Sponsored by CoolingZone and ElectronicsCooling Magazine

REAL Problems ...... REAL Solutions

A Unique Learning Experience

Fully Dedicated to Thermal Management

In Electronics Industry

Register by July 15, 2008 and save $300

In cooperation with the leading suppliers of Thermal Management Solutions

Kaveh Azar, Ph.D.

President & CEO
Advanced Thermal Solutions, Inc.

Keynote Lecture: Challenges in Thermal Management of Electronics for the Next Decade

As the Nineties were the era of access to the Internet, the current and future decade is the era of information delivery speed to the end user.

The magnificence and the ease of availability of data on the Internet has created a significant paradigm shift across the globe as the Internet is becoming the vehicle for business operation and communication. The reliance on the web as the means of data/information exchange has a unique appeal with its extraordinary challenges. The appeal has been in decentralization of any operation with the resulting benefit of office-anywhere-on-Earth. The unique challenges are associated with the speed by which the data is accessed as well as the communication exchange. Therefore, the issue of access-speed for different market segments is providing some interesting challenges with respect to both the electronics and the required power dissipation to deliver such speed.

As the demand for ease and access-speed increases, the current electronics packaging creates an obvious bottleneck with more pressing thermal challenges. As the power dissipation increases, irrespective of user location, e.g. home, under the desk, or a data/central office, managing the thermal issues will pose significant challenges. Every customer premise has its own special requirements that may complicate the required cooling scheme. The cooling constraints associated with customer premises impose stringent necessities on the component, board and system level power dissipation and cooling options. Together, these constraints create a set of opportunities and challenges that will dictate the thermal management requirements for the next decade. The questions that continue to rise are many. How broadly will liquid cooling be deployed in electronics cooling? How do you handle 1-2 kW of electronic power dissipation in residential and office environments? Would refrigeration be an alternative, in a broad sense, for thermal management of such applications, etc.? In this presentation, an attempt is made to shed some light on such challenges, opportunities and questions.

Shahriar Motakef, Ph.D.

President

CapeSym, Inc.

Fundamentals and Applications of Impingement Cooling

Impingement provides one of the highest single phase heat transfer coefficients, for a given fluid velocity. The primary advantage of this technique over other convective techniques is the creation of very small boundary layers on the target surface. Impingement cooling is attractive for high heat flux and electronic cooling applications, because the heat transfer coefficient scales inversely with the characteristic dimension of the impinging stream. Standard micro-fabrication techniques can be used to produce orifices and slots in the range of 100's of microns, resulting in very high heat transfer coefficients. The major challenge in using micro-impingement is replicating the performance of an isolated jet/slot over a large array of jets/slots. Two issues must be addressed here. First, fluid management at the inlet of the jet/slot array as to ensure that the incoming flow is distributed evenly between the jets/slots. Second, fluid management to ensure that the impinging streams do not interfere with each other as they are directed to the outlet of the cooling device. Of these, the latter is a more formidable challenge that requires innovative approaches. Failure to address these issues can easily eliminate advantages of impingement cooling.

Modification of the impinged surface to increase the effective heat transfer surface area can also be used to increase the overall heat transfer. Here, surface modifications must be aligned with the impingement flow structure to maximize heat removal rates.

Impingement can also be used to significantly increase Critical Heat Flux (CHF) in boiling heat transfer. By effective removal of bubbles generated at the boiling surface, impingement can be used to delay formation of the vapor blanket over the target to heat fluxes much higher than typical nucleate boiling CHF values. Micro-impingement in boiling applications has been shown to provide significant increases in heat removal rates and CHF at relatively low flow rates.

Inn this talk we will start by reviewing fundamentals of impingement and conduct a survey of experimental results and correlations. Attention will be then placed on micro-impingement in single phase and two-phase applications to achieve high heat transfer coefficients over large areas. Experimental and modeling results on micro-impingement by air and liquids, as well as in two-phase applications will be presented. We will also discuss approaches to enhancing the structure of the target surface to effectively leverage the features of impingement streams. We hope to leave the audience with a concrete understanding of the merits and challenges of impingement cooling.

John Pan, Ph.D.

Assistant Professor

Department of Industrial and Manufacturing Engineering

California Polytechnic State University

The Effects of Temperature on Lead-free Solder Joint Reliability

Ten trillion solder interconnections are made annually in the electronics industry for cell phone, computer, communication, medical, aerospace, and military applications. The solder interconnection is the primary interconnection in microelectronics packaging because it provides the mechanical and electrical interconnection between the package and the printed circuit board (PCB). If one interconnection fails in a PCB, the whole board and even the whole system may fail. Therefore, establishing and improving the reliability of solder interconnections is vital to the $1.3 trillion electronics industry.

Unfortunately, determining the reliability of solder interconnections is one of the most difficult and complicated problems in microelectronics interconnection and packaging. The fundamental technical challenge is further complicated by regulatory requirements to eliminate lead (Pb) from solders used in electronics products. To protect human health and the environment, the European Union (EU) banned the use of lead in electronics products (except those with exemptions) after July 1, 2006. This legislation has already had a tremendous global impact on the electronics industry. That impact is likely to increase in the future, because at present the EU law focuses primarily on low-reliability consumer products. High-reliability applications such as medical equipment, automotive, aerospace, military equipment, and high-end computers are presently exempted from the law, primarily because the reliability of lead-free solder interconnections is not well understood. In the near term, it is highly likely that the majority of electronic products, including those used in high-reliability applications, will eventually use lead-free soldering technology due to the limited availability of tin-lead components.

This talk will present the effects of temperature on solder joint reliability. Topics include what reliability is, how to perform reliability testing and data analysis, various thermomechanically-induced failures such as fatigue, creep, and delamination, failure analysis methods, and design for reliability. Application examples will be given as well.

Tony Kordyban, MS

Thermal Specialist

Emerson Network Power

Common Pitfalls of Air Cooling Electronics

One learns ten times as much from a mistake as from a success.  This talk aims for that tenfold increase in educational value by sharing some lessons learned the hard way, when air cooling of electronics didn't go quite the way it was supposed to.  It includes the seven reasons that heat sinks don't work,  how to know when a fan performance curve doesn't tell how a fan performs, and how ordinary room temperature has now become the worst case operating condition for some kinds of electronics.   Knowing about these pitfalls is the first step in avoiding them in your next project.

Carl Zweben, Ph.D.

Advanced Thermal Materials Consultant

High-Performance Thermal Management Materials

In response to well-recognized needs, there have been revolutionary advances in thermal management materials in the last few years. There are now many low-CTE, low-density materials with thermal conductivities up to 1700 W/m-K. Major material suppliers have become involved. Advantages are: increased reliability; reduced junction temperatures, cost and weight; low-CTE, thermally conductive PCBs, potentially eliminating the need for underfill; CTE matching allows direct attach with hard solders. There are a large and increasing number of microelectronic and optoelectronic applications, including: PCBs and PCB cold plates; heat sinks; microprocessor, RF and power modules; heat spreaders and sinks; laser diode and LED modules; thermoelectric coolers; plasma and LCD displays; detectors; and photovoltaics. This presentation covers the large and increasing number of advanced thermal management materials, including properties and the growing array of applications.

Michael Ellsworth, Jr., MS, PE

Sr. Technical Staff Member

Advanced Thermal laboratory Systems and Technology Group

IBM Corporation

A technical perspective and review of water cooling technology as implemented through 5 generations of IBM's high performance computing systems from the S360/91 to the recently announced IBM Power 575 supercomputing system will be given. The prior applications serve to demonstrate the viability and reliability of indirect water-cooling in large scale computer systems; thereby providing a solid example for current and future applications of water cooling in high performance computing systems. The use of hybrid air-to-water cooling and then indirect (cold plate) water cooling in earlier IBM systems will be described. The use of a Cooling Distribution Unit (CDU) to control cooling system water temperature, distribute water to multiple racks and serve as a buffer between system water and customer facility water will also be discussed. Finally, the new IBM Power 575 water cooling system will be described. In all cases attention will be given to how and why water cooling was implemented to provide the required cooling capability while providing high availability and maintaining ease of serviceability.

Theo Treurniet, Ph.D.

Senior Architect

Thermal management

Advanced Development Lighting

Philips Lighting

LEDs are a big opportunity for the lighting industry. LEDs are energy efficient and have the potential to be very reliable. Furthermore, they overcome a number of drawbacks of conventional lighting solution and provide a number of new features that are highly valued by the market.

One of the biggest technical challenges in the LED industry is thermal management. The current LEDs generate in the order of a few watts of heat per square millimeter die area. For the various general lighting applications, power levels of a few till about a hundred watts per system are required. This, together with a drive for miniaturization, high reliability and low cost solutions pushes the existing technologies to the edge and often requires new solutions.

The drive to higher power densities asks for packaging and substrate solutions provide optimal heat spreading, combined with a good electrical isolation. High power levels, combined with a drive for miniaturization asks for a solution beyond natural convection. However, current active cooling solutions provide a big challenge in terms of reliability, noise levels and cost. Next to that, optical requirements and high temperature operation provide new challenges in terms of reliability.

This presentation will discuss the thermal characterization of LED systems, the thermal solutions that are applied in existing products and the remaining challenges in different LED Systems.

Bruce Guenin, Ph.D.

Principal Research Engineer

Microelectronics Group

Sun Microsystems

Recent Advances in the Thermal Management of Electronic Components

Since the development of the integrated circuit, a key driver pushing the development of new packaging technologies has been the need to achieve higher levels of integration. In the past, this has been the result of putting more functionality on a single silicon chip. In recent years, this has been achieved by putting more chips into dense 3-D arrays in so-called “System in Package” configurations.

In computer technology, with the advent of multi-core processors, both of these trends are operative. Multi-core processors, with an appropriately designed operating system, can do the digital workload of many traditional single-threaded processors. However, to deliver on their computational capability, multi-core processors need to access much larger blocks of memory than their single-core brethren. 3-D packaging technologies offer a potential solution to this memory access problem, by putting larger amounts of memory within electrical signaling distances from the processor.

This trend toward packing greater amounts of silicon within a single package and more packages in a given volume brings greater performance, but also a greater challenge in extracting the heat at both of these length scales. This presentation will examine these challenges and various thermal management options for dealing with them.

Luncheon Talk

Challenges in Thermal Management of Electronic Systems

Professor Dereje Agonafer
University of Texas at Arlington, and
Dr. Martin Luther King, Jr. Visiting Professor
Massachusetts Institute of Technology

Abstract:

Following Moore’s Law, the number of transistors on a chip doubles every eighteen months leading to over a billion transistors on current high density interconnect microprocessors. This has resulted in a fast increasing power density and coupled with the increased dynamic power, is the fast increasing static power caused by leakage current (the gate oxide thickness for 90 nm nodes is only 1.2 nm). The push for multi-core processors and high k dielectric is partly attributed to this leakage current. Future directions of microprocessor performance will not be dictated by just “Moore’s Law” but by the so called “More than Moore” hypothesis. As such, architecture including highly non-uniform power with possible variability in supply voltage to individual cores will play a significant role which in turn will make local hot spots even more challenging. In this presentation, the presenter will discuss the studies that he and his graduate students in cooperation with numerous industry colleagues have conducted in the last ten years in the area of thermo/mechanical challenges in electronics cooling/packaging. The discussion will include stacked packaging and the related thermo/mechanical challenges; efforts to reduce thermal resistance due to highly non-uniform chip power distribution, development of a best known method for design of microprocessors based on power and thermal-architectural co-design, thermal challenge related to leakage current, effect of weight of heat sink assembly on mechanical reliability of a wire bonded plastic ball grid array package, bump electromigration and back end design rules, development of constitutive equations for lead free solders and some discussion on data centers and related energy management.

Bio:

After receiving his PhD, Professor Agonafer joined IBM in 1984. After 15 years at IBM, in 1999, Dereje joined the University of Texas at Arlington as Professor and Director of Electronics, MEMS, and Nanoelectronics Systems Packaging Center). He currently advises 16 graduate students including 6 PhD’s. Since joining UTA in 1999, he has graduated 58 graduate students. The research areas cover a broad area in electronic packaging. Professor Agonafer has published over 100 conference and journal papers and eight issued patents. In April 1998, Dereje was the recipient of the “The University of Colorado School of Engineering Distinguished Engineering Alumni Award (DEAA) in the category of Research and Invention.” In November 1998, he received “The Howard University Distinguished PhD Alumni Award.” Also, in November 1998, he received “ASME K-16/EEPD Clock Award for Outstanding Contribution in Computer Aided Thermal Management of Electronic Packages.” In 2002, he received ASME International Electronic and Photonic Packaging Division Highest Division Award for “Outstanding Contributions to the Area of the Application of the Science and Engineering of Heat Transfer to Electronic and Photonic Packaging.” He is currently the Editor in Chief of ASME Press Book Series in Electronic Packaging and Associate Editor of the Journal of Electronic Packaging. Professor Agonafer is a Fellow of the American Society of Mechanical Engineers International and a Fellow of American Association for the Advancement of Science. In March 2008, he received the IEEE SEMI-THERM Symposia “Significant Contributor to the field of semiconductor thermal management or Thermi Award.” In March 2005, 2006 and 2007 and 2008, Professor Agonafer received awards from University of Texas at Arlington for having “A strong record of external funding and scholarly achievement.” He is currently on a leave of absence as a Dr. Martin Luther King Visiting Professor at MIT in the Mechanical Engineering Department.

James Burnett,

Director of Government Business Development, Aspen Systems Inc.

Vapor Cycle Cooling for Mobile Electronics

Aspen Systems Inc. will discuss the features, capabilities, and
performance attributes, of vapor cycle cooling systems. In addition
to capabilities, opportunities for application to mobile electronics
systems will be discussed. The discussion will primarily be focused
on the enabling of COTS electronics in desert environments.
Environmental control system performance on a transit case will be
discussed.

Alexandra Francois-Saint-Cyr,

Applications Engineering Manager, Flomerics Inc.

Updates to FloTHERM V8

There are significant upgrades to the EDA Interface, SmartParts and graphical viewing capabilities which will be announced.

Thermal Management of Future Electronic Products Through Airflow Monitoring

Most products today are cooled using airflow. Though the temperature
rise is the primary factor in thermal control one also has to consider
the power required to cool as an important factor. If airflow is too
low the temperature rise can be very high, and as the airflow
increases beyond some point the reduction in temperature rise is
minimal. Power required to operate fans at higher speeds can be
significantly higher leading to negative net returns.

Temperature rise normally has a delayed response to a change in
airflow due to the thermal inertia of the hardware. This means that
the start of an impending temperature rise can be predicted through
monitoring airflow. This early warning may be used for active airflow
control or for graceful shutdown if the failure is critical.

In short, direct airflow measurement at critical locations on the
board will soon become a necessity for future applications in markets
such as telecommunications, servers, military and medical systems.
Electronic products with high power density and expected high
availability are the first ideal candidates.

Use of Flow Network Modeling for Rapid Design of Electronics Cooling Systems

The Flow Network Modeling (FNM) technique involves representation of an electronics cooling system as a network of components and flow paths whose behavior is described by overall flow and thermal characteristics. Flow and thermal analysis over the network allows quick and accurate evaluation of the interaction among the components for predicting the performance of the cooling system. The power of this technique is realized through the software tool MacroFlowTM. It features an intuitive Graphical User Interface (GUI), a comprehensive component library, and a powerful solution methodology to enable rapid evaluation of various design options, sizing of components, and investigation of "what if " scenarios. The presentation will provide an overview of the FNM technique, discuss capabilities of MacroFlow, and illustrate case studies involving the design of air- and liquid-cooling systems for computer, telecom, and defense electronics.

 Heat Spreading Solutions: Vapor Chamber and HiK Aluminum Plate Technologies

This presentation will focus on two heat spreading technologies that have been beneficial to the increasing thermal needs of the electronics industry. Both technologies rely on liquid to vapor phase change characteristics to transport high heat fluxes for improved heat dissipation. Vapor chambers are planar heat pipes that are capable of handling heat fluxes greater than 25W/cm2. Their low thermal resistance, less than 0.15°C/W, yields small temperature variations across its surface. HiK Aluminum plates have high effective thermal conductivities due to embedding heat pipes into an aluminum plate. Their keffective range is from 500 to 800 W/mK. Either of these technologies has been chosen by the electronics industry depending on the application’s performance and cost requirements. This discussion will include performance capabilities, application examples, manufacturing challenges, and future technology improvements.

 Radesh Jewram

Senior Research and Development Engineer, The Bergquist Company

 Silicone Free Thermal Interface Materials - Applications and Design Considerations

Silicone based thermal interface materials have been designed into
most applications because of its high continuous use temperature, low
modulus and high reliability. There has been an increasing need for
silicone-free materials in disc-drive, lighting, aerospace and other
applications. The concerns of silicone migration from the thermal
interface materials include application failure as well as
manufacturing/assembly concerns. This paper will address the different
types of silicone migration from the interface materials and their
failure modes and applications where silicone-free materials are
needed.

Matching Cooling Performance with System Impedance Airflow / Fan Noise Optimization

“Electronics cooling by method of electro-mechanical cooling fans is a mature practice, involving a mature product line. However, the alignment of the cooling solution with the system chassis remains just as much a ‘black art’, as a science among product users. The causes include inconsistencies among cooling fan manufacturers on product performance, unfamiliarity with accurate noise measurement, and performance benchmarks of fan operation in free-air versus actual performance within a specific system impedance. JMC Products will explain some common misunderstandings of what affects airflow in fan design and illustrate a preferred approach to optimal airflow within the system while limiting the noise signature of the cooling fan.”

 

• Join the industry leaders for 2 days of intense learning and brainstorming about the current and future challenges of thermal management in the electronics industry.
• Learn from some of the most prominent authorities in the electronics cooling arena representing some of the world's largest electronic firms and research centers.
• Network with other managers and experts in your field.

Who Should Attend

• Managers in the electronics industry responsible for the thermal performance and reliability of their products
• Thermal design engineers
• Senior executives from companies supplying thermal management solutions
• Scientists in industrial and academic institutions

Fee for the Summit:

$1095 ($1395 after July 15, 2008) per person

includes:

• Lecture notes (including a CD)

• Continental breakfast

• Lunch

Note: No refund is provided for cancellation after July 15, 2008

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How to Register?

• Online through our secure online processing (Credit Card Payment Only)

[If you have any difficulty with our online processing, please call us at 508-329-2021 or just use the fax form below]

• Fill this form out and fax to CoolingZone at 508-898-2796 or mail to:

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Travel and Lodging

If you are planning to fly into the Boston area you should consider one of the following choices

1. Logan Airport in Boston
2. Providence Airport in Rhode Island

The distance from either airport to Natick is about 40 minutes. It is, however, much easier to get in and out of Providence Airport. The ticket prices are also usually cheaper at Providence Airport. Please make your travel arrangements as soon as possible.

The meeting will start at 8:00 in the morning of every day. It will end at 4:30 PM on each day. Please keep this in mind as you book your return flight.

The event will be held at Crowne Plaza Hotel in Natick, MA. It is located at about 20 miles west of Boston. We have a small block of rooms reserved for $139 per night. Please make your reservation before August 5th to take advantage of the lower rate at the hotel.

The hotel is walking distance from shopping centers, bookstores, etc. There are many excellent restaurants in the area including the famous Legal Sea Foods that is just a block away.

The end of August is a great time to be in New England.

Crowne Plaza Hotel

1360 Worcester Street

Natick, MA 01760

1-508-653-8800

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