Archived Magazines » March 2006

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Preventing Corrosion in Cooling Systems

Preventing Corrosion in Cooling Systems Water and water/glycol solutions are common heat transfer fluids used in cooling systems. Although the fluids are the lifeblood for your heat transfer applications, they can also cause corrosion within your systems. This corrosion can result in a reduction in system thermal performance due to scaling on the heat transfer surface, decreased flow due to reduced pipe diameters from corrosion... details>>

Business & Technology Summit, August 16-18, 2006

Business & Technology Summit, August 16-18, 2006 The theme for the summit 2006 is:rnrnEmerging Technologies for Advanced Cooling of Electronic Components and SystemsrnrnIn addition to presentations by recognized authorities, we are going to have many technology providers to talk about their solutions and display them in our exhibition area.rn details>>

Liquid Cooling in Data Centers

Liquid Cooling in Data Centers Over the past couple of months several infrastructure providers of data centers have announced that they are introducing liquid cooling equipment. The press releases mention the benefits of liquid cooling over air cooling and the cost reduction resulting from such a change.rnrn details>>

Otis Elevator Uses Integrated Analysis to Meet Tough Thermal and EMC Challenges

Otis Elevator Uses Integrated Analysis to Meet Tough Thermal and EMC Challenges Otis Elevator Company is getting new products to market faster with a design methodology that integrates thermal and electromagnetic compatibility (EMC) analysis to meet increasingly tough requirements for elevator controls. Integrated thermal/EMC simulation with the Flomerics Integrated Analysis Environment helps ensure that the first prototype works as predicted from a thermal and EMC... details>>

New Flo/PCB Software Helps Solve Lead-Free Manufacturing Problems

New Flo/PCB Software Helps Solve Lead-Free Manufacturing Problems Flomerics has announced a new version of its Flo/PCB thermal simulation software that will help solve thermal problems in solder reflow processing associated with the use of lead-free solders. The new version of Flo/PCB simulates the reflow process and predicts the temperatures at any point on the board during the entire reflow process. details>>

Web-Based Units Converter & Equation Solver Save Engineers Time

Web-Based Units Converter & Equation Solver Save Engineers Time Lytron recently launched its free web-based Units Converter and Equation Solver. The Units Converter allows engineers to convert from one unit of measure to another, simply by entering a value and its unit of measure and then clicking on the preferred unit. With the Equation Solver, engineers can select from one of six standard thermal equations and enter their preferred units for each variable. details>>

IQS NEBS Seminar

IQS NEBS Seminar One day FREE seminar focuses on NEBS requirements for todays telecommunications equipment. Seminar features Chuck Graff of Verizon. details>>

SEAGATE FINDS CURE FOR PC HOT SPOT

SEAGATE FINDS CURE FOR PC HOT SPOT Seagate’s Design Service Center enlisted Coolit thermal & flow analysis software to solve a puzzling thermal problem for a customer's PC design. Though the high density power model was shoe-horned into a small details>>

Flomerics Announces 2006 Thermal, EMC and Antenna Simulation Training Schedule

Flomerics Announces 2006 Thermal, EMC and Antenna Simulation Training Schedule Flomerics has announced an extensive program of training classes for 2006 designed to help users take full advantage of its thermal, electromagnetic compatibility (EMC), and antenna and microwave simulation software. Classes include training in Flotherm, FLO/EMC, Micro-Stripes, and Flovent. details>>