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December 2016

Fujipoly releases a new line of thermal interface materials


fujipoly introduces a new line of sarcon gar high-performance, glass fabric reinforced thermal interface materials.


gar is a great choice for complex die-cut shapes and exerts a low force as it fills unwanted air gaps between the heatsink and heat source.


tim benefits:

·  thermal resistance as low as: 0.17 °cin2/w

·  thermal conductivity: 3.0 w/m°k

·  operating temperature: -40°c to +150°c

·  thickness: 0.20, .30, .45mm

·  form: sheet, roll, die-cut shapes 

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