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  • Scientists devise new strategy for improving heat transfer efficiency of condensers

    A team of scientists from Colorado State University (CSU) in Fort Collins, Colo. have devised a knife-like ridge architecture on superomniphobic surfaces that causes droplets...
  • Researchers modify semiconductors at atomic level to produce smallest 3-D transistors

    Researchers from the Massachusetts Institute of Technology (MIT) in Cambridge, Mass. and the University of Colorado (Boulder, Colo.) have demonstrated a microfabrication...
  • New material switches from conductor of electricity to insulator without altering atomic structure

    Researchers from the University of Wisconsin - Madison have developed a new material, based on vanadium dioxide, which transitions from conductor of electricity to...
  • Researchers design passive cooling system that could provide refrigeration for off-grid locations

    Researchers at the Massachusetts Institute of Technology (MIT) have devised a new passive cooling solution that uses inexpensive materials, requires no fossil fuel-generated...
  • Researchers show possibility of supercomputers without waste heat, reducing power consumption

    Scientists at the University of Konstanz (Germany) have demonstrated that lossless electrical transfer (superconductivity) of magnetically encoded information is possible,...
  • X-Ray imaging technique could control magnetic structure of materials for next-gen electronics

    Researchers from Rutgers University (Newark, N.J.) and the U.S. Department of Energy (DOE) Brookhaven National Laboratory (Upton, N.Y.) have demonstrated a new X-Ray imaging...
  • Researchers design thermal energy storage device that uses molten silicon in insulated tanks

    Researchers at the Massachusetts Institute of Technology (MIT) in Cambridge, Mass. have demonstrated a novel renewable energy storage system that stores excess thermal energy...
  • KIT researchers study competing states in high-temperature superconductors

    Researchers at the Karlsruhe (Germany) Institute of Technology (KIT) used high-resolution inelastic X-Ray scattering to discover that high uniaxial pressure creates a...
  • Researchers develop method for attaching heat sink without need for thermal interface materials

    Researchers at the University of Binghamton (N.Y.) have developed a process for laser metal printing a heat sink directly onto silicon, removing the need for thermal...

Future Facilities announces the release of its latest version of 6SigmaET

Future Facilities, a leading producer of engineering simulation software, has announced that 6SigmaET Release 13 is available for download. details>>

ANSYS Develops Open File Format for Thermal Simulation

Electronic component manufacturers and their customers can now easily share design models between different thermal simulation toolsets thanks to the new open neutral file format developed by ANSYS. details>>

Third set of the Encyclopedia of Thermal Packaging has been released

Set 3 of the Encyclopedia of Thermal Packaging, an encyclopedia compiled in four multi-volume sets, has now been released. details>>

TEA Thermal Test Chip Wafers Available In 8-inch Wafer Form

Thermal Engineering Associates, Inc. (TEA) announces that its industry leading Thermal Test Chip (TTC) will soon be available in 8-inch (200mm) diameter wafers. details>>

N2Power and New Yorker Electronics Sign Distribution Agreement for Advanced Power Supplies

New Yorker Electronics has teamed up with N2Power Power Solutions to develop a global supply chain for Power Supply products. details>>

Highlander Partners Announces sale of Ascend Custom Extrusions Assets to Tower Extrusions, Ltd.

Highlander Partners, L.P., a leading middle market private investment firm based in Dallas, Texas, announced the sale of substantially all of the assets of Ascend Custom Extrusions LLC to Tower Extrusions, Ltd. details>>

Supermicro Unleashes All-Flash NVMe 1U Petabyte Scale Systems at Gartner Data Center Conference

Super Micro Computer, Inc. (SMCI), a global leader in enterprise computing, storage, networking solutions and green computing technology, showed a new 1U system that supports up to 1 Petabyte (PB) of all-flash NVMe. details>>

Maxim Integrated SIMO PMICs Shrink Power Regulator Size in Half for IoT Devices

Designers of small, battery-powered electronics can enhance the user experience by extending battery life and further shrinking device size with six new low-power power-management integrated circuits (PMICs) from Maxim Integrated Products, Inc. details>>

Razer Redefines the Ultraportable Laptop with new Blade Stealth

Razer, the leading lifestyle brand for gamers, announced the release of their redesigned 13-inch ultraportable laptop line consisting of three new configurations. details>>

Exergen Global thermal management sensors provide accurate blood temperature measurement

Exergen Global announced that its Micro IRt/c-HB infrared non-contact sensors are being used to measure blood product temperatures in the ThermaCor 1200 Rapid Thermal Infuser designed and developed by Smisson-Cartledge Biomedical, LLC and manufactured by Sparton Medical. details>>

ATS Provides Thermal Management Consulting, Products, and Resources for Cooling PCIe Cards

ATS is an industry-leader in thermal management of electronics and has unique experience in cooling PCIe cards and the systems that include them. details>>

New heat sinks for BGA from Fischer Elektronik

For thermal dissipation of electronic devices or integrated circuitry in the casing design BGA (Ball Grid Array) Fischer Elektronik extends the wide range of products by additional heat sink solutions. details>>

New CPC QD Solution Optimizes HPC Liquid Cooling

CPC (Colder Products Company), part of Dover and maker of quick disconnects (QDs) designed specifically for liquid cooling use, introduces its PLQ2 high-performance thermoplastic connector. details>>

Alpha Preforms Improve Thermal Management on BTCs

Alpha Assembly Solutions has recently introduced ALPHA AccuFlux BTC-578 Solder Preforms, designed to enhance reliability and heat transfer through the reduction of voiding under bottom termination components (BTCs). details>>

3U VPX System with a High-Performance Processor and Four Peripheral Slots

Concurrent Technologies launches SY TR2/525, a 3U VPX development system complete with an 8 or 12-core computing board that has a direct PCI Express link to four slots for additional peripheral boards. details>>

Reflex Photonics launches 24-lane 150G full-duplex embedded optical transceivers

Reflex Photonics Inc. has developed compact 150G full-duplex (12+12) 12.5Gbps/lane optical fiber transceivers for harsh environment applications in Aerospace and Defense. details>>

Power Integrations Launches 98.5 Percent-Efficient High Voltage BLDC Motor Driver IC Family

Power Integrations, the leader in high-voltage integrated circuits for energy-efficient power conversion, today announced the release of its BridgeSwitch integrated half-bridge (IHB) motor driver IC family. details>>

EkkoSense extends European network, partnering with Rentaload

EkkoSense, the UK-based data center M&E Capacity Planning and Simulation specialist, has announced a software partnership with Rentaload, the leading European load bank rental company. details>>

RCM Technologies, Inc. Announces Acquisition of Thermal Kinetics

RCM Technologies, Inc. announced the acquisition of Thermal Kinetics, an established Buffalo-based engineering company providing full service process equipment supply, engineering, development and design services for construction and industrial customers. details>>

Risen Energy mass-producing first GW scale double-side AlOx passivated PERC cell Fab

Risen Energy Co., Ltd. has given a keynote speech focusing on the latest update involving the double-side-AlOx-passivated PERC cell in the 14th China Solar-grade-silicon and PV Conference (14th CSPV) in Xi'an, Shaanxi province, China. details>>

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