please see video at the end of the article.

april, 2015 - indium corporation will feature its reinforced indium and solder alloy fabrications, informs^®, at pcim europe, may 19-21 in nuremberg, germany.

informs are patented fabrications in which braided, woven, or random-fiber metal substrate materials are embedded into a solder preform. this technology is ideally suited for igbt assembly of the dbc to the baseplate.

informs create solder joints with a precisely controlled final solder joint thickness. the embedded metal does not melt during the reflow process and maintains a precise bondline thickness in the final solder joint. informs maintain the highest thermal and electrical conductivity as compared to typical soldered interconnections, and, by controlling the bondline thickness, the thermal performance is also more repeatable from device-to-device. 

informs provide engineers with an enhanced material for the development of new, or the improvement of existing, applications. for more information about informs, visit www.indium.com/thermal-interface-materials or visit indium corporation at stand 7-441.



for press release go to: http://www.indium.com/people/marketing-communications/news-releases/indium-features-informs-pcim#ixzz3wxobujjb

about

indium corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin film, and thermal management markets. products include solders, preforms, and fluxes; sputtering targets; indium, gallium, and germanium metals and compounds and sourcing; and nanofoil^®.

founded in 1934, indium has global technical support and factories located in china, singapore, south korea, the united kingdom, and the usa.

contact

utica, chicago, clinton
e-mail: [email protected]
phone: +1 315 853 4900