Download

the advancement in semiconductor technology has coerced engineers into looking for more innovative and effective methods to cool semiconductor devices with increasing power density.

the continuing efforts towards the shrinking of the metal oxide semiconductor field-effect transistor (mosfet) and the insulated gate bipolar transistor (igbt) gate size have made it impossible for standard electronics packages and pure air-cooled devices to handle the heat load dissipated by some high-power devices, such as high end cpus, power transistors, dsp chips, etc.

click here to read the full article.