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Heat Transfer Calculators

Library

coolingZONE Library – where engineers and researchers go to see the latest and archived developments in thermal management.


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Library  »  PAPERS  »  Theoretical/General

Multilayer circuitry on metal substrates

 - Goran Matijasevic, Ormet Corporation, discusses explains how multi-layer circuitry on metal substrates is used for thermal management of electronics. Read more »

Disk drive reliability and thermal management

 - Shams Jawaid, Quantum Corporation, explains how thermal management preserves reliability in disk drives. Read more »

Why the traditional reliability prediction models do not work - is there an alternative?

 - Michael Pecht, CALCE Electronic Packaging Research Center, University of Maryland, presents a historical overview of reliability predictions for electronics. Read more »

Single-sample uncertainty analysis

 - Robert J. Moffat, Professor of Mechanical Engineering (Emeritus), Stanford University, explores single-sample uncertainty analysis and the mathematics used to determine those calculations. Read more »

Thermal resistance: an oxymoron?

 - Clemens Lasance, Philips Research Laboratories, argues that thermal resistance is an oxymoron if the differences between thermal and electrical resistance are not understood. Read more »

Thermal resistance of interface materials as a function of pressure

 - Carol A. Latham, Thermagon Inc., explains that the thermal resistance of thermal interface materials is partially dependent on pressure. Read more »

Thermal conductivity of printed wiring boards

 - J.E. Graebner, AT&T Bell Laboratories, explores the thermal conductivity of printed wiring boards. Read more »

The thermal conductivity of silicon

 - The thermal conductivity of silicon varies widely in papers and handbooks and is partially dependent on the temperature of the material. Read more »

The thermal conductivity of gases

 - Thermal interface under a plastic quad flat pack by M. Okcay, Smiths Industries-Aerospace. Read more »

The thermal conductivity of ceramics

 - Clemens J.M. Lasance, Philips Research Laboratories, explores the thermal conductivity of ceramics. Read more »

The thermal conductivity of aluminum oxide

 - Clemens J.M. Lasance, Philips Research Laboratories, describes the thermal conductivity of aluminum oxide. Read more »

The need for a change in thermal design philosophy

 - Clemens J. M. Lasance, Philips Research, argues that there is a need to change the philosophy of thermal design. Read more »

The history of power dissipation

 - Kaveh Azar, PhD - Lucent Technologies delivers a history of power dissipation and a look at the development of Moore's Law. Read more »

The coefficient of thermal expansion - Part 1

 - Clemens J. M. Lasance, Associate Editor, Philips Research Laboratories, explains the importance of the coefficient of thermal expansion. Read more »

Temperature of in-line array of electronic components simulated by rectangular blocks

 - Majid Molki, Ph.D.and Mohammad Fraghri, Ph.D. describe how the adiabatic heat transfer coefficient can be used to predict the temperature of components in a simulation of an in-line array of rectangular blocks. Read more »

Radial nozzles

 - Maurice Marongiu, MJM Consulting Services, explains how radial nozzles have increased the efficiency of jet impingement cooling. Read more »

How Thermal Conductivity Relates to Electrical Conductivity

 - Clemens J.M. Lasance, Philips Research Laboratories, explains the connection between electrical and thermal conductivity. Read more »

High performance thermal management materials

 - Carl Zweben, Composites Consultant, explores advanced materials that are being used in thermal management solutions. Read more »

Heat pipe fundamentals

 - John. E. Graebner, Bell Labs, Lucent Technologies, shares the fundamentals of heat pipe design and thermal properties. Read more »

Evaluation of different heat transfer coefficient definitions

 - Kaveh Azar, AT&T Bell Laboratories and Robert Moffat, Stanford University, evaluate different definitions of heat transfer coefficients. Read more »

Status Report on EU project DELPHI

 - Harvey Rosten, Flomerics Limited, gives an update on DELPHI, the European Union funded project for the creation and validation of thermal models on electronic parts. Read more »

Computer-related thermal packaging at the millenial divide

 - Avram Bar-Cohen, PhD, University of Minnesota, explains that developments in electronic packaging will need to be made to reach the full potential of seimconductors. Read more »

The Coefficient of thermal expansion - Part 2

 - Clemens J M Lasance, Associate Editor, expands the discussion of the coefficient of thermal expansion to materials important to electronic parts. Read more »

Topics and Articles in Electronics Cooling