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Library
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Multilayer circuitry on metal substrates
- goran matijasevic, ormet corporation, discusses explains how multi-layer circuitry on metal substrates is used for thermal management of electronics. Read more »Disk drive reliability and thermal management
- shams jawaid, quantum corporation, explains how thermal management preserves reliability in disk drives. Read more »Why the traditional reliability prediction models do not work - is there an alternative?
- michael pecht, calce electronic packaging research center, university of maryland, presents a historical overview of reliability predictions for electronics. Read more »Single-sample uncertainty analysis
- robert j. moffat, professor of mechanical engineering (emeritus), stanford university, explores single-sample uncertainty analysis and the mathematics used to determine those calculations. Read more »Thermal resistance: an oxymoron?
- clemens lasance, philips research laboratories, argues that thermal resistance is an oxymoron if the differences between thermal and electrical resistance are not understood. Read more »Thermal resistance of interface materials as a function of pressure
- carol a. latham, thermagon inc., explains that the thermal resistance of thermal interface materials is partially dependent on pressure. Read more »Thermal conductivity of printed wiring boards
- j.e. graebner, at&t bell laboratories, explores the thermal conductivity of printed wiring boards. Read more »The thermal conductivity of silicon
- the thermal conductivity of silicon varies widely in papers and handbooks and is partially dependent on the temperature of the material. Read more »The thermal conductivity of gases
- thermal interface under a plastic quad flat pack by m. okcay, smiths industries-aerospace. Read more »The thermal conductivity of ceramics
- clemens j.m. lasance, philips research laboratories, explores the thermal conductivity of ceramics. Read more »The thermal conductivity of aluminum oxide
- clemens j.m. lasance, philips research laboratories, describes the thermal conductivity of aluminum oxide. Read more »The need for a change in thermal design philosophy
- clemens j. m. lasance, philips research, argues that there is a need to change the philosophy of thermal design. Read more »The history of power dissipation
- kaveh azar, phd - lucent technologies delivers a history of power dissipation and a look at the development of moore's law. Read more »The coefficient of thermal expansion - Part 1
- clemens j. m. lasance, associate editor, philips research laboratories, explains the importance of the coefficient of thermal expansion. Read more »Temperature of in-line array of electronic components simulated by rectangular blocks
- majid molki, ph.d.and mohammad fraghri, ph.d. describe how the adiabatic heat transfer coefficient can be used to predict the temperature of components in a simulation of an in-line array of rectangular blocks. Read more »Radial nozzles
- maurice marongiu, mjm consulting services, explains how radial nozzles have increased the efficiency of jet impingement cooling. Read more »How Thermal Conductivity Relates to Electrical Conductivity
- clemens j.m. lasance, philips research laboratories, explains the connection between electrical and thermal conductivity. Read more »High performance thermal management materials
- carl zweben, composites consultant, explores advanced materials that are being used in thermal management solutions. Read more »Heat pipe fundamentals
- john. e. graebner, bell labs, lucent technologies, shares the fundamentals of heat pipe design and thermal properties. Read more »Evaluation of different heat transfer coefficient definitions
- kaveh azar, at&t bell laboratories and robert moffat, stanford university, evaluate different definitions of heat transfer coefficients. Read more »Status Report on EU project DELPHI
- harvey rosten, flomerics limited, gives an update on delphi, the european union funded project for the creation and validation of thermal models on electronic parts. Read more »Computer-related thermal packaging at the millenial divide
- avram bar-cohen, phd, university of minnesota, explains that developments in electronic packaging will need to be made to reach the full potential of seimconductors. Read more »The Coefficient of thermal expansion - Part 2
- clemens j m lasance, associate editor, expands the discussion of the coefficient of thermal expansion to materials important to electronic parts. Read more »Topics and Articles in Electronics Cooling
- Data Center
- State of the Art in Data Center Thermal Management
- State of The Art In Data Center Thermal Management – 2013
- State of The Art In Data Center Thermal Management– 2011-2012
- State of The Art In Data Center Thermal Management– 2010-2011
- State of The Art In Data Center Thermal Management– 2009-2010
- State of The Art In Data Center Thermal Management– 2008-2009
- State of The Art In Data Center Thermal Management– 2007-2008
- State of The Art In Data Center Thermal Management– 2006-2007
- State of The Art In Data Center Thermal Management– 2005-2006
- State of The Art In Data Center Thermal Management– 2004-2005
- State of The Art In Data Center Thermal Management– 2003-2004
- State of The Art In Data Center Thermal Management– 2002-2003
- Air Flow Simulation In Data Centers
- Air Flow Simulation In Data Center– 2013
- Air Flow Simulation In Data Center– – 2011-2012
- Air Flow Simulation In Data Center– 2010-2011
- Air Flow Simulation In Data Center– 2009-2010
- Air Flow Simulation In Data Center– 2008-2009
- Air Flow Simulation In Data Center– 2007-2008
- Air Flow Simulation In Data Center– 2006-2007
- Air Flow Simulation In Data Center– 2005-2006
- Air Flow Simulation In Data Center– 2004-2005
- Air Flow Simulation In Data Center– 2003-2004
- Air Flow Simulation In Data Center– 2002-2003
- Air Flow Measurement in Data Centers
- Air Flow Measurement in Data Centers– 2013
- Air Flow Measurement in Data Centers– 2011-2012
- Air Flow Measurement in Data Centers – 2010-2011
- Air Flow Measurement in Data Centers – 2008-2009
- Air Flow Measurement in Data Centers– 2007-2008
- Air Flow Measurement in Data Centers– 2006-2007
- Air Flow Measurement in Data Centers– 2005-2006
- Air Flow Measurement in Data Centers– 2004-2005
- Liquid Cooling For Data Center Thermal Management
- Use of Liquid Cooling for Data Center Thermal Management– 2013
- Use of Liquid Cooling for Data Center Thermal Management– 2011-2012
- Use of Liquid Cooling for Data Center Thermal Management– 2010-2011
- Use of Liquid Cooling for Data Center Thermal Management– 2009-2010
- Use of Liquid Cooling for Data Center Thermal Management– 2008-2009
- Use of Liquid Cooling for Data Center Thermal Management– 2007-2008
- Use of Liquid Cooling for Data Center Thermal Management– 2006-2007
- Use of Liquid Cooling for Data Center Thermal Management– 2005-2006
- Use of Liquid Cooling for Data Center Thermal Management– 2004-2005
- Use of Liquid Cooling for Data Center Thermal Management– 2003-2004
- Use of Liquid Cooling for Data Center Thermal Management– 2002-2003
- State of the Art in Data Center Thermal Management
- Fan - Air Mover
- Role of Fans in Electronics Cooling
- use of fans in electronics cooling– 2013
- use of fans in electronics cooling– 2011-2012
- use of fans in electronics cooling– 2010-2011
- use of fans in electronics cooling– 2008-2009
- use of fans in electronics cooling– 2007-2008
- use of fans in electronics cooling– 2006-2007
- use of fans in electronics cooling– 2005-2006
- use of fans in electronics cooling– 2004-2005
- use of fans in electronics cooling– 2003-2004
- Fan Characterization
- Fan Reliability
- Fan Selection
- Role of Fans in Electronics Cooling
- Graphene
- Heat Sink
- Heat Sink Design
- "heat sink design"– 2013
- "heat sink design"– 2011-2012
- "heat sink design"– 2010-2011
- "heat sink design"– 2009-2010
- "heat sink design"– 2008-2009
- "heat sink design"– 2007-2008
- "heat sink design"– 2006-2007
- "heat sink design"– 2005-2006
- "heat sink design"– 2004-2005
- "heat sink design"– 2003-2004
- "heat sink design"– 2002-2003
- Heat Sink Optimization
- "Heat Sink Optimization"– 2013
- "Heat Sink Optimization"– 2011-2012
- "Heat Sink Optimization"– 2010-2011
- "Heat Sink Optimization"– 2009-2010
- "Heat Sink Optimization"– 2008-2009
- "Heat Sink Optimization"– 2007-2008
- "Heat Sink Optimization"– 2006-2007
- "Heat Sink Optimization"– 2005-2006
- "Heat Sink Optimization"– 2004-2005
- "Heat Sink Optimization"– 2003-2004
- "Heat Sink Optimization"– 2002-2003
- Role of Heat Sink Material In Its Thermal Performance
- "Heat Sink Material"– 2013
- "Heat Sink Material"– 2011-2012
- "Heat Sink Material"– 2010-2011
- "Heat Sink Material"– 2009-2010
- "Heat Sink Material"– 2008-2009
- "Heat Sink Material"– 2007-2008
- "Heat Sink Material"– 2006-2007
- "Heat Sink Material"– 2005-2006
- "Heat Sink Material"– 2004-2005
- "Heat Sink Material"– 2003-2004
- "Heat Sink Material"– 2002-2003
- Heat Sink Design
- Jet Impingement
- Single Jet
- Array of Jets
- Liquid Cooling
- Thermal Chracterization of Cold Plates
- Thermal Characterization of cold plates– 2013
- Thermal Characterization of cold plates– 2011-2012
- Thermal Characterization of cold plates– 2010-2011
- Thermal Characterization of cold plates– 2009-2010
- Thermal Characterization of cold plates– 2008-2009
- Thermal Characterization of cold plates– 2007-2008
- Thermal Characterization of cold plates– 2006-2007
- Thermal Characterization of cold plates– 2005-2006
- Thermal Characterization of cold plates– 2004-2005
- Thermal Characterization of cold plates– 2003-2004
- Thermal Characterization of cold plates– 2002-2003
- Thermal Design of Cold Plate
- Thermal Design of Cold Plate– 2013
- Thermal Design of Cold Plate– 2011-2012
- Thermal Design of Cold Plate– 2010-2011
- Thermal Design of Cold Plate– 2009-2010
- Thermal Design of Cold Plate– 2008-2009
- Thermal Design of Cold Plate– 2007-2008
- Thermal Design of Cold Plate– 2006-2007
- Thermal Design of Cold Plate– 2005-2006
- Thermal Design of Cold Plate– 2004-2005
- Thermal Design of Cold Plate– 2003-2004
- Thermal Design of Cold Plate– 2002-2003
- Role of Cold Plate Material In Its Thermal Performance
- Cold Plate Cooling
- Selection Of Coolant For Liquid Cooling
- selection of a coolant for liquid cooling with cold plate– 2013
- selection of a coolant for liquid cooling with cold plate– 2011-2012
- selection of a coolant for liquid cooling with cold plate– 2010-2011
- selection of a coolant for liquid cooling with cold plate– 2009-2010
- selection of a coolant for liquid cooling with cold plate– 2008-2009
- selection of a coolant for liquid cooling with cold plate– 2007-2008
- selection of a coolant for liquid cooling with cold plate– 2006-2007
- selection of a coolant for liquid cooling with cold plate– 2005-2006
- selection of a coolant for liquid cooling with cold plate– 2004-2005
- selection of a coolant for liquid cooling with cold plate– 2003-2004
- selection of a coolant for liquid cooling with cold plate– 2002-2003
- Thermal Chracterization of Cold Plates
- Microchannels - Their Role In Electronics Cooling
- Microchannels In Electronics Cooling
- microchannel in electronics cooling– 2013
- microchannel in electronics cooling– 2011-2012
- microchannel in electronics cooling– 2010-2011
- microchannel in electronics cooling– 2009-2010
- microchannel in electronics cooling– 2008-2009
- microchannel in electronics cooling– 2007-2008
- microchannel in electronics cooling– 2006-2007
- microchannel in electronics cooling– 2005-2006
- microchannel in electronics cooling– 2004-2005
- microchannel in electronics cooling– 2003-2004
- microchannel in electronics cooling– 2002-2003
- Manufacturing of Microchannel
- manufacturing of microchannel – 2013
- manufacturing of microchannel – 2011-2012
- manufacturing of microchannel – 2010-2011
- manufacturing of microchannel – 2009-2010
- manufacturing of microchannel – 2008-2009
- manufacturing of microchannel – 2007-2008
- manufacturing of microchannel – 2006-2007
- manufacturing of microchannel – 2005-2006
- manufacturing of microchannel – 2004-2005
- manufacturing of microchannel – 2003-2004
- manufacturing of microchannel – 2002-2003
- Heat Transfer Coefficient
- heat transfer coefficient for microchannel– 2013
- heat transfer coefficient for microchannel– 2011-2012
- heat transfer coefficient for microchannel– 2010-2011
- heat transfer coefficient for microchannel– 2009-2010
- heat transfer coefficient for microchannel– 2008-2009
- heat transfer coefficient for microchannel– 2007-2008
- heat transfer coefficient for microchannel– 2006-2007
- heat transfer coefficient for microchannel– 2005-2006
- heat transfer coefficient for microchannel– 2004-2005
- heat transfer coefficient for microchannel– 2003-2004
- heat transfer coefficient for microchannel– 2002-2003
- Pressure Drop Simulation and Estimation
- pressure drop in microchannel– 2013
- pressure drop in microchannel– 2011-2012
- pressure drop in microchannel– 2010-2011
- pressure drop in microchannel– 2009-2010
- pressure drop in microchannel– 2008-2009
- pressure drop in microchannel– 2007-2008
- pressure drop in microchannel– 2006-2007
- pressure drop in microchannel– 2005-2006
- pressure drop in microchannel– 2004-2005
- pressure drop in microchannel– 2003-2004
- pressure drop in microchannel– 2002-2003
- Design of Microchannels for Electronics Cooling
- designing microchannels for electronics cooling– 2013
- designing microchannels for electronics cooling– 2011-2012
- designing microchannels for electronics cooling– 2010-2011
- designing microchannels for electronics cooling– 2009-2010
- designing microchannels for electronics cooling– 2008-2009
- designing microchannels for electronics cooling– 2007-2008
- designing microchannels for electronics cooling– 2006-2007
- designing microchannels for electronics cooling– 2005-2006
- designing microchannels for electronics cooling– 2004-2005
- designing microchannels for electronics cooling– 2003-2004
- designing microchannels for electronics cooling– 2002-2003
- Microchannels In Electronics Cooling
- Refrigeration
- Use of Refrigeration In Electronics Cooling
- "refrigeration" and "electronics cooling"– 2013
- "refrigeration" and "electronics cooling"– 2011-2012
- "refrigeration" and "electronics cooling"– 2010-2011
- "refrigeration" and "electronics cooling"– 2009-2010
- "refrigeration" and "electronics cooling"– 2008-2009
- "refrigeration" and "electronics cooling"– 2007-2008
- "refrigeration" and "electronics cooling"– 2006-2007
- "refrigeration" and "electronics cooling"– 2005-2006
- "refrigeration" and "electronics cooling"– 2004-2005
- "refrigeration" and "electronics cooling"– 2003-2004
- "refrigeration" and "electronics cooling"– 2002-2003
- Use of Refrigeration In Electronics Cooling
- Thermal Interface Materials (TIM)
- TIM Thermal Characterization
- Thermal characterization of interface materials– 2013
- Thermal characterization of interface materials– 2011-2012
- Thermal characterization of interface materials– 2010-2011
- Thermal characterization of interface materials– 2009-2010
- Thermal characterization of interface materials– 2008-2009
- Thermal characterization of interface materials– 2007-2008
- Thermal characterization of interface materials– 2006-2007
- Thermal characterization of interface materials– 2005-2006
- Thermal characterization of interface materials– 2004-2005
- Thermal characterization of interface materials– 2003-2004
- Thermal characterization of interface materials– 2002-2003
- Thermal characterization of interface materials– 2013
- Thermal characterization of interface materials– 2011-2012
- Thermal characterization of interface materials– 2010-2011
- Thermal characterization of interface materials– 2009-2010
- Thermal characterization of interface materials– 2008-2009
- Thermal characterization of interface materials– 2007-2008
- Thermal characterization of interface materials– 2006-2007
- Thermal characterization of interface materials– 2005-2006
- Thermal characterization of interface materials– 2004-2005
- Thermal characterization of interface materials– 2003-2004
- Thermal characterization of interface materials– 2002-2003
- TIM Reliability
- thermal interface material reliability– 2013
- thermal interface material reliability– 2011-2012
- thermal interface material reliability– 2010-2011
- thermal interface material reliability– 2009-2010
- thermal interface material reliability– 2008-2009
- thermal interface material reliability– 2007-2008
- thermal interface material reliability– 2006-2007
- thermal interface material reliability– 2005-2006
- thermal interface material reliability– 2004-2005
- thermal interface material reliability– 2003-2004
- thermal interface material reliability– 2002-2003
- TIM - Phase Change
- "phase change thermal interface material"– 2011-2012
- "phase change thermal interface material"– 2010-2011
- "phase change thermal interface material"– 2009-2010
- "phase change thermal interface material"– 2008-2009
- "phase change thermal interface material"– 2007-2008
- "phase change thermal interface material"– 2006-2007
- "phase change thermal interface material"– 2005-2006
- "phase change thermal interface material"– 2013
- TIM Thermal Characterization