Sponsored by CoolingZone and ElectronicsCooling Magazine

REAL Problems ...... REAL Solutions

In cooperation with the leading suppliers of Thermal Management Solutions

Dr. Robert Moffat

Professor Emeritus

Stanford University

Keynote Lecture:

What Lies Ahead

Franklin was wrong - there is at least one other thing that is as certain as death or taxes: we will continue to have problems cooling electrical and electronic systems, and will continue to need innovative solutions to those problems.
Here is what I see in my crystal ball for the next ten years.
There are several cooling strategies available today (direct air-cooling, spray cooling, single-phase liquid cooling, boiling, etc.) and several “facilitators” that can be used in these systems (heat spreaders, heat sinks, thermoelectric coolers, heat pipes, etc.). The bottom line, though, is fixed. The ultimate heat sink for all of these strategies is either the ambient air or the local water supply and the way to get there is through a heat exchanger.
Liquid cooling and spray cooling clearly involve heat exchangers, and their size and weight are important. Even a simple finned heat sink is a heat exchanger.
I think we will see a lot of progress towards ultra-high-compactness heat exchangers in the next ten years. Using metallic or non-metallic foams, or micro-scale manufacturing techniques we can greatly reduce the size of heat exchangers while keeping their thermal performance and pressure drop constant. An “order of magnitude” (factor of ten) reduction in core volume is not impossible. To make these techniques practical, we need to reduce the cost of the new manufacturing methods and develop some new design approaches. Cooling system designers will have to become fluent in heat exchanger design and we need to get much smarter about the design of compact headers and low-loss ducting.
These reductions in heat exchanger size will affect the air movers we need. I think we will move toward lower flow, higher head blowers with active flow control. Noise management will become more important.
Direct air cooling, which seems to be the simplest cooling system, is actually the most difficult to pull off. Direct air cooling faces two very difficult problems: predicting the flow paths inside the enclosure, and the predicting the heat transfer from the components. Most people in the field rely on some level of CFD for predictions but the results are not always reliable. Small wonder: Even the best of “research-level” CFD codes still can’t handle separated and reattaching flows with good accuracy, and those situations abound in direct air cooling.
The dominance of CFD may be jeopardized by recent advances in rapid prototyping and rapid experimental methods. Two new experimental techniques may combine to replace CFD as the “tool of choice” for determining the flow distribution in a direct air-cooling situation. In the near term (this year and next) this approach may be limited to the most critical “high value” situations but it will become more widely available as more facilities are assembled.
The two techniques I have in mind are Magnetic Resonance Velocimetry and precision stereo lithography. MRV can quantitatively document the velocity field (magnitude and direction at thousands of points) within a model enclosure in just a few hours of run time. Starting with a geometry file, an appropriately scaled high precision Stereo Lithography model can be made and the unit tested within a week. Within the next ten years, I think this experimental approach will be routinely considered as an option.
Given an accurate SLA model it is relatively straightforward to attach thin-film heaters to the critical components and directly measure the heat transfer.
The “desk-top” heat transfer laboratory may be faster, cheaper, and more accurate than even a very good CFD program. Time will tell - and the clock is ticking

Dr. Avram Bar-Cohen

TherPES Laboratory
Department of Mechanical Engineering
University of Maryland

Thermal Characterization, Modeling, and Optimization
of Thermally-Enhanced Polymer Composite Heat Sinks

Increasing electronic product manufacturing volumes and cooling requirements necessitate the use of new materials and innovative techniques to meet the thermal management challenges and to contribute towards sustainable development in the electronic industry. Thermally conductive polymer composites, using high thermal conductivity fillers such as carbon fibers and carbon nanotubes, are becoming commercially available and provide favorable attributes for electronic heat sinks, such as low density and fabrication energy requirements. These polymer composites are inherently anisotropic but can be designed to provide high thermal conductivity values in particular directions to address application-specific thermal requirements.

This presentation will offer a systematic approach to the characterization, analysis, design, and optimization of orthotropic polymer composite fins used in electronic heat sinks. Morphological characterization and thermal conductivity measurements of thermally conductive Poly-Phenylene Sulphide composites are used to determine the significant directional thermal conductivity in such composites. An axisymmetric orthotropic thermal conductivity pin fin equation is derived to study the orthotropic thermal conductivity effects on pin fin heat transfer and temperature distribution. Theoretical models, CFD modeling, and experiments are used to characterize the thermal performance of heat sinks, fabricated of PPS composite pin fins, in air natural convection and forced convection modes. Simplified solutions, for the orthotropic fin heat transfer rate that are easy to use and can be easily implemented in a heat sink design and optimization scheme, are also presented.

Dr. Roger Schmidt

Distinguished Engineer
Server Group
IBM Corporation

Recent Advances and Future Challenges in Data Centers

The heat dissipated by electronic equipment continues to increase at an alarming rate. This occurred for products covering a wide range of applications. Manufacturers of this equipment require that the equipment be maintained within an environmental envelope in order to guarantee proper operation. Achievement of these environmental conditions are becoming increasingly difficult given the increases in rack heat loads and the desire for customers of such equipment to cluster racks in a small region for increased performance. This presentation will show some of the most recent advances in data center designs and best practices and also provide a view of what the future holds for housing IT equipment in data centers.

Dr. Suresh Garimella

Goodson Professor of Mechanical Engineering
Director, Cooling Technologies Research Center (an NSF I/UCRC)
and Birck Nanotechnology Center
Purdue University

Thermal Microsystems for Electronics Thermal Management across Multiple Scales

Electro-thermal co-design at the micro- and nano-scales is critical for achieving desired performance and reliability in microelectronic circuits and other microsystems. Emerging thermal microsystems technologies for this application area will be discussed, with specific examples including a novel micromechanical electrohydrodynamic micropump, electrowetting for fluidic actuation and site-specific thermal control, ion-driven airflow, and miniature piezoelectrically actuated cantilevers for cooling and sensing. Fundamental research into enabling technologies for such microsystems, conducted by the speaker’s group under the framework of the National Science Foundation Compact, High-Performance Cooling Technologies Research Center (www.ecn.purdue.edu/CTRC), will be presented. This includes single- and two-phase microchannel transport, thin-film evaporation, transport in porous metal foams and wicks, and enhancement of interface contact conductance.

Dr. Medi Asheghi

Research & Development

iCONA Technology

Advances in Thermal Engineering and Management of Microelectronic Devices and Microprocessors

The trend in increased power densities for integrated systems has been accompanied by the formation of non-uniform heat generation patterns and subsequently sharp temperature gradients across a microprocessor or chip. There have been many advances in recent years in package and chip level cooling technologies; however, it appears that, with increasing power density and the associated cost for cooling schemes, we can no longer design for worst case scenarios and must take into account both local and global temperature non-uniformities. Thermal management issues span from the individual device level to the system component (e.g., processor) level, thereby representing length scales that range from 10 ^-8 m to 10 ^-2 m. Clearly, understanding the fundamentals of heat transport and thermal modeling as well as developing simulation and experimental tools and technqiues to cover length scales that are different by nearly six orders of magnitude would be a challenging endeavor.

This presentation provides an overview of the challenges facing the semiconductor industry and will cover topics ranging from nanoscale heat transport in microelectronic devices to the microprocessor level thermal engineering and management. In particular, we attempt to understand to what extent can small heating effects (of a single or multiple transistors) impact chip temperature distribution for circuits under full operation? In another word, what is the impact of different power granularities on global chip temperatures? In addition, we will find the required minimum granularity (finest mesh) for accurate thermal analysis of a microprocessor as well as the lengthscale that separates the nano/micro-scale (transistor level) from the macroscale (chip and package level) regime.

Dr. Michael Ohadi

Professor

Petroleum Institute

University of Maryland

(Revised) A Self-Contained Cold Plate Utilizing Force-Fed Evaporation and Condensation--Application to Cooling of High Flux Electronics

This lecture will discuss development of a self-contained two-phase flow cold plate suitable for cooling electronics in a wide range of applications. The cold plate utilizes an innovative, forced-fed evaporation and condensation technique with demonstrated high promise for cooling of low volume, complex high flux electronics for both commercial and military applications. The technique has the potential to replace conduction cold plates in many other applications which require high heat dissipation rates and a high degree of reliability.
The technique utilizes high performance micro-structured surfaces consisting of alternating fins and channels, coupled with a force-fed mechanism in the evaporator and condenser. The force-fed mechanism provides a highly vigorous micro-channel convective heat transfer environment with the net effect of substantially higher heat transfer coefficients without the high pressure drop penalties that are normally associated with such flows. Our recent results demonstrate dissipation heat flux levels well above 900 W/cm2 with corresponding heat transfer coefficient of close to 160,000 W/m2-K, using HFE-7100 as the working fluid. For the condensation mode, the force-fed method produces heat fluxes up to 60 W/cm2 and heat transfer coefficient of 45,000 W/m2-K using R245fa.

Dr. Jim Wilson

Principal Mechanical Engineer

Raytheon Space and Airborne Systems

Thermal Design and Implementation Challenges for Military and Avionics Equipment

Thermal design challenges are currently a design constraint on the capability of many military and avionic electronic systems. While several of these challenges are familiar to members of the commercial electronics cooling community (e.g. microprocessor cooling), the typical, or routine, solutions to these problems become much more challenging when attempted in the much harsher military environment. Military and avionics equipment designers must consider extremes of hot and cold temperature, moisture, and the need for long term reliability. They are also expected to use the latest and greatest electronics available in the commercial world and keep the equipment light and small. This presentation will cover considerations that thermal design engineers must address when considering thermal management products for military and avionics environments. Suppliers of thermal management products also need to know how their products will be used and what type of performance data is most relevant to military and avionics designers.

Government funded research in thermal management has been significant over the past several years. Results from this research have included several thermal management technologies that offer the promise of either allowing higher heat dissipation or lower operating temperatures. However, implementing these technologies into fielded systems has been slow and in some cases difficult. The second part of this presentation will discuss some of these candidate cooling methods and discuss why implementing these solutions into military and avionics products does not happen quickly. Design and implementation considerations that need to be addressed by potential thermal management techniques will be discussed.

Luncheon Talk

TBD

Rajesh Nair, Degree Controls, Inc.

Designing and Testing for Thermal Interoperability in an Open (ATCA) Platform

The future of an open platform, such as ATCA, depends on the interoperability between compliant components. It involves interoperability in terms of mechanical, electrical, communications and thermal aspects between components like blades and shelves. Today, reliable removal of heat has become the most challenging bottleneck in the design of a telecommunication product.

Thermal Interoperability among ATCA components is defined as the capability of a compliant shelf to offer capacity to cool predefined power density, AND capability of compliant blades to appropriately utilize available cooling from a compliant shelf. To define thermal interoperability, we need to introduce a few new concepts, such as shelf airflow capacity, shelf airflow distribution, blade airflow impedance and blade power distribution. Communications Platform Trade Association (CP-TA) has defined methodologies for designing and validating for
thermal interoperability. This talk will cover topics such as: Defining thermal interoperability between shelves and blades, Methodology to measure airflow distribution in a chassis, Method to determine airflow impedance of blades, AND Architecture approaches for creating an intelligent thermal management system for open platforms.

Liquid Cooling Economics

The costs of liquid cooling technologies can vary quite a bit; understanding why can help you cut costs and still obtain the performance you need to properly cool your application. Two big cost drivers in cold plate, cooling system, and heat exchanger manufacturing are thermal performance requirements and annual demand, which generally thermal engineers and manufacturing engineers have little or no control over. However, there are numerous other requirements and specifications that thermal and manufacturing engineers do have control over. By involving your manufacturer early in the design process, you'll be able to identify the manufacturing cost drivers and select the most cost effective design.

Not your Grandparents’ Thermoelectrics: Recent Advances in Thermal Management of Electronics

Solid state cooling has been touted as the answer to electronics cooling issues for decades, but often the technology fell far short of what was required. Recent advancements make this technology worth another look, especially for electronic enclosures. This presentation will cover enabling innovations, including thermal isolation and high power density, which make thermoelectric cooling technology competitive for many of today’s “tough to solve” electronics cooling issues.

Rapid Analysis Tools for the Design of Electronics Cooling Systems

Innovative Research, Inc. will present an overview of the software products, MacroFlowTM and TileFlowTM that we offer to the electronics cooling industry.

MacroFlow is a Flow Network Modeling (FNM) tool for rapid thermal design of air- and liquid-cooled electronics systems. It has an intuitive Graphical User Interface (GUI), a comprehensive component library, and a powerful solution methodology that enable rapid and accurate analysis. Case studies involving design of air- and liquid-cooling systems for computer, telecom, and defense electronics will be discussed. TileFlow is a Computational Fluid Dynamics (CFD) software tool for efficient analysis of airflow and temperature distribution in raised-floor data centers. Illustrative applications of TileFlow for designing floor layouts for large-scale, practical data centers will be presented.

The Next Generation of FloTHERM

This presentation will outline the new functionality available in FLOTHERM V7.1. The presentation will be a mix of both PowerPoint material and live demonstration of the new software features. New and updated features include: network assembly for compact component modeling (multi-junction modeling), heat pipe SmartPart, response surface optimization (RSO), (for design optimization and sensitivity of the design to changes in design, manufacturing tolerances and errors in model input data), visualization application window, the Visual Editor (pre- and post-processing module offers real-time result inspection, as well as powerful animation capabilities), DXF translation (for 2D to 3D data conversion)
Andy Manning, Flomerics, Inc.

Michael Wilcox

Nuventix

Highly Reliable Airside Thermal Management with Synthetic Jets

The rise in power dissipation levels for microprocessors and graphics processors has long been the focal point for thermal engineers. Lately, chips that were once an afterthought are starting to eat up more of an already minimal thermal budget, resulting in the need for advanced cooling technologies. This has pushed systems that were once passively cooled into the realm of active cooling. For engineers that have traditionally cooled their systems passively the thought of going to active cooling can be intimidating due to reliability concerns.

Synthetic jets fill the need for forced air cooling with high reliability. Since synthetic jet actuators have no moving parts in friction, SynJet reliability is orders of magnitude higher than traditional fans. The increased reliability combined with the higher heat transfer and lower acoustics of SynJet technology makes it an ideal thermal management solution for many system solutions providers.

A synthetic jet is an intense, small-scale turbulent jet synthesized directly from the fluid in which it is embedded. The jet is formed when fluid is alternately entrained and ejected from the cavity by the motion of a diaphragm bounding the cavity, so that there is no net mass addition to the system but a positive momentum flux in the direction of the jet. The zero-mass flux nature of the jet precludes the need for input piping or complex fluidic packaging. The synthetic jet flow also benefits from the jet ejector effect. The jet ejector consists of a primary high momentum jet inducing a secondary flow within a channel, providing a 2 to 10x increase in the mean flow generated by the jet.

Also SynJets do not have an inlet and an outlet like a conventional fan, thus enabling unique form factors to solve cooling problems that fans simply can't solve and giving thermal and industrial engineers more flexibility in their designs.

SynJet technology enables a plethora of innovative and creative thermal management solutions with high reliability, low acoustics, flexible form factors and low power consumption.

Thermal modeling from Package to Board to System

The range of geometric scales involved in thermal modeling of electronics from package to system presents the thermal analysts with an array of questions. Depending on needs, fine detail analysis may be required for package and board level models but generally not for the system level models. When fine details are required in the thermal model, what is the suitable tool for each scale level to get the modeling done efficiently and accurately? In this talk, a range of approaches and tools available from Ansys Ice Division is presented to help answer these questions. In addition, possible integration of thermal, EM and structural co-simulations in a single modeling environment is briefly discussed.

As electronics systems are getting faster, more compact, portable and hotter, higher performing Thermal Interface Materials will be required. These thermal Interface materials include greases, phase change materials, solders, gap filling liquids/pads, laminating adhesives and liquid adhesives. As much as the end-of-line performance critical; so is the reliability of the materials in the interface over the lifetime of the electronic assembly. The reliability criteria are different for different types of TIMS.

Vacuum Insulated Tubes and Assemblies, and Integrated Cooling Packages for Electronics

Many electronic applications, such as IR Detectors or Super Conduction, require cooling to cryogenic or near cryogenic temperatures. This presents a thermal management challenge to the engineer, designer, and manufacturer of such equipment. Cryoablation surgery in the medical industry faces similar challenges which have been overcome with the use of micro-sized vacuum insulated tubing (to the 1E-5 micron level) and components. As sole supplier of proprietary technology for manufacturing such micro-sized, vacuum-insulated tubing and components, Concept Group, Inc. believes this same technology can be utilized in the electronics industry, specifically in applications requiring cryogenic temperatures in small packages. The talk will focus on the types of proprietary devices and tubing that are currently utilized for cryoablation surgery and how these devices may be utilized for the electronics industry.

Further, through the same vacuum brazing technology utilized for manufacturing vacuum-insulated micro-tubing, it is possible to modify the configuration of several standard electronic packages to allow direct, liquid cooling of these packages without the need for a secondary heat sink or modification of the standard package and heat transfer problems resulting from the boundary between standard electronic packages and a cooling source.

How to Pump More Heat and Use Less Electricity: Cooling Electronics with Thermoelectrics

One of the biggest downsides of many thermoelectric cooling solutions is that almost as much heat is produced as is removed. BSST’s scientists have taken the results of 5 years of research and applied it to electronics cooling to solve this problem. BSST has created advanced designs to reach a cooling capability that is twice that of standard thermoelectric cooling systems. This presentation will cover how the technology works and how it can be applied to particular applications. Audience questions and participation are strongly encouraged.

Darrell Park, BSST LLC

MacroFlow™ – A Productivity Tool for System-Level Thermal Design of Electronic Equipment

Innovative Research will present MacroFlow, an easy-to-use and computationally efficient software based on the Flow Network Modeling (FNM) approach for rapid system-level thermal design. MacroFlow has an integrated Graphical User Interface (GUI) and a powerful solution methodology for quick construction of the network models, rapid solution, and a comprehensive examination of results. MacroFlow contains an extensive library of components with built-in flow and thermal characteristics, and comprehensive vendor databases for accurate prediction of systemwide flow and temperature distributions in a variety of electronics cooling systems. Use of MacroFlow for system-level thermal design results in significant productivity improvements and a shorter design cycle. MacroFlow is widely used for thermal design of air- and liquid-cooling systems in all major computer, telecom, and defense electronics companies.
During the workshop, an overview of the technique of Flow Network Modeling (FNM) will be provided. This will be followed by a demonstration of MacroFlow for the analysis of a practical electronics system. Finally, a variety of case studies involving the use of MacroFlow for thermal design of air- and liquid-cooling systems for servers, telecom cabinets, avionics, and peripherals will be discussed.
Kanchan Kelkar, Innovative Research, Inc.

Airflow Measurement Techniques: An Introduction to Thermal and Airflow Measurements.

This will lead to a focused discussion on airflow testing on ATCA shelves and blades using the CP-TA test tools;
Chassis Scan and Blade Profiler.

Overview:
The introduction to this discussion will review the overall capabilities and techniques of the Degree Controls Center for Airflow and Thermal Testing (CATT). This will lead to an overview of the basic airflow requirements in the CP-TA Interoperability Control Document (ICD 1.0). The workshop will also discuss how to complete the necessary tests within the Test Procedure Manual (TPM 1.0) using the new measurement tools from CP-TA and Degree Controls. Both Blade
Profiler and Chassis Scan will be demonstrated through data collection on actual ATCA hardware.

Jason Lebouef, Thermal Engineer and Laboratory Manager

Vacuum Insulated Tubes and Assemblies, and Integrated Cooling Packages for Electronics

Concept Group will be demonstrated with video and live demonstrations the insulating performance of some of their vacuum insulated micro-tubing products currently being utilized in cryoablation surgery of the prostate (>10% of all prostate procedures use cryoablation surgery). Conceptual liquid cooling integration into standard electronic packages will also be demonstrated.

Paul Stepanoff, Concept Group, Inc.

High Pressure Liquid Pumps for Electronics Thermal Management

High heat load electronics applications require cooling solutions that can remove large amounts of heat in a small space. Micropump, a Idex Company has developed a small, low flow, high pressure pump for high volume applications. This presentation will cover the pump technology and its application in water based and two phase cooling solutions.

Mike Minnick, Micropump Inc.

 

• Join the industry leaders for 2 days of intense learning and brainstorming about the current and future challenges of thermal management in the electronics industry.
• Learn from some of the most prominent authorities in the electronics cooling arena representing some of the world's largest electronic firms and research centers.
• Network with other managers and experts in your field.

Who Should Attend

• Managers in the electronics industry responsible for the thermal performance and reliability of their products
• Thermal design engineers
• Senior executives from companies supplying thermal management solutions
• Scientists in industrial and academic institutions

Fee for the Summit:

$1395 per person

includes:

• Lecture notes (including a CD)

• Continental breakfast

• Lunch

Note: No refund is provided for cancellation after July 15, 2007

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How to Register?

• Online through our secure online processing (Credit Card Payment Only)

[If you have any difficulty with our online processing, please call us at 508-329-2021 or just use the fax form below]

• Fill this form out and fax to CoolingZone at 508-898-2796 or mail to:

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Travel and Lodging

If you are planning to fly into the Boston area you should consider one of the following choices

1. Logan Airport in Boston
2. Providence Airport in Rhode Island

The distance from either airport to Natick is about 40 minutes. It is, however, much easier to get in and out of Providence Airport. The ticket prices are also usually cheaper at Providence Airport. Please make your travel arrangements as soon as possible.

The meeting will start at 8:00 in the morning of every day. It will end at 4:30 PM on each day. Please keep this in mind as you book your return flight.

The event will be held at Crowne Plaza Hotel in Natick, MA. It is located at about 20 miles west of Boston. We have a small block of rooms reserved for $129 per night. Please make your reservation before August 5th to take advantage of the lower rate at the hotel.

The hotel is walking distance from shopping centers, bookstores, etc. There are many excellent restaurants in the area including the famous Legal Sea Foods that is just a block away.

The end of August is a great time to be in New England.

Crowne Plaza Hotel

1360 Worcester Street

Natick, MA 01760

1-800-227-6963

NOTE: Another block of rooms is also being held at The Hampton Inn, Natick.

Hampton Inn, Natick

319 Speen Street

Natick, MA 01760

Tel. 508-653-5000

Please contact Hapmton Inn if there are no vacancies at the Crowne Plaza. Hampton Inn is only a few minutes away from the Crowne Plaza and there is a free shuttle between the two hotels. The rooms are at $132 per night and are being held until August 7th, 2007.

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