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  • Researchers make breakthrough in building high-quality, high-volume, and low-cost nanochips

    A team of researchers led by engineers from the New York University (NYU) Tandon School of Engineering (Brooklyn, N.Y.) demonstrated that thermal scanning probe lithography...
  • Faster, smaller, and more energy-efficient modulator could be breakthrough for 5G communications

    Researchers from the City University of Hong Kong (CityU), Harvard University (Cambridge, Mass.), and Nokia Bell Labs developed a tiny on-chip lithium niobate modulator that...
  • Researchers develop greater understanding of electrical conductivity in organic semiconductors

    Researchers from the Dresden (Germany) Integrated Center for Applied Physics and Photonic Materials (IAPP) and the Center for Advancing Electronics Dresden (cfaed) at TU...
  • Tweaking component ratios creates electrically-different layers for transparent transistors

    Researchers at the King Abdullah University of Science and Technology (KAUST) in Thuwal, Saudi Arabia created transparent thin-film transistors from a single hafnium-zinc...
  • New fabrication technique for 2-D crystalline materials could boost next-gen flexible electronics

    Researchers from the University of Exeter (U.K.) created a new technique for creating van der Waals heterostructures with high-K dielectrics from two-dimensional materials,...
  • New computational algorithm seeks to reduce electromagnetic noise in electronic circuits

    Researchers at Osaka University (Japan) developed a new computational algorithm that uses electromagnetic (EM) studies and circuit theory to calculate electromagnetic noise...
  • Researchers create new map to determine materials with negative thermal expansion

    Researchers at Cornell University (Ithaca, N.Y.) studied the perovskite lead titanate (PbTiO3) and determined that the commonly-held rules for understanding materials with...
  • Scientists theorize that clever timing for computers can reduce heat below Landauer limit

    In the 1960s, Rolf Landauer described a theoretical lower limit for the amount of energy required to erase one bit of information (from the 1 state to the 0 state), but...
  • Scientists create first on-chip optical link to connect two parts of electronics chip

    Scientists at the University of Twente (Netherlands) have created the first on-chip optical link to connect two parts of an electronics chip through a novel optocoupler...

ATS continues monthly series with webinar on heat sink design and selection

Advanced Thermal Solutions, Inc. (ATS) is pleased to announce the next topic in its series of monthly, online webinars covering different aspects of the thermal management of electronics will be Air Cooling: Heat Sink Design and Selection. details>>

NetRack presents Ultra Rigid NRSe Data Center racks for Enhanced Thermal Management

NetRack, a leading solution provider for data centers and end-to-end IT server racks, registered its participation at BICSI - Ranchi, highlighted by its NRSe series racks for high density application in data centers and server room to achieve augmented cooling. details>>

L-com Debuts LC Couplers with Internal Dustproof Shutter

L-com, a preferred manufacturer of wired and wireless connectivity products, announced that it has launched a new line of LC internal shutter couplers that are ideal for high-speed networking environments where cleanliness is a requirement for performance. details>>

Noctua introduces new thermal compounds and cleaning wipes

Noctua introduced NT-H2, the further improved second generation of its award-winning hybrid thermal compound. details>>

Swiftech announces new generation Boreas liquid cooling kits

Swiftech announced the release of their new generation Boreas liquid cooling kits. details>>

Pasternack Launches Expanded Line of Millimeter-Wave Removable End Launch PCB Connectors

Pasternack, a leading provider of RF, microwave and millimeter wave products, has launched a new extended series of mmWave, removable, edge launch, PCB connectors that are ideal for SERDES applications like high-speed networking, cloud servers and supercomputing. details>>

Asetek Delivers Liquid Cooler to Support High Wattage Processors for Extreme Workstations

Asetek, the creator of the all-in-one liquid cooler and the global leader in liquid cooling solutions for gaming PCs and DIY enthusiasts, announced the availability of its highest performance all-in-one (AIO) liquid cooler to date, designed in collaboration with Intel. details>>

Western Digital Accelerates the PC Gaming Experience with WD Black SN750 NVMe SSD

Western Digital Corp. introduced its second-generation, high-performance WD Black SN750 NVMe SSD with up to 2 TB capacity on a single-sided M.2 form factor and will be showcasing a version for desktop systems or custom-built gaming rigs, which has an integrated heatsink that helps maintain speed and temperature. details>>

Andrew Alliance and Waters Corporation Partner to Provide Tailored Tools for LC-MS Research

Andrew Alliance S.A. and Waters Corporation announced a new strategic partnership agreement to improve laboratory operations in the field of liquid chromatography and mass spectrometry (LC-MS). details>>

Epner Technology Produces NIST New Gold Standard

The National Institute of Standards and Technology (NIST) has selected Laser Gold as the new gold standard for infrared reflectivity. details>>

ACT Acquires Parker Hannifin Precision Cooling Business

Advanced Cooling Technologies, Inc. (ACT), a premier thermal management solutions company, announced that it has completed the acquisition of Parker Hannifin Corporation?s Precision Cooling Business (PCB), a leading supplier of Pumped Two Phase Cooling products for power electronics applications. details>>

ATS and Master Electronics Announce New Distribution Partnership

Advanced Thermal Solutions, Inc. (ATS) and Master Electronics, a leading authorized distributor of electronic components supplying top quality products for industrial, military, medical, aerospace and consumer applications, are pleased to announce a new North American distribution partnership. details>>

Pfannenberg USA Introduces Kinetic System Series Air-to-Air Heat Exchangers

Introducing a revolutionary new way to cool electrical enclosures, the Pfannenberg PKS Series Air to Air Heat Exchangers use a revolutionary next generation cooling technology (Pfannenberg Kinetic System) that out-performs conventional heat exchangers. details>>

KULR Technology Secures Patent for Thermal Runaway Shield (TRS)

KULR Technology Group, Inc. announced that the United States Patent and Trademark Office has awarded it a patent on its Thermal Runaway Shield (TRS) ? a technology designed and successfully tested to reduce the fire, explosion and other risks associated with thermal runaway in lithium-ion battery packs. details>>

Boyd Corp Acquires Specialty Air Movers for Enterprise Cooling

Boyd Corporation, a global leader in thermal management and environmental sealing solutions, announced the acquisition of the Airflow Systems business from an affiliate of Henkel Corporation as of December 21, 2018. details>>

ANSYS and Electromagnetic Crosstalk Solutions Leader Helic Sign Definitive Acquisition Agreement

ANSYS, the global leader and innovator of engineering simulation software, announced that it has entered into a definitive agreement to acquire Helic, the industry-leading provider of electromagnetic crosstalk solutions for systems on chips (SoCs). details>>

Danfoss and Nelumbo, a Surface Modification Technology start-up, enter Strategic Partnership

Nelumbo and Danfoss have established a strategic partnership to deploy Nelumbo surface modification technology platform with Danfoss Microchannel heat exchanger business. details>>

TE Connectivity to present high-speed innovations at DesignCon 2019

TE Connectivity (TE), a world leader in connectivity and sensors, will again educate and inspire system designers at DesignCon this year by demonstrating a new array of innovative solutions for next-generation compute and networking systems. details>>

Lear and Gentherm Launch Development Partnership to Accelerate Thermal Seating Solutions

Lear Corporation, a global automotive technology leader, and Gentherm, the global market leader and developer of innovative thermal management technologies, announced a strategic joint development partnership today to drive the future of passenger thermal seating solutions. details>>

Thermaltake WaterRam Unveils RGB Liquid Cooling DDR4 Memory 3200MHz 32GB/16GB

Thermaltake, the leading PC DIY premium brand for cooling, gaming gear and enthusiast memory solutions, announces the immediate release of its groundbreaking product, the Thermaltake WaterRam RGB Liquid Cooling DDR4 Memory. details>>

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