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March 2013

Intersil's "DAQ on a Stick" Provides Complete Thermocouple and Strain Gauge Reference Designs Using USB and EFM32 Gecko MCU


MILPITAS, CA--(Marketwire - Feb 22, 2013) -  Intersil Corporation (NASDAQ: ISIL), a leader in the design and manufacture of high-performance analog, mixed-signal and power management semiconductors, will demonstrate new thermocouple and strain gauge designs using a convenient "DAQ on a Stick" at Embedded World 2013.

The "DAQ on a Stick" is a reference design highlighting Intersil's precision products with different microcontrollers. The reference designs are self-contained demonstrations showing a complete signal chain solution using Intersil parts and an Energy Micro EFM32 Leopard Gecko microcontroller. The complete reference designs are housed in a USB stick form factor. This compact design enables the user to power the application through the USB port and monitor the temperature through the GUI interface on a computer.




intersil_daq_usb_500

The solutions feature a variety of Intersil ICs, including the ISL28134 low noise, zero-drift op amp, the ISL26102 24-bit delta sigma converter, and the ISL21010 precision bandgap voltage reference. The Energy Micro EFM32LG332F128 is an extremely energy efficient 32-bit ARM Cortex MCU.

The thermocouple application circuit is calibrated at 25°C to within ± 0.1°C using a Fluke 54II Thermometer. The accuracy of this design is down to ±0.75% (limits of error).

The software and demonstration videos can be downloaded or viewed from the Intersil website (http://www.intersil.com/en/tools/reference-designs/emicro-thermo-reference-design.html) for the thermocouple reference design and (http://www.intersil.com/en/tools/reference-designs/emicro-strain-gauge-reference-design.html) for the strain gauge reference design. The solutions will be provided to customers by Avnet Memec.

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