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Library
coolingZONE Library – where engineers and researchers go to see the latest and archived developments in thermal management.
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Understanding the concept of Thermal Resistance
- this article will explain the concept of thermal resistance and how to calculate it in electronics cooling applications. Read more »First Law of Thermodynamics
- the first law of thermodynamics is basically the principle of conservation of energy. it says that energy will not vanish into nothing or arise out of nothing. Read more »Calculating Windchill Factor in Fahrenheit
- the windchill factor is due to the forced convection heat transfer since the heat transfer coefficient increases with increasing air velocity. Read more »Visiting Bernoulli's Equation
- bernoulli's equation is one of the most famous equations of fluid mechanics and defines the relationship between pressure and fluid velocity. Read more »Dimensionless Numbers in Heat Transfer
- explanation and analysis of dimensionless numbers in heat transfer and their significance in thermal management. Read more »Topics and Articles in Electronics Cooling
- Data Center
- State of the Art in Data Center Thermal Management
- State of The Art In Data Center Thermal Management – 2013
- State of The Art In Data Center Thermal Management– 2011-2012
- State of The Art In Data Center Thermal Management– 2010-2011
- State of The Art In Data Center Thermal Management– 2009-2010
- State of The Art In Data Center Thermal Management– 2008-2009
- State of The Art In Data Center Thermal Management– 2007-2008
- State of The Art In Data Center Thermal Management– 2006-2007
- State of The Art In Data Center Thermal Management– 2005-2006
- State of The Art In Data Center Thermal Management– 2004-2005
- State of The Art In Data Center Thermal Management– 2003-2004
- State of The Art In Data Center Thermal Management– 2002-2003
- Air Flow Simulation In Data Centers
- Air Flow Simulation In Data Center– 2013
- Air Flow Simulation In Data Center– – 2011-2012
- Air Flow Simulation In Data Center– 2010-2011
- Air Flow Simulation In Data Center– 2009-2010
- Air Flow Simulation In Data Center– 2008-2009
- Air Flow Simulation In Data Center– 2007-2008
- Air Flow Simulation In Data Center– 2006-2007
- Air Flow Simulation In Data Center– 2005-2006
- Air Flow Simulation In Data Center– 2004-2005
- Air Flow Simulation In Data Center– 2003-2004
- Air Flow Simulation In Data Center– 2002-2003
- Air Flow Measurement in Data Centers
- Air Flow Measurement in Data Centers– 2013
- Air Flow Measurement in Data Centers– 2011-2012
- Air Flow Measurement in Data Centers – 2010-2011
- Air Flow Measurement in Data Centers – 2008-2009
- Air Flow Measurement in Data Centers– 2007-2008
- Air Flow Measurement in Data Centers– 2006-2007
- Air Flow Measurement in Data Centers– 2005-2006
- Air Flow Measurement in Data Centers– 2004-2005
- Liquid Cooling For Data Center Thermal Management
- Use of Liquid Cooling for Data Center Thermal Management– 2013
- Use of Liquid Cooling for Data Center Thermal Management– 2011-2012
- Use of Liquid Cooling for Data Center Thermal Management– 2010-2011
- Use of Liquid Cooling for Data Center Thermal Management– 2009-2010
- Use of Liquid Cooling for Data Center Thermal Management– 2008-2009
- Use of Liquid Cooling for Data Center Thermal Management– 2007-2008
- Use of Liquid Cooling for Data Center Thermal Management– 2006-2007
- Use of Liquid Cooling for Data Center Thermal Management– 2005-2006
- Use of Liquid Cooling for Data Center Thermal Management– 2004-2005
- Use of Liquid Cooling for Data Center Thermal Management– 2003-2004
- Use of Liquid Cooling for Data Center Thermal Management– 2002-2003
- State of the Art in Data Center Thermal Management
- Fan - Air Mover
- Role of Fans in Electronics Cooling
- use of fans in electronics cooling– 2013
- use of fans in electronics cooling– 2011-2012
- use of fans in electronics cooling– 2010-2011
- use of fans in electronics cooling– 2008-2009
- use of fans in electronics cooling– 2007-2008
- use of fans in electronics cooling– 2006-2007
- use of fans in electronics cooling– 2005-2006
- use of fans in electronics cooling– 2004-2005
- use of fans in electronics cooling– 2003-2004
- Fan Characterization
- Fan Reliability
- Fan Selection
- Role of Fans in Electronics Cooling
- Graphene
- Heat Sink
- Heat Sink Design
- "heat sink design"– 2013
- "heat sink design"– 2011-2012
- "heat sink design"– 2010-2011
- "heat sink design"– 2009-2010
- "heat sink design"– 2008-2009
- "heat sink design"– 2007-2008
- "heat sink design"– 2006-2007
- "heat sink design"– 2005-2006
- "heat sink design"– 2004-2005
- "heat sink design"– 2003-2004
- "heat sink design"– 2002-2003
- Heat Sink Optimization
- "Heat Sink Optimization"– 2013
- "Heat Sink Optimization"– 2011-2012
- "Heat Sink Optimization"– 2010-2011
- "Heat Sink Optimization"– 2009-2010
- "Heat Sink Optimization"– 2008-2009
- "Heat Sink Optimization"– 2007-2008
- "Heat Sink Optimization"– 2006-2007
- "Heat Sink Optimization"– 2005-2006
- "Heat Sink Optimization"– 2004-2005
- "Heat Sink Optimization"– 2003-2004
- "Heat Sink Optimization"– 2002-2003
- Role of Heat Sink Material In Its Thermal Performance
- "Heat Sink Material"– 2013
- "Heat Sink Material"– 2011-2012
- "Heat Sink Material"– 2010-2011
- "Heat Sink Material"– 2009-2010
- "Heat Sink Material"– 2008-2009
- "Heat Sink Material"– 2007-2008
- "Heat Sink Material"– 2006-2007
- "Heat Sink Material"– 2005-2006
- "Heat Sink Material"– 2004-2005
- "Heat Sink Material"– 2003-2004
- "Heat Sink Material"– 2002-2003
- Heat Sink Design
- Jet Impingement
- Single Jet
- Array of Jets
- Liquid Cooling
- Thermal Chracterization of Cold Plates
- Thermal Characterization of cold plates– 2013
- Thermal Characterization of cold plates– 2011-2012
- Thermal Characterization of cold plates– 2010-2011
- Thermal Characterization of cold plates– 2009-2010
- Thermal Characterization of cold plates– 2008-2009
- Thermal Characterization of cold plates– 2007-2008
- Thermal Characterization of cold plates– 2006-2007
- Thermal Characterization of cold plates– 2005-2006
- Thermal Characterization of cold plates– 2004-2005
- Thermal Characterization of cold plates– 2003-2004
- Thermal Characterization of cold plates– 2002-2003
- Thermal Design of Cold Plate
- Thermal Design of Cold Plate– 2013
- Thermal Design of Cold Plate– 2011-2012
- Thermal Design of Cold Plate– 2010-2011
- Thermal Design of Cold Plate– 2009-2010
- Thermal Design of Cold Plate– 2008-2009
- Thermal Design of Cold Plate– 2007-2008
- Thermal Design of Cold Plate– 2006-2007
- Thermal Design of Cold Plate– 2005-2006
- Thermal Design of Cold Plate– 2004-2005
- Thermal Design of Cold Plate– 2003-2004
- Thermal Design of Cold Plate– 2002-2003
- Role of Cold Plate Material In Its Thermal Performance
- Cold Plate Cooling
- Selection Of Coolant For Liquid Cooling
- selection of a coolant for liquid cooling with cold plate– 2013
- selection of a coolant for liquid cooling with cold plate– 2011-2012
- selection of a coolant for liquid cooling with cold plate– 2010-2011
- selection of a coolant for liquid cooling with cold plate– 2009-2010
- selection of a coolant for liquid cooling with cold plate– 2008-2009
- selection of a coolant for liquid cooling with cold plate– 2007-2008
- selection of a coolant for liquid cooling with cold plate– 2006-2007
- selection of a coolant for liquid cooling with cold plate– 2005-2006
- selection of a coolant for liquid cooling with cold plate– 2004-2005
- selection of a coolant for liquid cooling with cold plate– 2003-2004
- selection of a coolant for liquid cooling with cold plate– 2002-2003
- Thermal Chracterization of Cold Plates
- Microchannels - Their Role In Electronics Cooling
- Microchannels In Electronics Cooling
- microchannel in electronics cooling– 2013
- microchannel in electronics cooling– 2011-2012
- microchannel in electronics cooling– 2010-2011
- microchannel in electronics cooling– 2009-2010
- microchannel in electronics cooling– 2008-2009
- microchannel in electronics cooling– 2007-2008
- microchannel in electronics cooling– 2006-2007
- microchannel in electronics cooling– 2005-2006
- microchannel in electronics cooling– 2004-2005
- microchannel in electronics cooling– 2003-2004
- microchannel in electronics cooling– 2002-2003
- Manufacturing of Microchannel
- manufacturing of microchannel – 2013
- manufacturing of microchannel – 2011-2012
- manufacturing of microchannel – 2010-2011
- manufacturing of microchannel – 2009-2010
- manufacturing of microchannel – 2008-2009
- manufacturing of microchannel – 2007-2008
- manufacturing of microchannel – 2006-2007
- manufacturing of microchannel – 2005-2006
- manufacturing of microchannel – 2004-2005
- manufacturing of microchannel – 2003-2004
- manufacturing of microchannel – 2002-2003
- Heat Transfer Coefficient
- heat transfer coefficient for microchannel– 2013
- heat transfer coefficient for microchannel– 2011-2012
- heat transfer coefficient for microchannel– 2010-2011
- heat transfer coefficient for microchannel– 2009-2010
- heat transfer coefficient for microchannel– 2008-2009
- heat transfer coefficient for microchannel– 2007-2008
- heat transfer coefficient for microchannel– 2006-2007
- heat transfer coefficient for microchannel– 2005-2006
- heat transfer coefficient for microchannel– 2004-2005
- heat transfer coefficient for microchannel– 2003-2004
- heat transfer coefficient for microchannel– 2002-2003
- Pressure Drop Simulation and Estimation
- pressure drop in microchannel– 2013
- pressure drop in microchannel– 2011-2012
- pressure drop in microchannel– 2010-2011
- pressure drop in microchannel– 2009-2010
- pressure drop in microchannel– 2008-2009
- pressure drop in microchannel– 2007-2008
- pressure drop in microchannel– 2006-2007
- pressure drop in microchannel– 2005-2006
- pressure drop in microchannel– 2004-2005
- pressure drop in microchannel– 2003-2004
- pressure drop in microchannel– 2002-2003
- Design of Microchannels for Electronics Cooling
- designing microchannels for electronics cooling– 2013
- designing microchannels for electronics cooling– 2011-2012
- designing microchannels for electronics cooling– 2010-2011
- designing microchannels for electronics cooling– 2009-2010
- designing microchannels for electronics cooling– 2008-2009
- designing microchannels for electronics cooling– 2007-2008
- designing microchannels for electronics cooling– 2006-2007
- designing microchannels for electronics cooling– 2005-2006
- designing microchannels for electronics cooling– 2004-2005
- designing microchannels for electronics cooling– 2003-2004
- designing microchannels for electronics cooling– 2002-2003
- Microchannels In Electronics Cooling
- Refrigeration
- Use of Refrigeration In Electronics Cooling
- "refrigeration" and "electronics cooling"– 2013
- "refrigeration" and "electronics cooling"– 2011-2012
- "refrigeration" and "electronics cooling"– 2010-2011
- "refrigeration" and "electronics cooling"– 2009-2010
- "refrigeration" and "electronics cooling"– 2008-2009
- "refrigeration" and "electronics cooling"– 2007-2008
- "refrigeration" and "electronics cooling"– 2006-2007
- "refrigeration" and "electronics cooling"– 2005-2006
- "refrigeration" and "electronics cooling"– 2004-2005
- "refrigeration" and "electronics cooling"– 2003-2004
- "refrigeration" and "electronics cooling"– 2002-2003
- Use of Refrigeration In Electronics Cooling
- Thermal Interface Materials (TIM)
- TIM Thermal Characterization
- Thermal characterization of interface materials– 2013
- Thermal characterization of interface materials– 2011-2012
- Thermal characterization of interface materials– 2010-2011
- Thermal characterization of interface materials– 2009-2010
- Thermal characterization of interface materials– 2008-2009
- Thermal characterization of interface materials– 2007-2008
- Thermal characterization of interface materials– 2006-2007
- Thermal characterization of interface materials– 2005-2006
- Thermal characterization of interface materials– 2004-2005
- Thermal characterization of interface materials– 2003-2004
- Thermal characterization of interface materials– 2002-2003
- Thermal characterization of interface materials– 2013
- Thermal characterization of interface materials– 2011-2012
- Thermal characterization of interface materials– 2010-2011
- Thermal characterization of interface materials– 2009-2010
- Thermal characterization of interface materials– 2008-2009
- Thermal characterization of interface materials– 2007-2008
- Thermal characterization of interface materials– 2006-2007
- Thermal characterization of interface materials– 2005-2006
- Thermal characterization of interface materials– 2004-2005
- Thermal characterization of interface materials– 2003-2004
- Thermal characterization of interface materials– 2002-2003
- TIM Reliability
- thermal interface material reliability– 2013
- thermal interface material reliability– 2011-2012
- thermal interface material reliability– 2010-2011
- thermal interface material reliability– 2009-2010
- thermal interface material reliability– 2008-2009
- thermal interface material reliability– 2007-2008
- thermal interface material reliability– 2006-2007
- thermal interface material reliability– 2005-2006
- thermal interface material reliability– 2004-2005
- thermal interface material reliability– 2003-2004
- thermal interface material reliability– 2002-2003
- TIM - Phase Change
- "phase change thermal interface material"– 2011-2012
- "phase change thermal interface material"– 2010-2011
- "phase change thermal interface material"– 2009-2010
- "phase change thermal interface material"– 2008-2009
- "phase change thermal interface material"– 2007-2008
- "phase change thermal interface material"– 2006-2007
- "phase change thermal interface material"– 2005-2006
- "phase change thermal interface material"– 2013
- TIM Thermal Characterization