te connectivity (te), a world leader in connectivity and sensors, announced its new standard portfolio of board level shielding (bls), providing customers with shorter time to market, weight savings, and improved thermal conductivity.

in addition to te's custom-designed bls solutions, these bls products are ideal for 2-in-1 notebooks, game consoles, routers, point of sale (pos) equipment, wireless meters, wearable devices, internet of things (iot) devices, servers, and other applications where weight, thermal performance, and electromagnetic shielding are crucial.

along with standard cold-rolled steel (crs) material, te's new bls portfolio includes aluminum material options, which are one-third the weight of steel. aluminum offers extreme weight savings while still offering similar emi suppression capabilities.

aluminum options also provide up to five times better thermal conductivity than crs material to help keep a device or system's shielded components running cooler.

"designers need to shield electronic components such as wireless chipsets, processors and memory within their systems to minimize electrical interference. however, having to order custom shielding solutions can be inefficient and prolongs time to market," said eric powell, director of product management at te connectivity's data and devices business unit.

"by delivering a standard portfolio with a wide range of bls products, we can speed time to market and improve design efficiency for our customers."

standard bls products from te's new portfolio are available immediately.