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  • Running an LED in reverse could be new solid-state cooling technology for microprocessors

    Researchers at the University of Michigan (Ann Arbor, Mich.) discovered that running a light-emitting diode (LED) with the electrodes reversed could cool a second device that...
    details>>
  • Researchers create new material for supercapacitors with more than double the energy density

    Researchers from Tohoku University in Sendai, Japan collaborated with supercapacitor manufacturer TOC Capacitor Co. to create a new material from graphene mesosponge, which...
    details>>
  • Strain engineering can be used to change the thermal properties of semiconductor materials

    Researchers from the Massachusetts Institute of Technology (MIT) in Cambridge, Mass., the Skolkovo Institute of Science and Technology (Skoltech) in Moscow, Russia, and...
    details>>
  • Researchers unlock secrets behind heat transport in black phosphorous nanoribbons

    Scientists from the Agency for Science, Technology and Research (A*STAR) Institute of Materials Research and Engineering in Singapore discovered why heat moves twice as fast...
    details>>
  • Physicists create the first electron liquid at room temperature, paving way for more study

    Scientists at the University of California, Riverside (UCR) created the first electron liquid at room temperature by bombarding a sandwich of ultrathin semiconductor...
    details>>
  • Researchers create thermoelectric device from cellulose to convert waste heat into electricity

    Researchers at the Institute of Materials Science of Barcelona, Spain (ICMAB-CSIC) created a new thermoelectric paper from cellulose and carbon nanotubes to covert waste heat...
    details>>
  • Researchers developing new eco-friendly manufacturing process for sustainable electronics

    Researchers from Simon Fraser University (SFU) in British Columbia, Canada and the Swiss Federal Laboratories for Materials Science and Technology (Empa) in Dubendorf,...
    details>>
  • Researchers combine laser-induced graphene with other materials to form composites

    Researchers from Rice University (Houston, Texas) and Ben Gurion University (Negev, Israel) continued their study of laser-induced graphene (LIG) by combining the flaky foam...
    details>>
  • Researchers make breakthrough in building high-quality, high-volume, and low-cost nanochips

    A team of researchers led by engineers from the New York University (NYU) Tandon School of Engineering (Brooklyn, N.Y.) demonstrated that thermal scanning probe lithography...
    details>>

IDT and Telink Semiconductor Announce Partnership on Integrated Sensor Platforms

Leveraging respective leadership technologies in sensors and IoT connectivity, Integrated Device Technology, Inc. (IDT) and Telink Semiconductor are announcing a partnership to create connected and integrated sensor platforms for IoT applications. details>>

New ventilated sensor enclosures from Hammond Electronics

The new 1551V miniature ventilated sensor enclosures from Hammond Electronics are designed to house sensors and small sub-systems installed in the manufacturing environment as part of IoT systems. details>>

Anomatic Acquires Injection Molding Company CP Technologies

Anomatic Corporation, a full-service manufacturer of anodized aluminum and metallized packaging solutions, has announced the acquisition of CP Technologies Company, an injection molding firm located in Columbus, Ohio. details>>

Picosun ALD Encapsulation Prevents Electronics Degradation

Picosun Group, a leading supplier of ALD (Atomic Layer Deposition) thin film coating solutions for global industries, reports unprecedented results in high reliability electronics protection with ALD. details>>

Achronix Announces Partner Program for Speedster, Speedchip, and Speedcore Ecosystem

Achronix Semiconductor Corporation announced the launch of its Partner Program for EDA tools, software, and IP vendors with solutions and services directly applicable to Achronix versatile Speedster FPGAs, Speedchip chiplet technology, and Speedcore eFPGA custom IP-block technology. details>>

ANSYS Twin Builder Empowers Organizations to Optimize Product Operations

ANSYS is enabling product developers to potentially save millions of dollars in warranty and operational costs with the latest release of ANSYS Twin Builder. details>>

Plugable Launches Tool-free USB-C NVMe SSD Enclosure

Plugable launches the 10Gb USB-C (USB 3.1 Gen 2) NVMe SSD Enclosure, the first high performance NVMe enclosure to feature a completely tool-free, spring-loaded design for inserting and removing a compatible SSD. details>>

Modine Launches High-Efficiency Motor Enhancement for Cabinet Unit Heaters

Modine Manufacturing Company, a leader in technology in the HVAC industry, has launched another HVAC enhancement with the addition of an Electronically Commutated (EC) Motor to its cabinet unit heater offerings. details>>

Boeing and Safran Announce New APU Joint Venture Named Initium Aerospace

Boeing and Safran announce the name of their 50-50 joint venture to design, build and service Auxiliary Power Units (APUs): Initium Aerospace. details>>

Magewell Expands Pro Convert NDI Encoder Roster with Fourth Powerful Model

Magewell has unveiled the new Pro Convert SDI Plus standalone NDI encoder, the fourth entry in its rapidly-expanding Pro Convert family of devices for bringing traditional video signals into IP-based production networks using popular NewTek NDI technology. details>>

ATS continues monthly series with webinar on heat sink design and selection

Advanced Thermal Solutions, Inc. (ATS) is pleased to announce the next topic in its series of monthly, online webinars covering different aspects of the thermal management of electronics will be Air Cooling: Heat Sink Design and Selection. details>>

NetRack presents Ultra Rigid NRSe Data Center racks for Enhanced Thermal Management

NetRack, a leading solution provider for data centers and end-to-end IT server racks, registered its participation at BICSI ? Ranchi, highlighted by its NRSe series racks for high density application in data centers and server room to achieve augmented cooling. details>>

L-com Debuts LC Couplers with Internal Dustproof Shutter

L-com, a preferred manufacturer of wired and wireless connectivity products, announced that it has launched a new line of LC internal shutter couplers that are ideal for high-speed networking environments where cleanliness is a requirement for performance. details>>

Noctua introduces new thermal compounds and cleaning wipes

Noctua introduced NT-H2, the further improved second generation of its award-winning hybrid thermal compound. details>>

Swiftech announces new generation Boreas liquid cooling kits

Swiftech announced the release of their new generation Boreas liquid cooling kits. details>>

Pasternack Launches Expanded Line of Millimeter-Wave Removable End Launch PCB Connectors

Pasternack, a leading provider of RF, microwave and millimeter wave products, has launched a new extended series of mmWave, removable, edge launch, PCB connectors that are ideal for SERDES applications like high-speed networking, cloud servers and supercomputing. details>>

Asetek Delivers Liquid Cooler to Support High Wattage Processors for Extreme Workstations

Asetek, the creator of the all-in-one liquid cooler and the global leader in liquid cooling solutions for gaming PCs and DIY enthusiasts, announced the availability of its highest performance all-in-one (AIO) liquid cooler to date, designed in collaboration with Intel. details>>

Western Digital Accelerates the PC Gaming Experience with WD Black SN750 NVMe SSD

Western Digital Corp. introduced its second-generation, high-performance WD Black SN750 NVMe SSD with up to 2 TB capacity on a single-sided M.2 form factor and will be showcasing a version for desktop systems or custom-built gaming rigs, which has an integrated heatsink that helps maintain speed and temperature. details>>

Andrew Alliance and Waters Corporation Partner to Provide Tailored Tools for LC-MS Research

Andrew Alliance S.A. and Waters Corporation announced a new strategic partnership agreement to improve laboratory operations in the field of liquid chromatography and mass spectrometry (LC-MS). details>>

Epner Technology Produces NIST New Gold Standard

The National Institute of Standards and Technology (NIST) has selected Laser Gold as the new gold standard for infrared reflectivity. details>>

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