| 10th International Business & Technology Summit |
 The 10th International Business & Technology Summit sponsored jointly by CoolingZone and ElectronicsCooling magazine will be held on August 18-19 in Natick, MA. The summit will be followed by a one day course on August 20 titled "Cooling Electronics without All that Hot Air" delivered by Tony Kordyban in his usual engaging and informative way. |
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| Everything You Know Is Wrong - Part III |
 Dear Tony, My boss thinks I need to put in a time-delay in our fan-cooled system, so that the fan will stay on for about five minutes after the power is turned off to the electronics. He claims that if we turn off the fan at the same time as the electronics, the component temperatures will "overshoot" because of "thermal inertia." I can't find "thermal inertial" in any of my old textbooks. Is my boss nuts, or can my parts really overheat this way? Over-worked and Passed-over in Overton |
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July 2010
Published on June 28, 2010
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 َATS INTRODUCESNEW INSTRUMENT SYSTEM BUNDLE
Advanced Thermal Solutions, Inc. (ATS) has introduced system of integrated laboratory instruments and sensors for performing scientific studies that require precise air flow velocity and
temperature measurement.
The iTHERM -100 Airflow Measurement Test Station from ATS includes a benchtop, laboratory-grade wind tunnel, controller, and multiple
 TILEFLOW 4.2 NOW AVAILABLE
Innovative Research, Inc. is pleased the announce the release of TileFlow 4.2. This new version contains a large number of enhancements. These are outlined below.
Upflow CRAC Units
TileFlow now allows you to include upflow CRAC units in the data center layouts. For these units, the dimensions, the details of the return and supply openings, the flow rate, and the cooling characteristics are specified through upflow CRAC unit styles.
 HYBRID COUPLING COMBINES FLUID, ELECTRONICS, TUBING AND CABLE INTO ONE INTEGRATED CONNECTOR
Colder Products Company introduces its new hybrid connector to integrate fluidics and electronics into a single connection point. The new Hybrid Connector eliminates the need for multiple connections and simplifies the user interface between remote tools and a device. Medical professionals can quickly change or replace modular tools, umbilicals or hand pieces that require power, signal, air or fluids in a wide range of medical device applications
 HIGH POWER LIGHTING DIELECTRIC
HPL is a dielectric specifically formulated for high power lighting LED applications with demanding thermal performance requirements. This thin dielectric at 0.0015" (38μm) has the ability to withstand high temperatures with a glass transition of 185°C and phenomenal thermal performance of 0.30°C/W (RD 2018). Bergquist Thermal Clad HPL is available in scored array circuits, scored singulated circuit, punched singulated parts and in LED
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 JAROTHERM'S "SUPER-FLOW MICRO" FAN OFFERS HIGH OUTPUT, WEATHER-RESISTANT PERFORMANCE
In addition to the incredible output (.57 CFM) generated by Jaro's newest ultra-thin, micro-sized (15 x 4) fan, the entire package comes with an impressive IP 57 (water resistant) rating - which protects against harsh environments where dust, water, or humidity could be a problem.
DOW CORNING ANNOUNCES DOW CORNING® OE-8001 DIE ATTACH ADHESIVE FOR IMPROVED LED MANUFACTURING
Dow Corning’s Electronics group has introduced OE-8001 Die Attach Adhesive, a one-part heat curable methyl silicone resin adhesive for LED (light emitting diode) manufacturing.
OE-8001 adhesive excels in areas where competitive materials fall short, offering better adhesion strength than conventional silicone DA and better
 CHALLENGES OF LIQUID COOLING
Many have a conscious, or perhaps sub-conscious, fear of the two together. In this lecture, the plain facts of the topic of liquid cooling for electronics will be laid out so that attendees can make logical informed decisions about liquid cooling and whether their applications would benefit from using it.
General background knowledge of what is included in a liquid cooling system and what is needed for the successful implementation of liquid cooling will be provided. A discussion of the advantages and disadvantages of using the various common liquid cooling components for electronics cooling, as well as, some
 COOLING CHALLENGES OF 3D PACKAGING
The convergence of computing and communications dictates building up rather than out. As consumers demand more functions in their hand-held devices, the need for more memory in a limited space is increasing, and integrating various functions into the same package is becoming more crucial. Over the past few years, die stacking has emerged as a powerful tool for satisfying these challenging Integrated Circuit packaging
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