In the wake of exploding batteries that plagued Samsung in the fall, mobile phone manufacturers are going out of their way to assure consumers of the safety of their products and that the proper thermal management was implemented to avoid a repeat Samsung’s $5.3 billion product failure.
LG has announced its new phone will use heat pipes to ensure it won't overheat. (Wikimedia Commons)
One of those manufacturers is LG, which will be unveiling its newest LG G6 heading into the Mobile World Congress in Barcelona, Spain. Online rumors indicate that the phone will be unveiled on Feb. 26, which is the day before the event begins and released to the public sometime in March.
According to reports, the phone will have a 5.7-inch Quad HD display, minimal bezels around the screen, an ultra-wide 18:9 aspect ratio, dual lens camera, a removable battery, and will be powered by Qualcomm’s Snapdragon 821 chipset. It is also expected to allow for faster wireless charging.
Most importantly to coolingZONE, there are also new thermal management details that have come out in advance of its release. In a report to The Korea Times, LG announced that it was using copper heat pipes to draw 10 percent more heat away from the processor. Also, the company designed the phone with more space between components to allow for more power dissipation.
The report added that LG was implementing 15 percent higher standards for battery heat exposure than required by U.S. or EU standards and conducting anti-puncture and anti-shock testing.
As a report on MobilenApps.com indicated, LG is not the first company to incorporate heat pipes into its design. LG will be following the lead of Sony’s Xperia Z2 and Microsoft’s Lumia 950 XL.
Samsung released the report of its investigation into the explosions that plagued the Galaxy Note 7 and drew loads of negative publicity for the company this past fall and forced it to recall 2.5 million phones. The report indicated that faulty batteries from two suppliers were to blame and the South Korean manufacturer pledged to have those problems solved before the release of its Galaxy S8.
The announcement from the company indicated that the S8 would be pushed back from its initial unveiling, which was supposed to take place at the Mobile World Congress. Expectations are that the new phone will make its debut sometime in the spring.
According to the Rueters report on the announcement of the investigation findings, the suppliers were Samsung SDI of South Korea and Amperex Technology of China. The company is instituting an eight-point safety check measure to avoid this issue in the future.
Watch the video below to see more about heat pipes being used to cool smartphones: