in early february, coolit systems announced its latest patent application had been approved by the u.s. patent and trademark office to protect the invention of a modular heat transfer solution to cool an array of independent servers for rack-based data center installations.

coolit systems has announced another patent for cooling data center arrays. (wikimedia commons)

the system is composed of a rack, a heat exchanger, component heat exchange modules with distributed pumps, manifold module, and a coolant heat exchange module.

geoff lyon ceo, coolit systems said, “coolit’s commitment to developing and patenting unique solutions provides our customers with the assured competitive advantage they are looking for. the 60 patent milestone adds confirmation to coolit’s leadership in developing innovative liquid cooling solutions for modern data centers.”

as noted by insidehpc.com, this patent comes on the heels of last month’s patent for a “fluid heat exchange system used to cool heat generating components of a computer with a fluid heat exchanger that splits a mass flow of coolant.”

the split-flow invention achieves high level of performance by cooling the server cpus with warm liquid rather than using expensive chillers or energy-sapping air conditioning units.

coolit systems now has more than 60 issued patents, according to the company.