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John O | April 2017

Microsoft releases details about high-powered console with vapor chamber

Over the past few weeks, details have been released about the latest iteration of the Xbox One gaming console from Microsoft, Scorpio, which will be the most powerful gaming console by far, according to a report from Tech Crunch.



Project Scorpio will incorporate a vapor chamber array for its thermal management.


The article outlined some of Project Scorpio’s specifications, which were first reported by Digital Foundry, including a processor that can handle six teraflops (six trillion floating point operations per second), which is 4-1/2 times more powerful than a standard Xbox One and 1.4 times as powerful as Sony’s Playstation 4 Pro.


Some of the other details include 40 customized Radeon compute units on a single chip, which will run at 1,172 Mhz. There will also be an eight –core CPU at 2.3 Ghz, 12 GB of RAM and a memory bandwith that has been expanded to 326 GB/s.


As Tech Crunch explained, “Overall, it’s a great update for the Xbox One but not necessarily a gaming revolution. Of course Project Scorpio is less powerful than an expensive gaming PC. But it seems like a good compromise for those who just want a console in their living room.”


For the purposes of coolingZONE, the most important highlight of the new release is that Microsoft is incorporating a unique vapor chamber array that will dissipate heat away from the processors and to the back of the case.


The thermal management was noted by Tech Radar and more fully described by Tweaktwon.com, which stated, “Project Scorpio's vapor chamber cooling is complimented by a blower-style fan--again resembling a reference desktop-grade video card--that pushes heat out through the back of the system. Unlike current Xbox One and Xbox One S consoles, Microsoft's 4K machine doesn't have vents on its top or sides: heat is only expelled through vents on its rear side.”


Digital Foundry reported, “"It turns out efficiency in the Scorpio design isn't just baked in at the silicon level--it's there throughout the entire box. Microsoft has implemented what it's dubbed the Hovis method, named after the guy who came up with the concept.


“The Hovis method means this: every single Scorpio engine processor that comes off the production line has its own power characteristics...because every piece of silicon is ever so slightly different. Rather than apply the usual one-size-fits-all power delivery system, every Scorpio motherboard is balanced with its specific processor. This helps keep heat down and ensures peak efficiency."


More information, such as price and release date, are expected to be announced at the upcoming E3 2017 showcase in Los Angeles in June.


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