Press Releases

• 

  ATS Introduces New Thermal Test Instrument, FSC-200, Fan Speed Controller

  ATS has just introduced a new lab instrument, the FSC-200(TM) fan speed controller. This device is designed to control the fan/fan tray speed in a variety of applications, especially where air flow control is critical for accurate thermal design. Custom stageSPEED� software, which is included with the product, permits the user to fully control the fans' performance by adjusting the power from 0... details>>
• 

  Pushing the Limits of Air Cooled Heat Sinks Focus Part of coolingZONE 2013 - Register Today

  coolingZONE-13 will present a focus on next generation advancements in air cooling with presentations from Dr. Camil Ghiu of ATS and Dr. Sukhvinder Kang of Aavid Thermalloy. REGISTER TODAY for coolingZONE-13 Thermal Management Summit, October 21-23 in Boston MA, details>>
• 

  EMI Tape Company Releases New.24/2- UL-94 V-0 Silicon Thermal Pad equivalent to BERGQUIST GAP PAD VO Soft

  EMI Tape has released a family of silicon thermal pad equivielnts to Berquist product family. details>>
• 

  CoolitDC v. 6.00 Boosts Modeling Accuracy & Ease-of-Use

  Daat Research Corp. introduces a wealth of new enhancements for CoolitDC, its powerful CFD software for data center design. The new features boost speed and accuracy. details>>
• 

  Isola Introduces Very Low-Loss Materials for Advanced Automotive Safety and Driver Assistance Systems [Video]

  Isola announces Astra, a very low-loss dielectric constant (Dk) product for millimeter wave frequencies and beyond. Astra revolutionizes RF and microwave designs, as it delivers a thermoset solution, which is very easy to process and has stable electrical properties over a wide range of temperatures and frequencies. details>>
• 

  Sapa Group North American Technical Center Develops New Modular Method to Manufacture High Ratio Air Cooled Heat Sinks - Video

  Created by Sapa's North American Technical Center (NATC)-an internal research, design and development center that works to provide innovative solutions and products-the heat sink design leverages Sapa's expertise in aluminum extrusion manufacturing and Friction Stir Welding (FSW) technology, a technique that joins flush metal surfaces through the mechanical action of a rotating tool. Study Finds... details>>
• 

  Vincotech's Modules With Pre-Applied Phase-Change Material - video

  Vincotech offers modules with a layer of pre-applied PCM. The thermal interface material is applied in a layer with uniform thickness by a screen-printing process. This phase-change material is thixotropic and therefore will not flow without the application of pressure. Standard soldering profiles may be used. A lid or a foil can prevent the phase-change material's surface from coming into... details>>
• 

  Registere Today for coolingZONE 13: Thermal Interface Material Focus Part of coolingZONE 2013

  Register today for coolingZONE-13! At coolingZONE 2013 we've got a focus on thermal interface material with three excellent speakers over the Summit's 3-days: Dr. Richard Hill of Laird Technologies, Dr. Phil Blazdell of t-Global Technologies and Bill Pfeifer, sp3 Diamond. They will be addressing various aspects of what engineers will face in the future electronics cooling and thermal interface... details>>
• 

  AMETEK debuts slim, inverted blowers to deliver electronics cooling in tight enclosures

  AMETEK Rotron is introducing compact inverted blowers to provide concentrated, high-volume airflow for critical cooling applications in ruggedized computers, avionics, and communications. details>>
• 

  T-Global Technology Announces New Thermally Conductive Liquid Gap Filling Material

  T-Global Technologies has released their latest thermal interface material, the TG4040-2K Thermally Conductive Liquid Gap Filling Matierial. The product is supplied as two components which can be cured at room temperature or at an elevated temperature to give excellent thermal and mechanical performance. details>>