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  • Evidence discovered of heat moving through graphite the way sound moves through air

    Researchers at the Massachusetts Institute of Technology (MIT) in Cambridge, Mass. discovered a new mode of heat transport, dubbed second sound, in graphite, where heat moves...
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  • Light is used as a switch to control the thermal conductivity of novel polymers

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    Researchers from the U.S. Department of Energy (DoE) Lawrence Berkeley National Laboratory (Berkeley, Calif.) developed a method for stacking two-dimensional layers of...
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  • Scientists use hydrogels and solar power to produce moisture harvester for clean water

    Researchers at the University of Texas (UT) at Austin utilized solar power and hydrogels, gel-polymer hybrids that can retain large amounts of water, to produce a device that...
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  • Scientists create ultra-lightweight ceramic aerogel that can withstand extreme temperatures

    Researchers from the University of California Los Angeles (UCLA), and eight other research institutions, created an ultra-lightweight, durable, ceramic aerogel that can...
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ATS continues monthly series with webinar on limits of air cooling and growth of liquid

Advanced Thermal Solutions, Inc. (ATS) is pleased to announce the next topic in its series of monthly, online webinars covering different aspects of the thermal management of electronics will be Limits of Air Cooling and the Role of Liquid Cooling in Growing Thermal Demands. details>>

Wiwynn Showcases Immersion Cooling Solutions at OCP Global Summit 2019

Wiwynn demonstrates its two-phase immersion cooling systems designed with Open Compute Project (OCP) servers to address the fast-growing power consumption and computing density while providing power and cooling efficiency, serviceability and reliability advantages. details>>

Ventec Showcasing Thermal Management and IMS Solutions for Power Electronics at APEC

Ventec International Group will showcase its latest power electronics PCB material technology innovations at APEC 2019, which is taking place at the Anaheim Convention Center from March 18-20 in Anaheim, Calif. details>>

Forced Physics DCT to Unveil First Installation Showcasing Patented Cooling Technology

Forced Physics DCT will showcase its patented JouleForceTM server cooling technology in an operational demo suite opening at the Phoenix location of H5 Data Centers on March 21. details>>

Altus Capital buys Thermal Solutions Manufacturing

Altus Capital Partners, an investment firm focused on middle market manufacturing companies headquartered in the U.S., announced the acquisition of Thermal Solutions Manufacturing, Inc., a nationally recognized manufacturer and distributor of heat exchange and thermal management products. details>>

Molex and Innovium Demonstrate Switches Designed with BiPass I/O and TERALYNX Switch Silicon

Molex, a leading global manufacturer of electronic solutions, has teamed with Innovium, a leading provider of networking switch solutions for data centers, to demonstrate a switch system design using Molex-s BiPass I/O technology with Innovium 12.8Tbps TERALYNX Switch ASIC at the OCP Global Summit. details>>

MaxLinear to Showcase New Switch Mode DC/DC Dual 13A Power Module at APEC 2019

MaxLinear, Inc. will showcase its latest power management products at booth 302 at the Applied Power Electronics Conference (APEC) in Anaheim, Calif. from March 18-20, 2019. details>>

Dengrove DOSA-footprint DC/DC converters up to 30W maximize power density and efficiency

For applications that require high power density and high efficiency, Dengrove Electronic Components is stocking RECOM RPM3.3 and RPM5.0 non-isolated DC/DC converters in power ratings from 3.3W to 30W. details>>

Western Digital Award-Winning WD Blue SSD Goes NVMe

Western Digital Corp., a global data infrastructure leader, is accelerating the NVMe transition of value-PC storage by adding an NVMe model to its award-winning WD Blue solid-state drive (SSD) portfolio, the WD Blue SN500 NVMe SSD. details>>

Dana and Hyliion announce strategic partnership

Dana Inc. and Hyliion Inc. announced that they have entered into a strategic partnership. details>>

Phononic Announces General Availability of Non-Hermetic Thermoelectric Cooler

Phononic, the global leader delivering disruptive and sustainable solid-state thermal management solutions, announced the general availability of ReefTEC TM, its proprietary Non-Hermetic Compatible Thermoelectric Cooler (TEC) Platform. details>>

Indium Launches Die-Level Bonding Solder Composite

Indium Corporation has launched InFORMS ESM02, a reinforced matrixed solder composite specifically designed to produce consistent bondline thickness for die-level attach applications. details>>

Teledyne LeCroy Demonstrates Protocol Analyzer Platform for USB4 and Thunderbolt 3 Systems

Teledyne LeCroy, Inc., the worldwide leader in USB protocol test solutions and a business unit of Teledyne Technologies Inc., announced and demonstrated the first protocol analyzer platform for testing next-generation USB4 and Thunderbolt 3 systems. details>>

Hackaday Flexible PCB Contest Launches on March 6

Digi-Key Electronics and Hackaday are teaming up for the Flexible PCB Contest and challenging makers to get creative with a board design 2 square inches (13 square cm) or smaller. details>>

Fractal Design introduces Prisma fan series

Fractal Design announced the release of the new Prisma family of LED case fans with Adjust R1 RGB Controller accessory. details>>

PolarFire FPGA-Based Solution Enables Lowest-Power 4K Video and Imaging Applications

The new PolarFire FPGA imaging and video solution from Microchip Technology Inc. addresses these challenges by delivering capabilities superior to alternative technologies to support resolution as high as 4K in small, low-power form factors necessary for a wide variety of imaging and video applications. details>>

Qorvo Ships 100 Million RF Devices for 5G Wireless Infrastructure

Qorvo, a leading provider of innovative RF solutions that connect the world, announced that it has shipped over 100 million 5G wireless infrastructure components since January 2018. details>>

TI Partners with Digi-Key to Sponsor TechMatch Start-Up Competition

Twelve start-ups entered the race for prizes totaling over $34,000 at the TechMatch start-up competition run by semiconductor manufacturer Texas Instruments (TI) and partners including Digi-Key Electronics, a global electronic components distributor, on January 31, 2019 in Bielefeld, Germany. details>>

Micron Accelerates the Mobile Computing Experience With Introduction of New Client SSD

Micron Technology, Inc. added a new cost-efficient solid-state drive (SSD) to its client computing portfolio. details>>

Future Tech Enterprise, Inc. Introduces Collaborative Virtual Reality (CVR) Appliance

At the GPU Technology Conference (GTC), Future Tech Enterprise, Inc. will debut its new 3D-printed, Collaborative Virtual Reality (CVR) appliance. details>>

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