Download

in the multi-trillion dollar industry of electronics, the ever-rising demands on product capabilities are driving the importance of thermal management toward the leading edge of design cycles.  to maintain spatial efficiency, engineering teams deploy products with higher complexity, more dense pcb topologies, higher power dissipations, etc. resulting in harsher operating conditions.  

due to an abundance of competition, and reduced design cycle times program budgets continue to be reduced.   while system capabilities, and design budgets once followed parallels, now teams are pulled apart by departmental directives while implementing strategies to solve complex thermal management challenges that yield high roi.  when faced with solving a thermal design challenge, strategies may include: analytical modeling, computational fluid dynamics (cfd) and empirical testing. 

these approaches are subjective, often based on budgets, company culture, an engineer's background and training, etc.  this article will investigate these three methodologies used to solve thermal management challenges found on common communications boards.  

click here to read the entire pdf article, there is no cost for this engineering paper.