| CoolingZone Welcomes New Supplier |
| 2009 started with 3 new suppliers joining CoolingZone to take advantage of the cost effective marketing platform in these difficult economic conditions. These suppliers are:
* Colder Products
* Cooliance
* Future Facilities
For just $995 per year the suppliers of thermal management solutions can get in front of over 13,000 thermal professionals around the globe and around the clock. |
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February 2009
Published on February 12, 2009
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 LIQUI-BOND SA 1800 (ONE PART)
The Bergquist Company is excited to announce the addition of another high performance product, Liqui-Bond SA 1800, to its liquid silicone adhesive family. Liqui-Bond SA 1800 features both a high thermal conductivity (1.8 W/m-K) and a low viscosity, allowing for ease of screen or stencil application. The material is also well suited for ....
 INNOVATIVE RESEARCH AT THE UPCOMING UPTIME INSTITUTE SYMPOSIUM
Innovative Research will participate as a Research Underwriter in the Uptime Institute’s Lean, Clean & Green Symposium & Exposition at the New York Hilton from April 13-16. We would like to extend to you a special invitation to attend this year’s event at a VIP discount rate of 50% off the regular tuition. At the exposition, we will showcase TileFlow, our unique software product for simulating the cooling performance of data centers ........
 DISCOVER THE BENEFITS OF A PRECISION FORGED HEATSINK
The Thermal Management Industry has historically been dominated by extruded
and die cast heat sinks. As electronic packaging becomes more compact and
processing power continues to increase, engineers are looking for alternatives
that provide more efficient thermal transfer in a smaller space.
 BREAKTHROUGH IN THERMAL DESIGN SOFTWARE
Future Facilities Ltd, the global leader in software for data center design and operational management is pleased to announce their attendance at Semi-Therm 25 where they will unveil 6SigmaET, a 3rd generation CFD-based software for electronics thermal design and the first major breakthrough ....
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 NEW CONNECTIVITY OPTIONS FOR LIQUID COOLING
The trend toward faster, more compact electronic equipment with increased power capacity is not going away. Neither is the need to find ways to cool it. Companies involved in the design and manufacture of high-value electronic equipment that generates heat – such as servers, medical imaging systems and super computers – know that effectively cooling these systems is critically important and that liquid cooling ...
 FLUID FLOW SIMULATION HELPS OVERCOME TOUGH TELECOM THERMAL DESIGN CHALLENGE
Elma Electronic used FloTHERM thermal simulation software from the Mentor Graphics Mechanical Analysis Division (formerly Flomerics) to optimize the design of a new Advanced Telecommunications Computing Architecture (ATCA) platform that is designed to dissipate up to 300 watts in each of its 14 slots.
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