| System-Level Thermal Design and Testing of a 3G Wireless Network Gateway |
 A major OEM of dedicated gateways for mobile networks was faced with a show-stopping problem: their flagship product was failing during initial field tests due to overheating, so what to do to salvage their multi-million dollar investment and thousands of hours of development effort? The design of an improved thermal architecture for the product is the subject of this paper.
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| Business & Technology Summit, August 16-18, 2006 |
 Our Summit in August of 2005 was a great success. CoolingZone's Business & Technology Summit was designed to mix technology and business issues in a practical fashion and as such it is different from other conferences on thermal management. |
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April 2006
Published on April 18, 2006
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 NEW CLIP-ON SYSTEM PROVIDES SAFE, CONVENIENT HEAT SINK ATTACHMENT
Advanced Thermal Solutions, Inc. (ATS) has introduced the patent pending maxiGRIP™ attachment system for mounting heat sinks to flip chips, BGAs, and other hot on the PCB components.
 NORTH AMERICAN ICEPAK SUMMIT
Make plans to attend the 2006 North American Icepak Summit - the meeting of the minds in high-performance electronics cooling - May 22-23 in Monterey, CA.
This event is for engineers and managers looking to share ideas on how to enhance the use of thermal modeling within their electronics cooling design processes. Come and see the newest applications and approaches using Icepak, Icepro, Iceboard, Icechip, and Icewave. Learn about upcoming developments in these products, as well as new products that will be released in the coming months.
To register, log on to:
http://icepaksummit.icepak.com/
 FIRST ELECTRONICS FLUIDS MODELING SYMPOSIUM ANNOUNCED
Analysts, designers, and engineering managers...
Fluent invites you to join in the Symposium on Fluids Modeling for the Electronics Industry to be held during the 2006 CFD Summit, May 22-23 in Monterey, CA. World-class speakers from
major chip manufacturers and electronics companies will talk about their successes and lessons learned in the use of fluids modeling technology.
 THERMAL SIMULATION SPEEDS QUIETER, SMALLER BTX PCS TO MARKET
Flomerics Inc. has announced that chipmakers and systems builders are making extensive use of its thermal simulation technology to expedite the movement of personal computers with the new quieter, smaller BTX form factor to market. Engineers used Flomerics Flotherm thermal simulation software to develop specifications for the new form factor that could be certain to maintain junction temperatures for critical components at safe levels. Also, Flomerics has provided systems builders with thermal modeling templates based on Intel’s reference designs that can be used to save time in their own design process by modifying the templates instead of starting from scratch.
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 FLOMERICS ESTABLISHES THERMAL TEST LAB AFTER T3STER ACQUISITION
Flomerics, the leader in thermal simulation of electronics systems and components, has announced that it will be offering the T3Ster (pronounced Trister) thermal testing system and other testing products gained through its acquisition of MicReD. Flomerics is also establishing a physical testing laboratory in Silicon Valley and will be providing physical testing services on a project basis.
FLOMERICS ANNOUNCES 2006 10-CITY SEMINAR AND USER GROUP MEETINGS
Flomerics Inc. has announced their 10-city seminar and user group schedule for the first half of 2006. These events will include a wide range of educational topics including high-heat flux applications, thermal advancements in portable devices, A/V systems for automobiles, radar cross-section, large scale EMI, Lightning strikes and many others.
 MILITARY POWER SUPPLY OPTIMIZED
Canadian electronics manufacturer, Filtran is using CoolitPCB to design ruggedized power supplies for a major military telecom application in which ambient temperature pushes against the upper design limit of the components. Becuase little margin is available, accurate thermal analysis is crucial.
 INEMI LIQUID COOLING SYMPOSIUM & MEETING
iNEMI is pleased to announce a symposium on successful applications of liquid cooling in the electronics industry plus a meeting of our new Liquid Cooling Project team. Both will take place at the Sheraton San Diego Hotel & Marina, San Diego, CA concurrently with iTherm and ECTC.
Liquid Cooling Symposium, May 31, 2006, 7:00-9:00 p.m.
Liquid Cooling Project Team Meeting, June 2, 2006, 7:00-8:00 a.m.
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