june, 2015 - tim-1 solutions are a class of high-purity, thermal interface materials that are applied between the chip surface and a heat spreader to help dissipate damaging heat to the exterior of a semiconductor package. however, as applications from data centers to consumer devices to automotive electronics all demand higher functioning integrated semiconductor devices with increasing processing power, the temperatures within chip packages are rapidly increasing and testing the limits of conventional tim-1 solutions.

“a long-time member of ibm’s ecosystem, dow corning brought decades of expertise in advanced silicone technology to help formulate this break-through tim-1 material for high-end chip packaging,” said andrew ho, global market segment leader, semiconductor packaging materials at dow corning. “it is only the latest innovation on the ambitious roadmap of thermal management solutions that dow corning has planned for this rapidly evolving global market.”

the successful efforts of ibm and dow corning scientists have raised the bar for tim-1 performance. dow corning tc-3040 thermally conductive gel delivers nearly two times the thermal performance of other industry standard tims, as well as high thermal conductivity targeting 4w/mk with robust reliability. as a result, it offers chip-makers broader design options for high-performing yet more reliable ics with improved thermal management.”

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established in 1943 specifically to explore and develop the potential of silicones, dow corning is a global leader in silicon-based technology and innovation. we are passionate about silicon technology’s versatility, its possibilities and its unique potential to help solve some of the most important challenges facing our world.

through our dow corning and xiameter brands, we provide performance-enhancing products and solutions to meet the needs of customers in virtually every major industry and to improve the daily lives of nearly a billion of the world’s people. more than half of our annual sales are outside the united states.

dow corning corporation is equally owned by the dow chemical company and corning, incorporated. dow corning also is the majority shareholder in hemlock semiconductor group, which is comprised of several joint venture companies. hemlock semiconductor is a leading provider of polycrystalline silicon and other silicon-based products used in the manufacturing of semiconductor devices and solar cells and modules.

for details, read dow corning fast facts (pdf).