

the dual isl8274m operates from a 5v or 12v power rail, provides two 30a outputs and up to 95.5% peak efficiency in a compact 18mm x 23mm2 footprint. the new zl9024m operates from a 3.3v rail and outputs 33a of power in a 17mm x19mm2footprint.

 

they deliver point-of-load (pol) conversions for advanced fpgas, dsps, asics and memory used in servers, telecom, datacom, optical networking and storage equipment. both devices are easy-to-use, pmbus-configurable power supplies that include a controller, mosfets, inductor and passives encapsulated inside a module that increases available board space and reduces bill of materials (bom).

 

the isl8274m and zl9024m digital power modules leverage renesas’ patented chargemode™ control architecture, which provides the highest efficiencies with better than 90% on most conversions. the power modules also provide a single clock cycle fast transient response to output current load steps common in fpgas and dsps that process power bursts.

 

their compensation-free design keeps the modules stable regardless of output capacitor changes due to temperature, variation or aging. eliminating the need for an external discrete compensation network also saves board space and additional bom cost. the isl8274m supports input voltages from 4.5v to 14v, while the zl9024m accepts input voltages from 2.75v to 4v. both modules offer adjustable output voltages as low as 0.6v.

 

the encapsulated modules use renesas’ proprietary high-density array (hda) package, which offers unmatched electrical and thermal performance through a single-layer conductive substrate that reduces lead inductance and dissipates heat primarily through the system board.

 

the hda’s copper lead-frame structure allows the modules to operate at full load over a wide temperature range with no airflow or heatsinks. the isl8274m and zl9024m also provide several protection features that ensure safe operations under abnormal operating conditions, further enhancing their robustness and reliability.

 

“the isl8274m and zl9024m expand renesas’ portfolio of encapsulated digital power modules and provides customers the first digital dual 30a power supply and first digital 33a power supply,” said philip chesley, vice president of industrial analog and power business division, renesas electronics corporation. “their power density, high efficiency and fast transient response address our customers demanding single and multi-rail power requirements.”

Choose category and click GO to search for thermal solutions

 
 

Subscribe to Qpedia

a subscription to qpedia monthly thermal magazine from the media partner advanced thermal solutions, inc. (ats)  will give you the most comprehensive and up-to-date source of information about the thermal management of electronics

subscribe

Submit Article

if you have a technical article, and would like it to be published on coolingzone
please send your article in word format to [email protected] or upload it here

Subscribe to coolingZONE

Submit Press Release

if you have a press release and would like it to be published on coolingzone please upload your pr  here

Member Login

Supplier's Directory

Search coolingZONE's Supplier Directory
GO
become a coolingzone supplier

list your company in the coolingzone supplier directory

suppliers log in

Media Partner, Qpedia

qpedia_158_120






Heat Transfer Calculators