carteret, nj —tuesday, september 30, 2014—fujipoly introduces a new version of its popular sarcon® spg-15a, form-in-place thermal interface compound. the new sarcon® spg-20b formulation is an easy to dispense, low-viscosity thermally conductive silicone that delivers a thermal conductivity of 2.1 w/m°k and a thermal resistance of only 1.8°c cm2/w. this is roughly a 51% improvement in thermal resistance and a 40% improvement in thermal conductivity compared to spg-15a.

when applied between a heat-generating component and a nearby heat sink or spreader, the very low compression, form-in-place material completely fills all unwanted gaps to improve cooling performance. the form stable thermal compound requires no heat curing, will not cause corrosion on metal surfaces, and maintains all initial properties across a wide temperature range (-40c to + 150c). the unique physical properties of this silicone compound also allow for excellent vibration absorption and have proven to be an effective thermal solution for both current and emerging higher-frequency electronics applications.

about fujipoly america corporation

fujipoly america corporation is a wholly owned subsidiary of fuji polymer industries co., ltd. of japan. an iso9001:2008 registered company, fujipoly america corporation specializes in the fabrication of silicone rubber technology. it is a leader in the areas of elastomeric connectors, thermal interface materials, fusible tapes, and custom silicon rubber extrusions. fuji polymer industries co., ltd., has eight divisions worldwide, located in north america, europe and asia and an international network of distributors and representatives. the company’s north american operations are based in carteret, new jersey. for more information, call (732) 969-0100 or visit us on the web at http://www.fujipoly.com.

fujipoly contact:
frank hobler
fujipoly of america corporation
732-969-0100
[email protected]