| The Best Heat Transfer Fluids for Liquid Cooling |
 One of the most important factors when choosing a liquid cooling technology for your application is the compatibility of the heat transfer fluid with the wetted surfaces of the cooling components or system and your application. |
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April 2008
Published on April 20, 2008
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 DR. AZAR TO DELIVER THE KEYNOTE LECTURE AT SUMMIT 2008
This year's keynote lecture will be delivered by Dr. Kaveh Azar and is titled: Challenges in Thermal Management of Electronics for the Next Decade
 FUNDAMENTALS AND APPLICATIONS OF IMPINGEMENT COOLING
Summit 2008, August 20-21: Impingement provides one of the highest single phase heat transfer coefficients, for a given fluid velocity. The primary advantage of this technique over other convective techniques is the creation of very small boundary layers on the target surface. Impingement cooling is attractive for
 THE EFFECTS OF TEMPERATURE ON LEAD-FREE SOLDER JOINT RELIABILITY
Summit 2008, August 20-21: Ten trillion solder interconnections are made annually in the electronics industry for cell phone, computer, communication, medical, aerospace, and military applications. The solder interconnection is the primary interconnection in microelectronics packaging because it provides the mechanical and ..
 COMMON PITFALLS OF AIR COOLING ELECTRONICS
Summit 2008, August 20-21: One learns ten times as much from a mistake as from a success. This talk aims for that tenfold increase in educational value by sharing some lessons learned the hard way, when air cooling of electronics didn't go quite the way it was supposed to. It includes the seven reasons that heat sinks don't work,
 HIGH-PERFORMANCE THERMAL MANAGEMENT MATERIALS
Summit 2008, August 2008: In response to well-recognized needs, there have been revolutionary advances in thermal management materials in the last few years. There are now many low-CTE, low-density materials with thermal conductivities up to 1700 W/m-K.
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 THERMAL DESIGN AND IMPLEMENTATION OF ROBUST LIQUID COOLING SYSTEMS FOR HIGH PERFROMANCE COMPUTER SYSTEMS
Summit 2008, August 20-21: A technical perspective and review of water cooling technology as implemented through 5 generations of IBM's high performance computing systems from the S360/91 to the recently announced IBM Power
 THERMAL CHALLENGES IN LED SYSTEMS
Summit 2008, August 20-21: LEDs are a big opportunity for the lighting industry. LEDs are energy efficient and have the potential to be very reliable. Furthermore, they overcome a number of drawbacks of conventional lighting solution and provide a number of new features that are highly valued by the market.
 RECENT ADVANCES IN THE THERMAL MANAGEMENT OF ELECTRONIC COMPONENTS
Since the development of the integrated circuit, a key driver pushing the development of new packaging technologies has been the need to achieve higher levels of integration. In the past, this has been the result of putting more functionality on
 NEW CATALOG & THERMAL REFERENCE NOW AVAILABLE FROM LYTRON
Lytron recently published its new catalog and thermal reference. It features both custom and standard cold plates, cooling systems, and heat exchangers.
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