Archived Magazines » April 2006

Back to Archive

System-Level Thermal Design and Testing of a 3G Wireless Network Gateway

System-Level Thermal Design and Testing of a 3G Wireless Network Gateway A major OEM of dedicated gateways for mobile networks was faced with a show-stopping problem: their flagship product was failing during initial field tests due to overheating, so what to do to salvage their multi-million dollar investment and thousands of hours of development effort? The design of an improved thermal architecture for the product is the subject of this paper.rn details>>

MILITARY POWER SUPPLY OPTIMIZED

MILITARY POWER SUPPLY OPTIMIZED Canadian electronics manufacturer, Filtran is using CoolitPCB to design ruggedized power supplies for a major military telecom application in which ambient temperature pushes against the upper design limit of the components. Becuase little margin is available, accurate thermal analysis is crucial. details>>

Flomerics Announces 2006 10-City Seminar and User Group Meetings

Flomerics Announces 2006 10-City Seminar and User Group Meetings Flomerics Inc. has announced their 10-city seminar and user group schedule for the first half of 2006. These events will include a wide range of educational topics including high-heat flux applications, thermal advancements in portable devices, A/V systems for automobiles, radar cross-section, large scale EMI, Lightning strikes and many others. details>>

Flomerics Establishes Thermal Test Lab After T3Ster Acquisition

Flomerics Establishes Thermal Test Lab After T3Ster Acquisition Flomerics, the leader in thermal simulation of electronics systems and components, has announced that it will be offering the T3Ster (pronounced Trister) thermal testing system and other testing products gained through its acquisition of MicReD. Flomerics is also establishing a physical testing laboratory in Silicon Valley and will be providing physical testing services on a project basis. details>>

Thermal Simulation Speeds Quieter, Smaller BTX PCs to Market

Thermal Simulation Speeds Quieter, Smaller BTX PCs to Market Flomerics Inc. has announced that chipmakers and systems builders are making extensive use of its thermal simulation technology to expedite the movement of personal computers with the new quieter, smaller BTX form factor to market. Engineers used Flomerics Flotherm thermal simulation software to develop specifications for the new form factor that could be certain to maintain junction temperatures... details>>

First Electronics Fluids Modeling Symposium Announced

First Electronics Fluids Modeling Symposium Announced Analysts, designers, and engineering managers... Fluent invites you to join in the Symposium on Fluids Modeling for the Electronics Industry to be held during the 2006 CFD Summit, May 22-23 in Monterey, CA. World-class speakers from major chip manufacturers and electronics companies will talk about their successes and lessons learned in the use of fluids modeling technology. details>>

North American Icepak Summit

North American Icepak Summit Make plans to attend the 2006 North American Icepak Summit - the meeting of the minds in high-performance electronics cooling - May 22-23 in Monterey, CA. This event is for engineers and managers looking to share ideas on how to enhance the use of thermal modeling within their electronics cooling design processes. Come and see the newest applications and approaches using Icepak, Icepro,... details>>

New Clip-on System Provides Safe, Convenient Heat Sink Attachment

New Clip-on System Provides Safe, Convenient Heat Sink Attachment Advanced Thermal Solutions, Inc. (ATS) has introduced the patent pending maxiGRIP™ attachment system for mounting heat sinks to flip chips, BGAs, and other hot on the PCB components. details>>

Business & Technology Summit, August 16-18, 2006

Business & Technology Summit, August 16-18, 2006 Our Summit in August of 2005 was a great success. CoolingZone's Business & Technology Summit was designed to mix technology and business issues in a practical fashion and as such it is different from other conferences on thermal management. details>>

iNEMI Liquid Cooling Symposium & Meeting

iNEMI Liquid Cooling Symposium & Meeting iNEMI is pleased to announce a symposium on successful applications of liquid cooling in the electronics industry plus a meeting of our new Liquid Cooling Project team. Both will take place at the Sheraton San Diego Hotel & Marina, San Diego, CA concurrently with iTherm and ECTC. Liquid Cooling Symposium, May 31, 2006, 7:00-9:00 p.m. Liquid Cooling Project Team Meeting, June... details>>