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  • Supersolder boasts twice the thermal conductivity of conventional solders

    Researchers at Carnegie Mellon University (Pittsburgh, Pa.) and the National Renewable Energy Laboratory (NREL) have created a new material that can fill the role of...
    details>>
  • UIC researchers demonstrate novel method for cooling hotspots in electronics

    Researchers from the Advanced Semiconductor Materials and Devices Laboratory at the University of Illinois - Chicago (UIC) have produced a new technique for cooling hotspots...
    details>>
  • How can thermocouples be designed for accurate measurement at microscale

    In a recent article from Advanced Thermal Solutions, Inc. (ATS), a leading-edge engineering company based in Norwood, Mass., the design for thermocouples was examined to...
    details>>
  • Simulations reveal key principles for developing next-gen carbon fibers

    A research team from the Korea Advanced Institute of Science and Technology (KAIST) in Daejeon, South Korea used computer simulations to determine how the alignment between...
    details>>
  • New research demonstrates high-res imaging of nanostructure surfaces is possible

    Researchers from Finland and China have demonstrated that extremely high-resolutions images of the surface of silver nanoparticles, including the individual parts of...
    details>>
  • Simple and versatile strategy proposed for preparing carbon nanomaterials

    Researchers at the University of Science and Technology of China (USTC) in Hefei have proposed a new approach that simplifies the process and is versatile enough to create...
    details>>
  • Superflexible aerogels are highly-efficient absorbents, thermal insulators and pressure sensors

    Researchers from Kyoto University (Japan) have demonstrated a new class of highly-elastic aerogels that avoid the typical brittleness of these materials and can be produced...
    details>>
  • Rare earth compound demonstrates unusual properties, could lead to new class of materials

    Scientists at the U.S. Department of Energy Ames Laboratory (Ames, Iowa) have discovered an unknown discontinuous magnetoelastic transition in a rare earth compound composed...
    details>>
  • What are effect of vacuum and fill ratio on thermal performance of heat pipes

    A recent article from Advanced Thermal Solutions, Inc. (ATS), a leading-edge engineering company based in Norwood, Mass. focused on the thermal management of electronics,...
    details>>

ATS and Richardson RFPD announce new distribution partnership

Advanced Thermal Solutions, Inc. (ATS), a leading-edge thermal engineering and manufacturing company focused on the thermal management of electronics, and Richardson RFPD, an ARROW Company and specialized electronic component distributor focused on RF, wireless, IoT, and power technologies, are pleased to announce a new distribution partnership. details>>

Epoxy Adhesive Designed for Heat Sink Bonding

The 70-3812NC Aluminum Filled Epoxy Adhesive from Epoxies, Etc. has been specifically designed for bonding heat sinks that require high thermal conductivity and strong structural bonds. details>>

Baknor releases design for a high performance, compact, liquid cold plate

Baknor have developed various solutions that improve performance, essential for effective operation of your energy storage and power electronic requirements in all climates. details>>

SiTime and Intel Announce Collaboration on MEMS Timing for 5G

SiTime Corporation, a leading provider of MEMS timing, and Intel today announced a collaboration to work together on integrating timing solutions for Intel 5G multi-mode radio modems. details>>

Parker Aerospace and GKN Aerospace Sign Technology Development Agreement

Parker Aerospace, a business group of Parker Hannifin Corporation, the global leader in motion and control technologies, announceD that its Gas Turbine Fuel Systems Division has entered into a technology development agreement with GKN Aerospace Sweden AB. details>>

Danfoss acquires stake in California heat exchanger technology start-up

Danfoss has purchased minority shares in California-based start-up Nelumbo. details>>

Pulse Electronics Releases PA500X Series High Current, Low Profile SMT Inductors

Pulse Electronics - Power, a leading provider of electronic components, introduces a new series of high current, low profile SMT inductors. details>>

DASHFLOW 360 AIO Liquid Cooler Released by ID-COOLING

ID-COOLING a cooling solution provider focusing on thermal dissipation and fan technology research and production for over 10 years, announced DASHFLOW 360 AIO water cooler. details>>

TAT Technologies signs a new contract with UTC Aerospace Systems

TAT Technologies Ltd., a leading provider of services and products to the commercial and military aerospace and ground defense systems, announced that its subsidiary, Limco Airepair, Inc. has signed a three-year contract with UTC Aerospace Systems to support its heat transfer MRO business as a licensed repair station. details>>

ATS Expanding Heat Pipe Line to Provide Industry's Broadest Off-the-Shelf Selection

Advanced Thermal Solutions, Inc. (ATS), a leading-edge thermal engineering and manufacturing company focused on the thermal management of electronics, is pleased to announce the expansion of its line of high-performance, off-the-shelf, flat and round heat pipes. details>>

Intertec launches passively cooled enclosures for field-based energy storage systems

At EES, Intertec is launching a range of ultra-robust enclosures for protecting field-based energy storage and electronics equipment. details>>

Acromag Quad-port Gigabit Ethernet XMC Modules Available in RJ45, SFP, and Rear I/O Versions

Acromag XMC610 Series modules provide four independent gigabit Ethernet interface ports when used on VME, VPX, PCIe or other embedded computing carrier boards. details>>

Boyd Corporation Acquired by Affiliates of Goldman Sachs from Genstar Capital

Boyd Corporation, a leading global provider of highly-engineered thermal management and environmental sealing solutions, announced that it has entered into a definitive agreement to be acquired by affiliates of Goldman Sachs. details>>

Modine Unveils Revolutionary BMS Monitoring System at Cultivate 2018

Modine Manufacturing Company, a leader in technology in the HVAC industry, showcased the revolutionary Building Management System (BMS) monitoring system at Cultivate 2018 in Columbus, Ohio. details>>

CORSAIR Launches New Hydro Series H100i PRO Liquid CPU Cooler

CORSAIR, a world leader in PC gaming peripherals and enthusiast components, launched a new addition to its bestselling Hydro Series liquid CPU coolers, the CORSAIR Hydro Series H100i PRO RGB 240mm Liquid CPU Cooler. details>>

Arrow Electronics Receives Microsoft Award for its Cloud Solutions Growth

Arrow Electronics, Inc. was awarded the Microsoft U.S. Partner Award for highest cloud solution provider indirect revenue growth this year. details>>

ITT Cannon Supplies Ultra-Fast, Liquid Cooled High Power Charging Solutions for Efacec

ITT Cannon announces an extended contract with Efacec Electric Mobility, a leading global provider of safe and clean energy solutions for the electric mobility market. details>>

Polyplastics Uses Computer-Aided Engineering (CAE) to Forecast Parts Deformation

Polyplastics Co., Ltd., a leading global supplier of engineering thermoplastics, is successfully utilizing computer-aided engineering (CAE) analysis to forecast parts deformation during the reflow process when manufacturing connector parts made of liquid crystal polymer (LCP). details>>

Henkel drives the future of e-Mobility

Building on years of experience and expertise in engine and powertrain applications, Henkel is actively investing in new technologies and products for efficient large-scale manufacturing of safe and reliable electric drive systems. details>>

ATS Announces Live Webinars on Thermal Management of Electronics

Advanced Thermal Solutions, Inc. (ATS), a leading-edge thermal engineering and manufacturing company focused on the thermal management of electronics, is pleased to announce a series of monthly, online webinars covering different aspects of the thermal management of electronics. details>>

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