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John O | May 2017

Wakefield-Vette offering new thermal interface material line

Wakefield-Vette has joined the line of companies investing in thermal interface materials (TIM) with its recently released line of ulTIMiFlux dielectric phase-change materials that uses a polyamide film as thermally conductive filler between the component and the heat sink.


Wakefield-Vette has released ulTIMiFlux phase-change material.


According to the Wakefield-Vette website, “Through the development of this unique formulation, Wakefield-Vette’s phase change solution offers efficient thermal transfer by phase-changing during normal device operating temperatures while maintaining a uniform bond line thus driving out the air and adjusting for any surface imperfections or flatness conditions that may exist across the interface.”


Wakefield is the latest company to announce a line of gap fillers, including Berquist and others, and is an extension of the thermal management options that the company already offers.


The website added, “A primary advantage of utilizing a phase-change system is the ability to drive out air from within the interface during initial device cycling causing phase change and surface wetting of the thermal compound coating.  The phase-change compound is available in specific die cut patterns for common TO packages and can be placed instantly and immediately ready for component mounting.”


The thixotropic design of the TIM ensures that there is no material running outside of the gap area during normal operation and, according to Wakefield-Vette, the TIM is solvent-free and designed to be drop in place rather than requiring thermal grease or another adhesive.


To get a datasheet, visit http://www.wakefield-vette.com/products/accessories/thermal-interface-material/ultimiflux-dielectric-phase-change-thermal-materia.aspx.

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