Home Archive Links
EDITORIALS
Fan Failures and Unavailability
Some problems are associated with so many uncertainties that it is doubtful if a computed result is any better than a crude estimate. The issue for this article is a typical example.
Details
Micro-Fabricated Solutions to Management of High Heat Flux Systems
Removal of high heat fluxes is increasingly becoming the technology bottleneck in a wide variety of applications such as solid state lasers and diodes, telecommunication systems, and consumer electronics. Fundamental considerations indicate that .....
Details
REVOLUTIONARY ADVANCES IN THERMAL MANAGEMENT MATERIALS
Thermal management problems are now critical in microelectronic and optoelectronic packaging. In response to the serious limitations of traditional packaging materials, material suppliers are developing an increasing number of new thermal management materials with low coefficients of thermal expansion (CTEs), ultrahigh ...
Details
June 2005
Published on June 13, 2005
THE MARKET
5TH INTERNATIONAL BUSINESS & TECHNOLOGY SUMMIT
This year's summit will feature in-depth and hour-long lectures by experts in various aspects of electronics cooling
Details
INNOVATIVE RESEARCH OFFERS FREE WORKSHOP AT THE SUMMIT 2005
Innovative Research will present Macroflow, an easy-to-use and computationally eficient software based on the Flow Network Modeling (FNM) approach for rapid system-level thermal design.
Details
MOVING TO LIQUID COOLING: COMMON SENSE DESIGN CONSIDERATIONS
A FREE workshop offered by Lytron at CoolingZone's Business & Technology Summit in August 2005
Details
DAAT RESEARCH CORP. PARTNERS WITH INDIA’S THERMAL SOLUTION PROVIDER, WAVEAXIS
Daat announces licensing rep for India
Details
 
Q&A ON MIKROS NCP
We have been shipping our cold plate in sample quantities for a few months now and are encouraged by the response we have received from those who have evaluated the NCP. In one case, a client has succeeded in dissipating 1900 Watts/cm2 with our standard 10 mm x 20 mm cold plate.
Details
PACE MICRO USES THERMAL AND EMC SIMULATION TO BOOST HARD DRIVE LIFE
Pace Micro Technology, United Kingdom, used thermal and electromagnetic compatibility (EMC) software to reduce temperature of a new set-top box by 5%, substantially increasing disk drive reliability and life. Alan Bate, senior design engineer....
Details
A SHORT COURSE AT THE SUMMIT 2005: DESIGN OF LIQUID COOLING SYSTEMS
This short course presents a birds-eye view of liquid cooling technology. While liquid cooling is not at all new, most civilian electronics cooling applications have been air cooled for the last couple of decades.
Details
LINKS
Copyright © 2004 Coolingzone  Copyright Archive Feedback Disclaimer Privacy Policy