Log In   |   Sign up

New User Registration

Article / Abstract Submission
Register here
Register
Press Release Submission
Register here
Register
coolingZONE Supplier
Register here
Register

Existing User


            Forgot your password
August 2017

Easy to Apply Form-in-Place Thermal Gap Filler from Fujipoly


SARCON SPG-20A from Fujipoly is an easy to dispense, low-viscosity silicone compound that exhibits a thermal conductivity of 2.0 W/m°K and a thermal resistance of only 2.1°K•cm2/W.

 

When applied between heat-generating components and a nearby heat sink or spreader, the form stable thermal material completely fills unwanted gaps as small as 0.08mm. This allows for more efficient transfer and dissipation of heat from the component and improved performance.

 

Due to its superior handling properties, SPG-20A is an excellent alternative to thermal grease.

 

The form-in-place silicone material requires no heat curing, will not cause corrosion on metal surfaces, and maintains all initial properties across a wide temperature range (-40C to + 150C).

Choose category and click GO to search for thermal solutions

 
 

Subscribe to Qpedia

A subscription to Qpedia monthly thermal Magazine from the media partner Advanced Thermal Solutions, Inc. (ATS)  will give you the most comprehensive and up-to-date source of information about the thermal management of electronics

Subscribe

Submit Article

If you have a technical article, and would like it to be published on coolingZONE
please send your article in WORD format to articles@coolingzone.com or upload it here

Subscribe to coolingZONE

Submit Press Release

If you have a Press Release and would like it to be published on coolingZONE please upload your PR  here

Member Login

Supplier's Directory

Search coolingZONE's Supplier Directory
GO
Become a coolingZONE Supplier

List your company in the coolingZONE Supplier Directory

Suppliers Log In

Media Partner, Qpedia

qpedia_158_120






Heat Transfer Calculators