Honeywell recently announced the development of a new thermal interface material (TIM) that could help smartphone manufacturers and designers meet thermal management and heat dissipation requirements for their new products.
Honeywell's newest thermal interface material is intended for smartphones. (Wikimedia Commons)
The new TIM utilizes phase-change materials to transfer thermal energy away from the phone’s chips to a heat sink or spreader, such as a heat pipe or vapor chamber. According to the company website, the phase-change materials are based on polymer systems with “advanced filler technology”.
Phone thermal management has been in the news quite a bit in the past year and Honeywell insists that its new TIM will improve heat transfer and in turn improve performance and reliability of the products.
“Honeywell’s innovative TIM technology provides customers with the ideal solution to optimize their phones’ performances,” said Olivier Biebuyck, vice president and general manager of Honeywell Electronic Materials. “As demand for smartphones grows around the world, these breakthrough designs help provide optimal user experience throughout the entire lifecycle of their devices.”
As the smartphone market continues to expand, with IDC Research predicting more than 1.77 billion units sold by 2020, Honeywell and other companies are positioning themselves to have thermal solutions to meet consumer and manufacturer demand.