Press Releases

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  Mushkin Announces New Ridgeback Heatsink Design

  Cut from aircraft-grade aluminum, the second generation Ridgeback heatsink is the newest model of durability and functionality. Officially scheduled to launch with Mushkin�s new performance DDR4 memory kits in Q1 2015, each module is hand tested and validated on motherboards from all the major manufacturers. The Ridgeback DDR4 modules feature XMP 2.0 profiles to deliver easy, reliable... details>>
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  Indium Corporation Features Heat-Spring for LED Manufacturing at Strategies in Light [Video]

  The compressible, recyclable, metal thermal interface material provides 86W/mK of thermal conductivity using a pressure range of only 35 to 100+ psi. Heat-Spring offers superior conductivity and ease of use as compared to thermal grease alternatives. In addition, Heat-Spring will not bake out or pump out, optimizing long-term performance consistency and eliminating the rework process. details>>
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  Fujipoly Debuts New, Cost Effective Method for Connecting an LCD to a PCB

  Fujipoly's new Zebra 2004 Elastomeric Connector is a low cost interconnect device made from alternating layers of conductive carbon-filled and non-conductive silicone. This unique construction makes the connector ideal for devices with pad spacing as close as .020" (.50mm). It is capable of delivering a current carrying capacity of 50 mA per .040" x .040" pad and can be specified... details>>
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  ACT Fluid Accumulators Delivered To The International Space Station

  Advanced Cooling Technologies, announced four fluid compensation accumulators installed in NASA�s Cloud Aerosol Transport Systems (CATS) instrument were successfully delivered to the International Space Station (ISS) aboard SpaceX�s CRS 5 dragon capsule which docked with the space station on January 13th 2015. The all stainless steel accumulators provide volumetric compensation for fluid... details>>
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  Cooler Master and CoolChip Technologies(TM) Forge Partnership to Bring Kinetic Cooling Technology to PC Gaming and DIY Markets [Video]

  Cooler Master, a leading creator, innovator and manufacturer of desktop components and peripherals, and CoolChip Technologies a leading fabless technology house of thermal management solutions, today announced a partnership to bring kinetic cooling technology to the multi-billion dollar PC gaming and DIY markets. The increasing demand for more powerful devices in ever-smaller form factors... details>>
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  NMB Adds New Cooling Fans to Popular SB Series

  New innovative applications in the medical, office equipment and LED lighting design industry require cooling fans that offer low power consumption, high air flow and longer life. NMB has added 3 new frame sizes to the SB fan series that will continue to keep this market cool. details>>
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  EK intros GIGABYTE GTX 980 Gaming G1 Full-Cover water block

  EK-FC980 GTX WF3 is a high-performance full-cover water block, designed for GIGABYTE non-reference design GeForce GTX 980 graphics cards. The cooler actively cools the GPU, RAM as well as VRM (voltage regulation module) as water flows directly over these critical areas thus allowing the graphics card and it's VRM to remain stable under high overclocks. details>>
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  Acal BFi Launches new All-in-one Thermal Camera Module

  Acal BFi, European leader in advanced technology solutions, has launched a new "all-in-one" thermal camera module. Designed for OEMs and integrators, the ICC-TM640-105HZ combines the Tamarisk 640 high performance uncooled thermal camera core from DRS Technologies with an outstanding 35-105mm 3x zoom lens. details>>
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  TECA Releases Powerhouse Thermoelectric Enclosure Cooler: Increased Cooling, Same Small Size

  For enclosure cooling, TECA introduces a powerful new thermoelectric air conditioner. The AHP-690 Model features compact dimensions and 55% more cooling capacity than coolers of similar size. As a closed loop enclosure cooler, the AHP-690 protects electronics from overheating in any environment. The AHP-690 is available with military grade fans for NEMA-4X enclosures. details>>
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  Bergquist Gap Pad HC 3.0 Kicks Off A New Generation Of High Compliance, Easy To Handle, Low Modulus Thermal Material [Video]

  The Bergquist Company is proud to introduce its latest product in our Gap Pad family - Gap Pad HC 3.0. The new high-compliance Gap Pad HC 3.0 utilizes a low-modulus resin formulation and filler package to provide exceptional performance at low pressures. The thermal material is well suited for high performance applications requiring low stress on components during assembly. This highly... details>>