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  • Researchers develop method for switching heat on and off in electronics

    A team of researchers developed a new technology that breaks the heat flow between a hotter region and a colder region, in effect allowing engineers to turn heat on and off.
  • Improved fabrication methods developed for nano-structures for electronics

    Researchers created a more efficient fabrication process, called inverse metal-assisted chemical etching (I-MacEtch), to produce semiconductors that are more reliable and...
  • Study looks into the physics-defying quantum properties of HOIP materials

    Researchers studied the semiconducting properties of hybrid organic-inorganic perovskites (HOIP) that defy physics by producing stable quantum properties despite intense...
  • Physicists discover new quantum electronic material, kagome metal

    Scientists have for the first time produced a kagome metal, which is an electrically-conducting crystal made of layers of iron and tin atoms.
  • Scientists creating smaller nanoparticles have overcome thermal quenching

    Researchers believe that they have found a way around the fundamental physical restraint of thermal quenching, which has dimmed the brightness of ultra-small nanoparticles.
  • Advances made in production of nanoparticles using plasma-based synthesis

    Scientists developed diagnostic tools to improve the production of nanomaterials with specific characteristics through plasma-based synthesis.
  • Researchers create molecules in never-before-seen, complex structures

    Physicists worked on a two-year project to create Rydberg polarons from strontium atoms that were one million times colder than deep space.
  • Gaps between layers of 2-D materials used to separate atoms at room temp

    Researchers discovered that there are naturally-occurring gaps between the layers of 2-D materials can be used as subatomic sieves to separate atoms and demonstrated this...
  • Research reveals details about heat carriers in amorphous polymers

    Researchers detail their work on amorphous polymer chains to gain a greater understanding for how heat carriers move in the polymers and its effect on thermal conductivity.

ATS offers Portable Anemometer for measuring airflow velocity

The ATS-0345-1 from Advanced Thermal Solutions, Inc. (ATS) is a portable vane anemometer for measuring air flow speed and volumetric flow rate. details>>

Future Facilities launches neutral file format for thermal simulation models

Future Facilities, provider of leading thermal simulation tool, 6SigmaET, has announced the availability of a new neutral file format that will help solve the challenge of sharing design models between different thermal simulation toolsets. details>>

TT Electronics introduces lightest, most effective PCB mounted heatsink for power resistors

TT Electronics, a global provider of engineered electronics for performance critical applications, has announced the WMHP-HS heat sink specifically designed to optimize the thermal performance of its WMHP series power resistors. details>>

Cavium Expands Industry Partnerships to Drive OCP NIC 3.0

Cavium, Inc. announced that it is collaborating with Hewlett Packard Enterprise (HPE), to bring hyperscale-inspired designs based on Open Compute Project into mainstream enterprise IT. details>>

Microsemi Announces Adaptec Smart Storage Compatibility with AMD EPYC Processor

Microsemi Corporation announced interoperability between its 12 gigabits per second (Gbps) SAS/SATA host bus adapters (HBAs) and redundant array of independent disk (RAID) adapters. details>>

Larson Electronics LLC Releases 100W Portable Explosion Proof LED

Industrial lighting leader, Larson Electronics LLC, announced the release of a 100-watt explosion proof LED lamp, mounted on a portable non-sparking triangle aluminum base. details>>

ERS Electronic Announces AirCool PRIME Thermal Chuck Tech Will Soon Be Available

ERS Electronic, the leader in the market of thermal test solutions for semiconductor, is announcing that its AirCool PRIME thermal chucks will soon be available in 200mm format. details>>

NEO Tech Releases New LTCC and AlN Design Guidelines

NEO Tech announces that it recently produced and published new and expanded guidelines for the manufacture of Low-Temperature Co-Fired Ceramic (LTCC) and Aluminum Nitride (AlN) packaging solutions. details>>

Qorvo Introduces Most Powerful GaN-on-SiC Transistor

Qorvo, a leading provider of innovative RF solutions that connect the world, introduced the highest power gallium nitride on silicon carbide (GaN-on-SiC) RF transistor. details>>

Axcelis Announces New Purion H Order from Leading Advanced Logic Chip Maker

Axcelis Technologies, Inc., a leading supplier of innovative, high-productivity solutions for the semiconductor industry, announced that it has penetrated a new customer with the Purion H high current system with an order from a leading advanced logic chip manufacturer. details>>

Advanced Thermal Solutions, Inc. unveils new Heat Exchanger Selection Tool

To make the selection process easier for engineers, ATS has recently unveiled a new Heat Exchanger Selection Tool that will point engineers to the exact option that will meet the inputted criteria. details>>

Altair Expands Thermal Capabilities and Acquires TES International Software

Altair, developer of the popular HyperWorks computer-aided engineering software suite, has acquired Michigan-based TES International technology, intellectual property, and other assets. details>>

Shin-Etsu Silicones Launches CLG Series Gap Fillers with Improved Resistance

Shin-Etsu Silicones of America, Inc. recently premiered its CLG Series single-component, pre-cured Gap Filler product line. details>>

650 V Silicon Carbide FETs Offer Simple Silicon Substitution to Cut Losses in Power Systems

UnitedSiC, a manufacturer of silicon carbide (SiC) power semiconductors, has announced the UJ3C series of 650 V SiC FETs as drop-in replacements for silicon Superjunction MOSFETs. details>>

Oclaro Enables Deployment of Fully Tunable DWDM Technology Over I-Temp Range

Oclaro, Inc., a leading provider and innovator of optical communications solutions, today announced production shipments of the first fully-tunable SFP+ industrial temperature range (TSFP+ I-temp) transceiver. details>>

Cyclone Power Technologies Files for Patents for Thermal Storage and Thermal Storage Medium

Cyclone Power Technologies has filed for patents for the Cyclone Thermal Storage Unit and the Cyclone Thermal Medium. details>>

Boyd Corp Completes Acquisition of Action Fabricators

Boyd Corporation, a global leader in thermal management and environmental sealing solutions, announced the acquisition of Action Fabricators. details>>

KEMET Introduces KC-LINK Capacitors for Fast-Switching Wide Bandgap Applications

KEMET Corporation, a leading global supplier of electronic components, launched KC-LINK surface mount capacitors at APEC 2018 in San Antonio. details>>

Bel Power Solutions Announces Next-generation Regulated Bus Converter

Bel Power Solutions and Protection has revealed its new regulated bus converted, 0RQB-X3S11BG. details>>

Modine Completes Construction on New Facility in Hungary

Modine Manufacturing Company, a diversified global leader in thermal management technology and solutions, recently completed construction of a new, 92,000 square-foot production facility in Hungary. details>>

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