panasonic automotive and industrial systems europe has launched a highly-compressible thermal interface material (tim) to reduce contact thermal resistance between rough surfaces in extremely thin spaces. soft-pgs enhances the thermal coupling between heat producing devices (heat sources) and heat dissipation devices (heat sinks).

tim is a key component in the majority of power electronic systems. heat generated by semiconductors, has to be transferred to a heat sink and ultimately dissipated. soft-pgs is a 200µm thick graphite sheet designed for use as a thermal interface material for igbt modules. as it can be compressed by 40% it is an excellent solution for dramatically reducing thermal resistance between a heat sink and an igbt module.

the 200µm thick sheet is easy to install, and has far lower labour and installation costs than thermal grease or phase change material. it guarantees thermo stability of up to 400c and high reliability against intense heat cycles (-55c to +150c).

its thermal conductivity is guaranteed at 400w/mk for x-y direction and at 30w/mk in z direction. panasonic offers a wide range of standard sheets for different igbt modules from various suppliers.

simone saile, product manager, thermal solutions and ceramic devices at panasonic commented, “reducing the volume of the heat sink combined with increased local power densities leads to greater demands on the thermal interface connecting power electronic components to the heat sink. a paste-like tim-layer below a module is never of homogenous thickness and additionally, most paste-like thermal solutions also degrade and age over time. compared to thermal grease and pcm, soft-pgs fits uneven surfaces far better as well as offering superior workability, reliability and thermo stability.”