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 LIQUI-BOND SA 1800 (ONE PART)
The Bergquist Company is excited to announce the addition of another high performance product, Liqui-Bond SA 1800, to its liquid silicone adhesive family. Liqui-Bond SA 1800 features both a high thermal conductivity (1.8 W/m-K) and a low viscosity, allowing for ease of screen or stencil application. The material is also well suited for ....
 BREAKTHROUGH IN THERMAL DESIGN SOFTWARE
Future Facilities Ltd, the global leader in software for data center design and operational management is pleased to announce their attendance at Semi-Therm 25 where they will unveil 6SigmaET, a 3rd generation CFD-based software for electronics thermal design and the first major breakthrough ....
 NEW CONNECTIVITY OPTIONS FOR LIQUID COOLING
The trend toward faster, more compact electronic equipment with increased power capacity is not going away. Neither is the need to find ways to cool it. Companies involved in the design and manufacture of high-value electronic equipment that generates heat – such as servers, medical imaging systems and super computers – know that effectively cooling these systems is critically important and that liquid cooling ...
 FUTURE FACILITIES WILL ANNOUNCE NEW THERMAL DESIGN SOFTWARE AT SEMI-THERM
Future Facilities Ltd, the global leader in software for data center design and operational management is pleased to announce their attendance at Semi-Therm 25 where they will unveil 6SigmaET, a 3rd generation CFD-based software for electronics thermal design and the first major breakthrough for a thermal design tool in 10+ years!
View 6SigmaET in action at the Future Facilites booth #70 or at the Future Facilities vendor presentation at 2:00 pm on Tuesday, March 17.
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 INNOVATIVE RESEARCH AND THE UPTIME INSTITUTE COLLABORATE AT SYMPOSIUM 2009 TO REDUCE ENERGY CONSUMPTION
Minneapolis--Innovative Research, a pioneer in the use of Computational Fluid Dynamics (CFD) for the simulation of airflow and cooling in data centers, is pleased to collaborate with the Uptime Institute in its 4th Annual Research Symposium: Lean, Clean & Green; at the Hilton New York, April 13 through 16.
 MENTOR GRAPHICS ANNOUNCES FLOEFD INDUSTRY-LEADING FUNCTIONALITY FOR ELECTRONICS COOLING SIMULATION AND ANALYSIS
SEMITHERM 2009, San Jose, CA, March 16, 2009 – Mentor Graphics Corporation (NASDAQ: MENT) today announced the FloEFD™ (Engineering Fluid Dynamics) v9.0 product suite from the company’s Mechanical Analysis Division (formerly known as Flomerics), with functionality specifically targeted for simulation and analysis of electronics cooling applications. As a “CAD-Embedded” application, the FloEFD suite tightly integrates with all popular MCAD design solutions to enable mechanical designers to easily analyze sophisticated electronic products including those with complex geometries.
 EMBEDDED CFD HELPS REDUCE NUMBER OF THERMAL PROTOTYPES FROM UP TO 12 TO 1
Azonix used FloEFD Software from the Mentor Graphics Mechanical Analysis Division (formerly Flomerics) to reduce the number of thermal prototypes required from up to 12 to 1 on its new Terra embedded computer. “FloEFD computational fluid dynamics (CFD) software enables design engineers without a fluid analysis background to perform thermal simulation,” said James Young,
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