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Library  »  Application Notes  »  Sarang Shidore

Package Substrates

 - An article by Mr. Sarang Shidore of Flomerics, Inc. on thermal analysis and design of IC packages Read more »

Detailed Modeling - The Lead Frame

 - An article by Mr. Sarang Shidore of Flomerics, Inc. on thermal analysis and design of IC packages Read more »

Detailed Modeling - The Die

 - An article by Mr. Sarang Shidore of Flomerics, Inc. on thermal analysis and design of IC packages Read more »

Building a Good Detailed Model

 - An article by Mr. Sarang Shidore of Flomerics, Inc. on thermal analysis and design of IC packages Read more »

Applications of Two Resistor Models

 - An article by Mr. Sarang Shidore of Flomerics, Inc. on thermal analysis and design of IC packages Read more »

Two Resistor Models

 - An article by Mr. Sarang Shidore of Flomerics, Inc. on thermal analysis and design of IC packages Read more »

DELPHI Compact Models Revolutionize Thermal Design

 - An article by Sarang Shidore and Dr. Akbar Sahrapour, Flomerics Inc. Read more »

Two New Friends, Theta-JB and Psi-JB

 - An article by Mr. Sarang Shidore of Flomerics, Inc. on thermal analysis and design of IC packages Read more »

Our Old Friend Theta-JA

 - This is the second part of a series of articles focusing on the thermal analysis of electronic components written by Mr. Sarang Shidore of Flomerics. Read more »

Thermal Analysis of IC Packages

 - The introductory article in a series of articles on this important topic written by Sarang Shidore, a well-known expert in the thermal analysis of electronic components Read more »

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Topics and Articles in Electronics Cooling