march, 2015 - 

thin wafer processing temporary bonding adhesive film for 3d wafer integration

(princeton jct. nj) temporary wafer bonding for thin wafer processing is one of the key technologies for wafer level 3d system integration. ai technology, inc (ait) is proud to be the first known provider of a film format high temperature temporary bonding adhesive for thin wafer processing of bonding device wafer to carrier wafer. leveraging its expertise manufacturing film adhesives for the semiconductor industry over the last 30 plus years, ait offers wafer processing adhesives (wpa) from 5 to 80 micron film adhesives for device wafer processing up to 450mm with and without topography. ait high temperature capable wpa removes easily with laser assisted and solvent assisted release separation de-bonding besides traditional heat-sliding processes.

ai technology, inc. (ait)s temporary bonding wafer processing adhesives (wpa) are thermally stable to 320-330c and the bonded compound wafers are compatible with standard wlp process equipment and for backside processing of 3d-tsv wafers. high integrity in bond strength enables easy back grinding to a thickness of 50m. aits thermally and chemically stable polymers can withstand multiple device wafer processes, such as dry etching, wet etching, cmp, pvd, solvent based spin coating of resists and polymers, lithography, electro plating and extended elevated temperature processing up to 320-330c for at least 60 minutes under high vacuum.

in comparison to traditional wax based and polyimide based temporary handling solutions, ai technology, inc. (ait)s wpa-ts 320 and wpa-tl 330 demonstrate some of the highest temperature capabilities for thin wafer processing as well as easy removal and cleaning.

about

since pioneering the use of flexible epoxy technology for microelectronic packaging in 1985,

ai technology, inc. (ait) has been one of the leading forces in development and patented applications of advanced materials and adhesive solutions for electronic interconnection and packaging. ait offers some of the most reliable adhesives and underfills for die bonding for the largest dies, stack-chip packaging with dicing die-attach film (ddaf), flip-chip bonding and underfilling and high temperature die bonding for single and multiple-chip modules for applications beyond 230c. the company continues to provide the best adhesive solution for component and substrate bonding for both military and commercial applications. aits thermal interface material solutions, including our patented phase-change thermal pads, thermal greases and gels and thermal adhesives have set many bench marks of performance and reliability for power semiconductors, modules, computers and communication electronics.'

contact


online: http://www.aitechnology.com/

for an application analysis: http://www.aitechnology.com/analysis/

70 washington rd.

princeton jct. nj 08550

f: (609) 799 – 9388
p: (609) 799 - 9308

[email protected]