Log In   |   Sign up

New User Registration

Article / Abstract Submission
Register here
Register
Press Release Submission
Register here
Register
coolingZONE Supplier
Register here
Register

Existing User


            Forgot your password
John O | September 2017

Polymer film created that can transfer heat from batteries and processors


Scientists from the University of California Los Angeles (UCLA) Henry Samuell School of Engineering and Applied Science and California-based non-profit research organization SRI International have developed a thin, flexible device from an electrocaloric polymer film that can be used to transfer heat from batteries or processors and has a number of potential applications.

 


Because the system is built on a flexible polymer film, it could be adapted for devices with complex curvature or with moving surfaces. (UCLA Engineering)

 

According to a report from UCLA, the device transfers heat from the component, such as a battery or a processor in a mobile device, to a heat sink. Electrical current acts as a switch to alternate contact between the heat source and the heat sink.

 

“It is the first demonstration of a solid-state cooling device based on the electrocaloric effect — a phenomenon in which a material’s temperature changes when an electric field is applied to it,” the report explained.

 

The flexibility of the polymer film, and the device that the researchers made from it, means that it could be used in wearable electronics, personalized cooling systems, mobile devices, computers, and more.

 

The report added, “The UCLA–SRI system also has certain advantages over another advanced type of cooling system, called thermoelectric coolers, which require expensive ceramic materials and whose cooling capabilities don’t yet measure up to vapor compression systems.”

 

Researchers believe that this could also lead to flexible pads for treating injuries or reducing thermal noise in thermographic cameras or night-vision devices.

 

The research was recently published in Science. The abstract read:

 

“Solid-state refrigeration offers potential advantages over traditional cooling systems, but few devices offer high specific cooling power with a high coefficient of performance (COP) and the ability to be applied directly to surfaces.

 

“We developed a cooling device with a high intrinsic thermodynamic efficiency using a flexible electrocaloric (EC) polymer film and an electrostatic actuation mechanism.

 

“Reversible electrostatic forces reduce parasitic power consumption and allow efficient heat transfer through good thermal contacts with the heat source or heat sink. The EC device produced a specific cooling power of 2.8 watts per gram and a COP of 13.

 

“The new cooling device is more efficient and compact than existing surface-conformable solid-state cooling technologies, opening a path to using the technology for a variety of practical applications.”

Choose category and click GO to search for thermal solutions

 
 

Subscribe to Qpedia

A subscription to Qpedia monthly thermal Magazine from the media partner Advanced Thermal Solutions, Inc. (ATS)  will give you the most comprehensive and up-to-date source of information about the thermal management of electronics

Subscribe

Submit Article

If you have a technical article, and would like it to be published on coolingZONE
please send your article in WORD format to articles@coolingzone.com or upload it here

Subscribe to coolingZONE

Submit Press Release

If you have a Press Release and would like it to be published on coolingZONE please upload your PR  here

Member Login

Supplier's Directory

Search coolingZONE's Supplier Directory
GO
Become a coolingZONE Supplier

List your company in the coolingZONE Supplier Directory

Suppliers Log In

Media Partner, Qpedia

qpedia_158_120






Heat Transfer Calculators