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coolingZONE-13 Thermal Management of Electronics eConference All 8 Lectures

Speakers

 

Special Guest Lecture: Thermal Management for Microprocessors .
by Medhi Asheghi, Speaker

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Key Note Speaker: Galinstan-Based Cooling of Microelectronics: Beyond Tuckerman and Pease? .
by Dr. Marc Hodes, Ph.D., Tufts University, Ph.D.

In 1981 in perhaps the most cited study in the thermal management of electronics literature, Tuckerman and Pease at Stanford University pumped water through a bank of 50 microchannels etched into 1 cm x 1 cm footprint 400 micro millimeter thick silicon block. A heater sputtered onto the silicon dissipated 791 W/cm2 and the pressure difference across the microchannels was 2 atmospheres. The measured thermal resistance based upon the maximum heater temperature and inlet water temperature was 0.09oC/W and it has been subsequently been shown that it may be reduced to 0.07oC/W by refining the microchannel geometry. Such a resistance implies that a microprocessor uniformly dissipating 1000 W/cm2, currently the heat flux at “hot spots” on high-end microprocessors, could be accommodated by single-phase liquid cooling. read more

Liquid Cooling Tutorial: Designing Liquid Cooled heat Sinks and Cold Plates .
by Dr. Alfonso Ortega, Ph.D., Speaker

This 80 minute lecture, comprised of two pre-recorded segments, covers a tutorial in the design of liquid cooled heat sinks and cold plates and a discussion of fundamental concepts for moving from air to liquid cooling. Dr. Ortega also addresses indirect liquid cooling of electronics with micro- and mini-scale cold plates and heat sinks. read more

Planes, Trains, and Automobiles ..... and Electronics? .
by Ruben Bons, Director of Electronics at CD-Adapco, Speaker

Flow and thermal simulation has been used in the design of electronic systems for more than 2 decades, growing in both the breadth and depth of the applications. But a great deal of growth is still possible. This presentation will examine where this growth will likely occur by drawing on experiences in other industries that rely much more heavily on simulation to drive design. The aerospace, automotive, and rail industries (plus others such as marine, nuclear, and oil & gas) have driven simulation technology to grow in multi-disciplinary scope and multi-scale depth, plus design optimization technology has rapidly developed in capability and practicality. The electronics industry will greatly benefit from these advancements both now and in the future, and, to illustrate how, specific concepts and examples of multi-disciplinary, multi-scale, optimization analysis will be demonstrated and discussed. read more

Passive Thermal Management, Challenges and Directions for A Lower Cost of Ownership Solution .
by Dr. Philip Blazdell, Ph.D., General Manager, t-Global Europe and North America, Speaker

In this lecture for coolingZONE 2013, Dr. Blazdell, Ph.D., of t-Global Technologies lecture on \"Passive Thermal Management: Challenges and Directions Lower Cost of Total Ownership. His talk addresses the intersection of new technology in thermal management with the overarching need for cost effectiveness and market acceptance. read more

Fast CFD for Data Center Cooling Design .
by Jim VanGilder, P.E., Director of Cooling Prediction R&D for APC by Schneider, Speaker

The power and flexibility of traditional CFD tools are not always justified for data center modeling given their limitations (cost, long run times, and training requirements). For example, in the design and planning stage, even the IT Equipment selections are not yet finalized and guesses must be made as to total rack power and airflow. In such applications, a lighter-duty version of CFD, based on potential flow modeling, may offer significant advantages. Several researchers have developed prototypes and, at least one, vendor offers potential-flow-based software commercially. Most recently, researchers have proposed models for incorporating physical effects like buoyancy into potential flow models thereby extending their useful scope while still retaining the speed and stability that make such models attractive. This presentation will review potential flow modeling technology and its role in data center design. read more

Lowering Aluminum Heat Sink and Liquid Cooler Thermal Resistance with Friction Stir Welding .
by Mike Tozier, Technology Development Manager at Sapa Extrusions North America, Speaker

Aluminum heat sinks and liquid coolers are the most common cooling components in the cooling system for Power Electronic Modules. Given the increasing demand for handling higher power dissipation as well as for cost reduction, it is very important to further optimize the design for aluminum heat sinks and liquid coolers. In this paper, we present new cost effective methods to manufacture aluminum heat sinks and liquid coolers using Friction Stir Welding (FSW). The thermal performance of friction stir welded heat sinks and liquid coolers is evaluated and compared with others made by conventional manufacturing methods. Initial indications show that the thermal performances of heat sinks and liquid coolers made by both the new and the conventional methods are similar, with FSW methods lowering thermal resistance 8% at effective costs. read more

How to Properly Measure Temperature within Electronic System and Analyze the Results .
by Dr. Kaveh Azar, Ph.D., President and CEO of Advanced Thermal Solutions, Ph.D.

Attendees of this tutorial will deepen their understanding of the importance of temperature measurement in electronic systems. They will learn about each of the instruments needed for measuring temperature and interpreting temperature data. The instructor will show the key locations inside electronics systems where thermal testing should be conducted to obtain the most accurate and actionable results. read more

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