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qpedia continues its review of technologies developed for electronics cooling applications. we are presenting selected patents that were awarded to developers around the world to address cooling challenges. after reading the series, you will be more aware of both the historic developments and the latest breakthroughs in both product design and applications.   

we are specifically focusing on patented technologies to show the breadth of development in thermal management product sectors.  please note that there are many patents within these areas. limited by article space, we are presenting a small number to offer a representation of the entire field. you are encouraged to do your own patent investigation.

further, if you have been awarded a patent and would like to have it included in these reviews, please send us your patent number or patent application. in this issue our spotlight is on integrating heat pipes into heat sinks. there is much discussion about its deployment in the electronics industry, and these patents show some of the salient features that are the focus of different inventors. 

click here to read the full article, free, in pdf.