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thermal interface materials (tims) facilitate the transfer of heat from hot chips to heat spreaders. tims have soft material components that fill into the air gaps between the package and spreader joining surfaces. one type of tim is a phase change material that contains a high viscosity fluid, e.g. paraffin, as well as thermally conductive fillers that provide the heat transfer.

but, traditional fillers, typically particles of alumina or glass, are inherently limited in their abilities to conduct heat. as a result, thermal transfer into spreaders is limited and chips may not be cooled to the levels they require. with power dissipation rising, there is a need for tims with higher levels of thermal conductivity. 

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