Press Releases

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  Noctua Unveils New Electronics Cooling Products at Computex 2014

  Ranging from fans and heatsinks to be released soon over experimental concepts such as flock coated fans and cube base heat pipes to updates on its Active Noise Cancellation project, Noctua's line-up for this year's show has received excellent feedback from the international press. details>>
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  Applied Math Modeling Releases CoolSim 4.3 Next - Generation Data Center Design Software

  Applied Math Modeling Inc., a leading provider of data center design optimization software, announced today CoolSim 4.3 - the next revision of the company's popular modeling software. As the industry's only cloud based solution, CoolSim 4.3 continues to add important ease of use and modeling features for data center design optimization. Using CoolSim 4.3, users are now able to build models... details>>
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  ATS Launches Nine New Product Families for Electronics Thermal Management

  Advanced Thermal Solutions (ATS) has nine new product lines for effectively managing heat in electronics, including portable anemometers, heat pipes, shut off valves, portable chillers, flow meters, TEC assemblies and modules, and heat exchangers. details>>
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  New IGBT and Rectifier Diode Modules from Littelfuse Combine High Operating Efficiency with Wide Choice of Package Designs

  Littelfuse, Inc., the global leader in circuit protection, has added two products to its power control semiconductor line., the IGBT and Rectifier Diode Modules. details>>
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  Self-Ventilating Heat Exchanger Cools Electronics without Mixing External and Compartment Air

  AMETEK Rotron has introduced a thermal management product which cools sealed airborne or ground-based electronic and optical compartments without introducing contaminated external air. The new Discus self-ventilating heat exchanger offers greater cooling capability and reduced weight compared with previous technologies. Designed specifically for pod-mounted airborne optical systems, the Discus... details>>
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  Elite Thermal Engineering has introduced the OCP-300L thermoelectric cooling plate and HS-004L high-power heat sink for laboratory and OEM applications.

  Elite Thermal Engineering has introduced the OCP-300L thermoelectric cooling plate and HS-004L high-power heat sink for laboratory and OEM applications. details>>
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  Dresser-Rand Introduces New Magnum� HammerHead� Valve

  The Magnum� HammerHead� valve is specifically designed for high molecular weight applications at both low and high compressor speeds. The Magnum HammerHead valve can be applied to all brands of reciprocating compressors. details>>
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  Cambridge Nanotherm� Products Receive UL� Recognition [video]

  Electronics thermal management innovator Cambridge Nanotherm� Ltd has announced that UL� has given recognized status to its Nanotherm� Laminated Copper (LC) thermal management products. details>>
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  Thermacore Offers First Heat Pipe Assembly for Operational Prototypes After Passing NASA Ames Hypersonic Tests

  Officials at Thermacore, a provider of advanced thermal solutions, announced that a Thermacore heat pipe assembly recently completed testing at the NASA Ames Arc Jet Complex, operating at very high temperatures in a hypersonic leading edge simulation, making it the first rigid embedded heat pipe module to operate successfully at those conditions. details>>
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  TECA introduces New 3-Phase Thermoelectric Air Conditioners

  TECA now offers thermoelectric air conditioners for systems with 3-phase power. Reliable thermoelectric technology is maintenance free and does not require filters, coolant or chemicals of any kind. details>>