Archived Magazines » May 2006

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Erosion-Corrosion in Cooling Systems

Erosion-Corrosion in Cooling Systems Heat exchangers and cold plates are used to remove and transfer heat from one place to another using a fluid. There are thousands of combinations of fluids and fluid path materials used. It's important to know the fluids? and the materials? properties in order to minimize erosion-corrosion and optimize system performance and life... details>>

Dr. Joshi to deliver the keynote talk at the upcoming Summit

Dr. Joshi to deliver the keynote talk at the upcoming Summit Dr. Yogendra Joshi, of G.W. Woodruff School of Mechanical Engineering at theGeorgia Institute of Technology will deliver the keynote at this year's Business & Technology summit in August 2006 details>>

Cooper-Standard Automotive Completes Acquisition of ITT Industries' Fluid Handling Systems

Cooper-Standard Automotive Completes Acquisition of ITT Industries' Fluid Handling Systems Cooper-Standard Automotive has completed the acquisition of the Fluid Handling Systems business unit of ITT Industries Inc. in a transaction valued at approximately $205 million. details>>

Lytron Announces Strategic Acquisition To Expand Custom Cold Plate Capabilities

Lytron Announces Strategic Acquisition To Expand Custom Cold Plate Capabilities Lytron, Inc., a leading supplier of liquid cooling products to OEMs around the world, announced May 1st the acquisition of Lockhart Industries, Inc., a subsidiary of Wakefield Thermal Solutions. Based in Paramount, California, Lockhart designs and manufactures advanced aluminum-brazed cooling components for the military and electronics markets. details>>

Lytron Announces Release of New Thermal Management Reference

Lytron Announces Release of New Thermal Management Reference Lytron, Inc. announced the release of its completely updated thermal management reference guide and catalog. The reference provides detailed descriptions of more than 100 standard products, including cold plates, chillers, cooling systems, and heat exchangers. details>>

NVIDIA Uses Compact Thermal Models to Speed Design of NVIDIA nForce4-based Systems

NVIDIA Uses Compact Thermal Models to Speed Design of NVIDIA nForce4-based Systems NVIDIA® took advantage of the speed and time savings provided by compact thermal models to reduce the time required to optimize package design and develop thermal design guidelines for their new NVIDIA nForce(TM)4 media and communications processor. details>>

Flomerics Presentation at DesignCon: “EEs Should Be More Thermally Proactive”

Flomerics Presentation at DesignCon: “EEs Should Be More Thermally Proactive” Alexandra Francois-Saint-Cyr, an application engineer for Flomerics, made a presentation at the DesignCon 2006 conference to encourage electrical engineers to be more proactive about thermal management. The presentation pointed out that power dissipation of electronic devices has been rising steadily to the point that thermal management must be considered as an integral part of the design process... details>>

COOLITPCB V2.0 SIMULATES TRACES AND TRANSIENT FLOW

COOLITPCB V2.0 SIMULATES TRACES AND TRANSIENT FLOW CoolitPCB, the price shattering CFD software for board level analysis, is delivering major new functionality in its latest release. Now shipping, V2.0 simulates traces, a feature unique for CFD software details>>

Cooper-Standard Automotive to present paper at ITherm 2006 Conference

Cooper-Standard Automotive to present paper at ITherm 2006 Conference Mr. Frank Valdez, Advanced Engineer in research and development, at Cooper-Standard Automotive in Auburn Hills, Michigan will present a paper on Tubing Selection for Sealed-For-Life Liquid Cooling Units for Electronics” at the ITherm 2006 International Conference. details>>