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it is vital to understand heat dissipation from electronic components during their operation in order to properly design the cooling system and selection of the appropriate heat removal methodologies.
heat dissipation from a component in an electronic package not only influences its own performance but also affects the performance of neighboring components, leading to their failure. this article will discuss a new method of measuring the heat flux from a component on a pcb.
click here to read the entire pdf article, there is no cost for this engineering paper.
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